JPWO2014188768A1 - 電子部品実装装置および電子部品の製造方法 - Google Patents
電子部品実装装置および電子部品の製造方法 Download PDFInfo
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- JPWO2014188768A1 JPWO2014188768A1 JP2015518129A JP2015518129A JPWO2014188768A1 JP WO2014188768 A1 JPWO2014188768 A1 JP WO2014188768A1 JP 2015518129 A JP2015518129 A JP 2015518129A JP 2015518129 A JP2015518129 A JP 2015518129A JP WO2014188768 A1 JPWO2014188768 A1 JP WO2014188768A1
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Abstract
Description
30分以内で実装を行わなければならないものが多い。このため、例えば、1つの半導体チップの実装に15〜20秒かかる場合には、ディスペンサによって非導電性ペースト(NCP)を基板に塗布し、基板を70℃程度まで加熱した後に連続して実装を行える半導体チップの数は100個程度(基板を70℃程度に加熱後30分以内に実装できる数)となり、一枚の基板に実装する半導体チップの数がこれ以上となる場合には、非導電性ペースト(NCP)が変質しない常温まで一旦基板を冷却した後、再度、ディスペンサによって非導電性ペースト(NCP)を基板に塗布し、再度、70℃程度まで基板を加熱した後に、再度実装することが必要となってくる。このため、ディスペンサが複数必要となったり、基板を冷却する装置が必要となったりして設備が大型化すると共に、基板の冷却に時間がかかり、全体の実装時間が長くなってしまうという問題があった。また、半導体チップの実装のみならず、LEDなど他の電子部品を基板に実装する際にも同様の問題があった。
[0009]
そこで、本発明は、簡便な装置で基板に多数の電子部品を効率的に実装することができる電子部品実装装置を提供することを目的とする。
課題を解決するための手段
[0010]
本発明の電子部品実装装置は、基板に電子部品の実装を行う電子部品実装装置であって、その表面に固定した基板を加熱する加熱領域と、その表面に固定した基板を加熱しない非加熱領域とに区分された区分実装ステージと、表面に固定した基板全体を加熱する全体加熱実装ステージと、基板の上の各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布ブロックと、を有し、基板の上の各電子部品を実装する各位置に非導電性ペーストを塗布した後、基板の区分実装ステージの加熱領域上に固定された部分のみを加熱して該部分の各位置に各電子部品を実装し、その後、全体加熱実装ステージで基板全体を加熱して残余の部分の各位置に各電子部品を実装する電子部品実装装置である。
[0011]
本発明の電子部品実装装置において、区分実装ステージは、平面状の段部を有する平板状の基体部と、その表面が基体部の表面と同一面となるよう段部に重ねあわされた断熱層と、を備え、基体部の表面と断熱層の表面とに基板を固定し、加熱領域は、基体部の表面であり、非加熱領域は、断熱層の表面であること、としても好適である。
[0012]
本発明の電子部品実装装置は、基板に電子部品の実装を行う電子部品実装装置であって、その表面に固定した基板を加熱する加熱領域と、その表面に固定した基板を加熱しない非加熱領域とに区分された第一の区分実装ステージと、加熱領域と非加熱領域の配置を第一の区分実
装ステージと反対にした第二の区分実装ステージと、基板の上の各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布ブロックと、を有し、基板の上の各電子部品を実装する各位置に非導電性ペーストを塗布した後、基板の第一の区分実装ステージの加熱領域上に固定された部分のみを加熱して該部分の各位置に各電子部品を実装し、その後、基板の第二の区分実装ステージの加熱領域上に固定された部分のみを加熱して該部分の各位置に各電子部品を実装する電子部品実装装置である。
[0013]
本発明の電子部品実装装置において、第一、第二の区分実装ステージは、平面状の段部を有する平板状の基体部と、その表面が基体部の表面と同一面となるよう段部に重ねあわされた断熱層と、を備え、基体部の表面と断熱層の表面とに基板を固定し、加熱領域は、基体部の表面であり、非加熱領域は、断熱層の表面であること、としても好適である。
[0014]
本発明の電子部品の製造方法は、その表面に固定した基板を加熱する加熱領域と、その表面に固定した基板を加熱しない非加熱領域と、に区分された第一の区分実装ステージと、加熱領域と非加熱領域の配置を第一の区分実装ステージと反対にした第二の区分実装ステージと、を有する電子部品実装装置を準備する工程と、電子部品実装装置を用いて、基板の上の各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布工程と、基板を第一の区分実装ステージに固定する第一の固定工程と、基板の第一の区分実装ステージの加熱領域上に固定された部分のみを加熱する第一の加熱工程と、基板の加熱された部分の各位置に各電子部品を実装する第一の実装工程と、基板を第二の区分実装ステージに固定する第二の固定工程と、基板の第二の区分実装ステージの加熱領域上に固定された部分のみを加熱する第二の加熱工程と、基板の加熱された部分の各位置に各電子部品を実装する第二の実装工程と、を有し、基板に複数の電子部品の実装を行う電子部品の製造方法である。
[0015]
本発明の電子部品の製造方法は、その表面に固定した基板を加熱する加熱領域と、その表面に固定した基板を加熱しない非加熱領域と、に区分された区分実装ステージと、その表面に固定した基板全体を加熱する全体加熱実装ステージと、を有する電子部品実装装置を準備する工程と、基板の上の各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布工程と、基板を区分実装ステージに固定する第一の固定工程と、基板の区分実装ステージの加熱領域上に固定された部分のみを加熱する第一の加熱工程と、基板の加熱された部分の各位置に各電子部品を実装する第一の実装工程と、基板を全体加熱実装ステージに固定する第三の固定工程と、基板全体を加熱す
Claims (10)
- 電子部品実装装置であって、
その表面に固定した基板を加熱する加熱領域と、その表面に固定した前記基板を加熱しない非加熱領域とに区分された少なくとも1つの区分実装ステージを有し、基板に電子部品の実装を行う電子部品実装装置。 - 請求項1に記載の電子部品実装装置であって、
前記区分実装ステージは、
平面状の段部を有する平板状の基体部と、その表面が前記基体部の表面と同一面となるよう前記段部に重ねあわされた断熱層と、を備え、前記基体部の表面と前記断熱層の表面とに前記基板を固定し、
前記加熱領域は、前記基体部の表面であり、
前記非加熱領域は、前記断熱層の表面であること、
を特徴とする電子部品実装装置。 - 請求項1に記載の電子部品実装装置であって、
その表面に固定した基板を加熱する加熱領域と、その表面に固定した前記基板を加熱しない非加熱領域とに区分された第一の区分実装ステージと、
前記加熱領域と前記非加熱領域の配置を前記第一の区分実装ステージと反対にした第二の区分実装ステージと、
を有することを特徴とする電子部品実装装置。 - 請求項2に記載の電子部品実装装置であって、
その表面に固定した基板を加熱する加熱領域と、その表面に固定した前記基板を加熱しない非加熱領域とに区分された第一の区分実装ステージと、
前記加熱領域と前記非加熱領域の配置を前記第一の区分実装ステージと反対にした第二の区分実装ステージと、
を有することを特徴とする電子部品実装装置。 - 請求項1に記載の電子部品実装装置であって、
更に、表面に固定した前記基板全体を加熱する少なくとも1つの全体加熱実装ステージを有すること、
を特徴とする電子部品実装装置。 - 請求項2に記載の電子部品実装装置であって、
更に、表面に固定した前記基板全体を加熱する少なくとも1つの全体加熱実装ステージを有すること、
を特徴とする電子部品実装装置。 - 請求項3に記載の電子部品実装装置であって、
更に、表面に固定した前記基板全体を加熱する少なくとも1つの全体加熱実装ステージを有すること、
を特徴とする電子部品実装装置。 - 電子部品の製造方法であって、
その表面に固定した基板を加熱する加熱領域と、その表面に固定した前記基板を加熱しない非加熱領域と、に区分された第一の区分実装ステージと、
前記加熱領域と前記非加熱領域の配置を前記第一の区分実装ステージと反対にした第二の区分実装ステージと、を有する電子部品実装装置を準備する工程と、
前記電子部品実装装置を用いて、前記基板の上の前記各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布工程と、
前記基板を第一の区分実装ステージに固定する第一の固定工程と、
前記基板の前記第一の区分実装ステージの加熱領域上に固定された部分のみを加熱する第一の加熱工程と、
前記基板の加熱された部分の前記各位置に前記各電子部品を実装する第一の実装工程と、
前記基板を第二の区分実装ステージに固定する第二の固定工程と、
前記基板の前記第二の区分実装ステージの加熱領域上に固定された部分のみを加熱する第二の加熱工程と、
前記基板の加熱された部分の前記各位置に前記各電子部品を実装する第二の実装工程と、
を有し、基板に複数の電子部品の実装を行う電子部品の製造方法。 - 電子部品の製造方法であって、
その表面に固定した前記基板を加熱する加熱領域と、その表面に固定した前記基板を加熱しない非加熱領域と、に区分された区分実装ステージと、
その表面に固定した前記基板全体を加熱する全体加熱実装ステージと、を有する電子部品実装装置を準備する工程と、
前記電子部品実装装置を用いて、前記基板の上の前記各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布工程と、
前記基板を前記区分実装ステージに固定する第一の固定工程と、
前記基板の前記区分実装ステージの前記加熱領域上に固定された部分のみを加熱する第一の加熱工程と、
前記基板の加熱された部分の前記各位置に前記各電子部品を実装する第一の実装工程と、
前記基板を全体加熱実装ステージに固定する第三の固定工程と、
前記基板全体を加熱する第三の加熱工程と、
前記第一の実装工程で前記電子部品を実装していない前記各位置に前記各電子部品を実装する第三の実装工程と、
を有し、基板に複数の電子部品の実装を行う電子部品の製造方法。 - 電子部品の製造方法であって、
その表面に固定した前記基板を加熱する加熱領域と、その表面に固定した前記基板を加熱しない非加熱領域と、に区分された区分実装ステージを有する電子部品実装装置を準備する工程と、
前記電子部品実装装置を用いて、前記基板の上の前記各電子部品を実装する各位置に非導電性ペーストを塗布するペースト塗布工程と、
前記基板を区分実装ステージに固定する第一の固定工程と、
前記基板の前記区分実装ステージの加熱領域上に固定された部分のみを加熱する第一の加熱工程と、
前記基板の加熱された部分の前記各位置に前記各電子部品を実装する第一の実装工程と、
前記基板を水平面内で180度回転させ、前記第一の実装工程で電子部品が実装されていない領域を前記区分実装ステージの加熱領域に固定する第四の固定工程と、
前記基板の前記区分実装ステージの加熱領域上に固定された部分のみを加熱する第四の加熱工程と、
前記基板の加熱された部分の前記各位置に前記各電子部品を実装する第四の実装工程と、
を有し、基板に複数の電子部品の実装を行う電子部品の製造方法。
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JP4390503B2 (ja) | 2003-08-27 | 2009-12-24 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
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KR20070074118A (ko) * | 2006-01-06 | 2007-07-12 | 삼성전자주식회사 | 표시패널 솔더링 설비 및 이를 이용한 표시패널의 솔더링방법 |
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JP4788759B2 (ja) * | 2008-11-20 | 2011-10-05 | パナソニック株式会社 | 部品実装装置 |
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JPS618937A (ja) * | 1984-06-25 | 1986-01-16 | Shinkawa Ltd | ボンダ−用加熱装置 |
JP2006324581A (ja) * | 2005-05-20 | 2006-11-30 | Athlete Fa Kk | 電子部品の接合装置 |
JP2011159847A (ja) * | 2010-02-02 | 2011-08-18 | Apic Yamada Corp | 半導体装置の接合装置及び接合方法 |
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CN104871300A (zh) | 2015-08-26 |
KR20150042842A (ko) | 2015-04-21 |
CN104871300B (zh) | 2017-11-21 |
US20170347504A1 (en) | 2017-11-30 |
WO2014188768A1 (ja) | 2014-11-27 |
TWI514489B (zh) | 2015-12-21 |
SG11201509575WA (en) | 2015-12-30 |
US9968020B2 (en) | 2018-05-08 |
KR101994667B1 (ko) | 2019-07-01 |
US10568245B2 (en) | 2020-02-18 |
TW201445652A (zh) | 2014-12-01 |
US20160081241A1 (en) | 2016-03-17 |
JP6142276B2 (ja) | 2017-06-14 |
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