JPWO2014069356A1 - 電気化学デバイス用粘着テープ - Google Patents
電気化学デバイス用粘着テープ Download PDFInfo
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- JPWO2014069356A1 JPWO2014069356A1 JP2014544473A JP2014544473A JPWO2014069356A1 JP WO2014069356 A1 JPWO2014069356 A1 JP WO2014069356A1 JP 2014544473 A JP2014544473 A JP 2014544473A JP 2014544473 A JP2014544473 A JP 2014544473A JP WO2014069356 A1 JPWO2014069356 A1 JP WO2014069356A1
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- adhesive tape
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- sensitive adhesive
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- BFZPBUKRYWOWDV-UHFFFAOYSA-N lithium;oxido(oxo)cobalt Chemical compound [Li+].[O-][Co]=O BFZPBUKRYWOWDV-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- FLTJDUOFAQWHDF-UHFFFAOYSA-N trimethyl pentane Natural products CCCCC(C)(C)C FLTJDUOFAQWHDF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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Abstract
Description
本発明の他の目的は、活物質の脱落防止等の目的で電気化学デバイスに使用される粘着テープであって、貼着により位置ズレが発生しないように活物質を仮固定することができ、且つ切断しても切断刃への粘着剤の付着を防止することができる電気化学デバイス用粘着テープを提供することにある。
本発明の更に他の目的は、上記電気化学デバイス用粘着テープを使用する電気化学デバイスの製造方法を提供することにある。
工程1:集電体に活物質を塗工して集電体/活物質積層体を製造する工程
工程2:集電体/活物質積層体における活物質の塗布部と未塗布部の境界部分に、前記電気化学デバイス用粘着テープを40℃以上、150℃未満の温度で圧着する工程
工程3:電気化学デバイス用粘着テープが圧着された集電体/活物質積層体を切断及び/又は打ち抜き加工する工程
本発明の粘着剤層は、アクリル系ポリマーをベースポリマーとして含有する粘着剤(=アクリル系粘着剤)からなる。
(DSCを用いたTgの測定方法)
示差走査熱量計:TA Instruments製 Q200
測定速度:10℃/min
雰囲気ガス:N2(50mL/min)
試料重量:3〜4mg
尚、上記ホモポリマーの作製は下記の通り行った。
Tgが不明なモノマー100重量部と開始剤として2,2’−アゾビスイソブチロニトリル(AIBN) 0.1部、溶媒としてトルエン 100重量部を配合し、N2置換を2時間行った。その後、60℃で6時間重合を行ってホモポリマーを得た。
ホモホリマーを、剥離処理を施したポリエステルフィルム(50μm)の剥離処理面に、乾燥後の厚みが30μmとなるように塗布、乾燥して、ホモポリマーの固形分の試料を作製した。
基材としては、例えば、繊維系基材、紙系基材、プラスチック系基材、ゴム系基材、発泡体、及びこれらの積層体等を用いることができる。上記プラスチック系基材の素材としては、例えば、ポリエステル(ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンテレフタレート、ポリブチレンナフタレートなど)、ポリオレフィン(ポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体など)、ポリビニルアルコール、ポリ塩化ビニリデン、ポリ塩化ビニル、塩化ビニル−酢酸ビニル共重合体、ポリ酢酸ビニル、ポリアミド、ポリイミド、セルロース類、フッ素系樹脂、ポリエーテル、ポリエーテルアミド、ポリフェニレンサルファイド、ポリスチレン系樹脂(ポリスチレンなど)、ポリカーボネート、ポリエーテルスルホン等を挙げることができる。
本発明の電気化学デバイス用粘着テープは、上記基材の少なくとも一方の面に上記粘着剤層を有する。本発明の電気化学デバイス用粘着テープは、公知慣用の方法により形成することができ、例えば、上記粘着剤層を構成する粘着剤を必要に応じて溶媒(例えば、トルエン、キシレン、酢酸エチル、メチルエチルケトン等)を使用して希釈してコーティング液を調製し、これを直接基材上に塗布して粘着剤層を形成する方法や、適当なセパレータ(剥離紙など)上に前記コーティング液を塗布して粘着剤層を形成し、これを基材上に転写(移着)する方法等を挙げることができる。転写による場合は、基材との界面にボイド(空隙)が残る場合がある。この場合、オートクレーブ処理等により加温加圧処理を施し、ボイドを拡散させて消滅させることができる。
<測定条件>
温度:25℃
プローブ材質:SUS
プローブ形状:円柱状(5mmφ)
加圧(圧縮)速度:30mm/min
測定(離脱)速度:30mm/min
プリロード:100gf
加圧(圧縮)時間:1秒
本発明の電気化学デバイスの製造方法は、下記工程を含むことを特徴とする(図3参照)。
工程1:集電体に活物質を塗工して集電体/活物質積層体を製造する工程
工程2:集電体/活物質積層体における活物質の塗布部と未塗布部の境界部分に、前記電気化学デバイス用粘着テープを40℃以上、150℃未満の温度で圧着する工程
工程3:電気化学デバイス用粘着テープが圧着された集電体/活物質積層体を切断及び/又は打ち抜き加工する工程
アクリル酸ブチル(BA)/メチルメタクリレート(MMA)/アクリル酸(AA)(81.3重量部/6.5重量部/12.2重量部)、開始剤として2,2’−アゾビスイソブチロニトリル(AIBN)0.1部、溶媒としてトルエン100重量部を配合し、N2置換を2時間行った。その後、60℃で6時間重合を行って、酸価94KOHmg/gのアクリル系共重合体(1)100重量部に、イソシアネート系架橋剤(商品名「コロネートL」、日本ポリウレタン(株)製)を1重量部添加し、トルエンで希釈してコーティング液(1)を得た。
得られたコーティング液(1)を、厚さ20μmのポリプロピレンフィルム(OPP)(商品名「トレファンBO2548」、東レ(株)製)上に、乾燥後の厚みが10μmとなるように塗布、乾燥して、粘着テープ(1)を得た。
アクリル酸ブチル(BA)/酢酸ビニル(VAc)/アクリル酸(AA)(79.3重量部/4.8重量部/15.9重量部)、開始剤として2,2’−アゾビスイソブチロニトリル(AIBN)0.1部、溶媒としてトルエン100重量部を配合し、N2置換を2時間行った。その後、60℃で6時間重合を行って、酸価124KOHmg/gのアクリル系共重合体(2)を作製した。
アクリル系共重合体(1)に代えてアクリル系共重合体(2)を使用した以外は実施例1と同様にして粘着テープ(2)を得た。
アクリル酸エチル(EA)/アクリル酸2−エチルヘキシル(2−EHA)/N−フェニルマレイミド(PMI)/アクリル酸2−ヒドロキシエチル(HEA)(26.3重量部/61.4重量部/8.8重要部/3.5重量部)、開始剤として2,2’−アゾビスイソブチロニトリル(AIBN)0.1部、溶媒としてトルエン100重量部を配合し、N2置換を2時間行った。その後、60℃で6時間重合を行って、アクリル系共重合体(3)作製した。
アクリル系共重合体(1)に代えてアクリル系共重合体(3)を使用した以外は実施例1と同様にして粘着テープ(3)を得た。
アクリル酸2−エチルヘキシル(2−EHA)/アクリル酸(AA)(95.2重量部/4.8重量部)、開始剤として2,2’−アゾビスイソブチロニトリル(AIBN)0.1部、溶媒としてトルエン100重量部を配合し、N2置換を2時間行った。その後、60℃で6時間重合を行って、酸価37KOHmg/gのアクリル系共重合体(4)を作製しした。
アクリル系共重合体(1)に代えてアクリル系共重合体(4)を使用した以外は実施例1と同様にして粘着テープ(4)を得た。
実施例及び比較例で得られた粘着テープをガラス板上に固定(基材面に両面粘着テープを貼着して固定)し、タッキング試験機((株)レスカ製)を使用して、下記条件でプローブを粘着テープに押しつけ、引き離す過程での粘着力(N)を測定した。
測定条件
温度:25℃
プローブ材質:SUS
プローブ形状:円柱状(5mmφ)
加圧(圧縮)速度:30mm/min
測定(離脱)速度:30mm/min
プリロード:100gf
加圧(圧縮)時間:1秒
SUS304BA板にヒートプレス機(商品名「TP−701−B ヒートシールテスター上下温調TYPE」、テスター産業(株)製)使用して、下記条件下にて実施例及び比較例で得られた粘着テープ(幅10mm、長さ100mm)の圧着を行い、25℃にて30分以上放置したあと、180°引き剥がし粘着力(25℃、N/10mm)を測定した。
圧着条件
温度:25℃、80℃
圧力:0.4MPa
圧縮時間:1秒
アルミホイル(商品名「ニッパクホイル」、日本製箔(株)製)に実施例及び比較例で得られた粘着テープ(幅15mmの短冊状)を下記条件下にて圧着し、粘着テープの基材側から切断刃(商品名「NT Spare Blade DISPENSER A」、エヌティ(株)製)を使用し、10mm間隔で100回切断して切断刃への粘着剤付着を目視により確認し、下記基準により付着性を評価した。
圧着条件
温度:80℃
圧力:0.4MPa
圧縮時間:1秒
評価基準
◎:200回の切断において、切断刃への粘着剤付着無し
○:100回以上、200回未満の切断において、切断刃への粘着剤付着無し
×:100回の切断で、切断刃へ粘着剤が付着
2、21、22 粘着剤層
3、31、32 電気化学デバイス用粘着テープ
4 集電体
5 活物質
6 切断部
7 電極
Claims (6)
- 電気化学デバイス製造に使用する粘着テープであって、基材の少なくとも一方の面にアクリル系ポリマーをベースポリマーとして含有する粘着剤層を有し、40℃以上、150℃未満の温度で圧着後の180°引き剥がし粘着力(対SUS304BA板、剥離温度:25℃、剥離速度:300mm/分)が、25℃で圧着後の180°引き剥がし粘着力(対SUS304BA板、剥離温度:25℃、剥離速度:300mm/分)の2倍以上であることを特徴とする電気化学デバイス用粘着テープ。
- アクリル系ポリマーを構成するモノマー成分全量(100重量%)における、ホモポリマーのガラス転移温度が10℃以上であるモノマー(2種以上含有する場合はその総量)の割合が5重量%以上である請求項1に記載の電気化学デバイス用粘着テープ。
- アクリル系ポリマーを構成するモノマー成分全量(100重量%)における、ホモポリマーのガラス転移温度が10℃未満であるモノマー(2種以上含有する場合はその総量)の割合が65〜94重量%である請求項1又は2に記載の電気化学デバイス用粘着テープ。
- アクリル系ポリマーを構成するモノマー成分全量(100重量%)における、カルボキシル基含有モノマー(2種以上含有する場合はその総量)の割合が2重量%以上である請求項1〜3の何れか1項に記載の電気化学デバイス用粘着テープ。
- 下記工程を含む電気化学デバイスの製造方法。
工程1:集電体に活物質を塗工して集電体/活物質積層体を製造する工程
工程2:集電体/活物質積層体における活物質の塗布部と未塗布部の境界部分に、請求項1〜4の何れか1項に記載の電気化学デバイス用粘着テープを40℃以上、150℃未満の温度で圧着する工程
工程3:電気化学デバイス用粘着テープが圧着された集電体/活物質積層体を切断及び/又は打ち抜き加工する工程 - 請求項5に記載の電気化学デバイスの製造方法により得られる電気化学デバイス。
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PCT/JP2013/078940 WO2014069356A1 (ja) | 2012-11-05 | 2013-10-25 | 電気化学デバイス用粘着テープ |
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JP (1) | JP5976833B2 (ja) |
KR (1) | KR101602611B1 (ja) |
CN (1) | CN104755575B (ja) |
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CN104812864B (zh) * | 2013-06-19 | 2017-07-28 | 株式会社Lg化学 | 压敏粘合剂组合物 |
JP2016125026A (ja) * | 2015-01-07 | 2016-07-11 | 日東電工株式会社 | 粘着テープ |
JP6776442B2 (ja) * | 2017-03-29 | 2020-10-28 | 三井化学株式会社 | 電池用積層体 |
DE102017206083A1 (de) * | 2017-04-10 | 2018-10-11 | Tesa Se | Verklebung in elektrochemischen Zellen und Stapeln von elektrochemischen Zellen |
US11279857B2 (en) | 2017-05-23 | 2022-03-22 | Teraoka Seisakusho Co., Ltd. | Adhesive tape |
KR102261800B1 (ko) | 2017-11-20 | 2021-06-04 | 주식회사 엘지화학 | 비정형 전극의 제조 방법 |
KR102294860B1 (ko) * | 2018-01-19 | 2021-08-30 | 주식회사 엘지에너지솔루션 | 전극 제조방법 |
CN112500810B (zh) * | 2020-12-01 | 2022-09-02 | 东莞新能源科技有限公司 | 胶纸及应用所述胶纸的锂离子电池极片的制备方法 |
CN112608690B (zh) * | 2020-12-01 | 2022-05-20 | 东莞新能源科技有限公司 | 胶纸及应用所述胶纸的锂离子电池极片的制备方法 |
CN112500809B (zh) * | 2020-12-01 | 2022-03-18 | 东莞新能源科技有限公司 | 胶纸及应用所述胶纸的锂离子电池极片的制备方法 |
WO2022196616A1 (ja) * | 2021-03-19 | 2022-09-22 | 株式会社村田製作所 | 電極およびその製造方法、ならびに電池 |
JP7213942B1 (ja) | 2021-12-06 | 2023-01-27 | ニチバン株式会社 | コンデンサ素子 |
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US6485826B1 (en) * | 1997-04-08 | 2002-11-26 | Lintec Corporation | Adhesive sheet |
EP1088871B1 (en) * | 1999-03-18 | 2005-04-20 | Sekisui Chemical Co., Ltd. | Pressure-sensitive adhesive tape or sheet and process for producing the same |
JP2002042881A (ja) * | 2000-07-27 | 2002-02-08 | Sony Corp | テープ貼着装置及びテープ貼着方法 |
JP4780843B2 (ja) * | 2001-03-01 | 2011-09-28 | 日東電工株式会社 | リチウム二次電池用アクリル系接着剤又は粘着剤 |
JP3754420B2 (ja) * | 2003-02-04 | 2006-03-15 | 三洋電機株式会社 | 二次電池用電極板及びその製造方法並びにこの電極板を用いた二次電池 |
WO2004099334A1 (ja) * | 2003-05-07 | 2004-11-18 | Soken Chemical & Engineering Co., Ltd. | 光学部材用粘着剤および積層体 |
JP2005056658A (ja) * | 2003-08-04 | 2005-03-03 | Nitto Denko Corp | リチウムイオン電池素子巻止用粘着テープ又はシート |
US20060188714A1 (en) * | 2005-02-24 | 2006-08-24 | Lintec Corporation | Adhesive sheet |
US20080222935A1 (en) * | 2007-03-16 | 2008-09-18 | Christiansen Ned F | Three-Piece Grip Safety |
JP5363836B2 (ja) * | 2009-03-02 | 2013-12-11 | 日東電工株式会社 | 電池用粘着テープ、及びこの電池用粘着テープを用いた電池 |
JP5443917B2 (ja) * | 2009-09-18 | 2014-03-19 | 日東電工株式会社 | 絶縁テープ |
JP4738552B1 (ja) * | 2009-12-25 | 2011-08-03 | オー・エム・シー株式会社 | 電気化学素子用の絶縁テープの自動供給装置 |
JP2012067291A (ja) * | 2010-08-27 | 2012-04-05 | Nitto Denko Corp | 非水系電池用粘着テープ |
EP2620483B1 (en) * | 2010-09-22 | 2016-02-10 | Zeon Corporation | Adhesive film for organic electrolyte accumulator devices |
KR101781645B1 (ko) * | 2011-04-20 | 2017-09-25 | 닛토덴코 가부시키가이샤 | 전기 화학 디바이스용 점착 테이프 |
KR20120119955A (ko) * | 2011-04-20 | 2012-11-01 | 닛토덴코 가부시키가이샤 | 전기 화학 디바이스용 점착 테이프 |
CN102250562A (zh) * | 2011-05-31 | 2011-11-23 | 东莞市苏粤电子包装材料有限公司 | 终止胶带及其制作方法 |
CN202256521U (zh) * | 2011-09-05 | 2012-05-30 | 瞿纯昊 | S参数测量装置 |
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TW201430093A (zh) | 2014-08-01 |
WO2014069356A1 (ja) | 2014-05-08 |
CN104755575A (zh) | 2015-07-01 |
KR20150043510A (ko) | 2015-04-22 |
US20150291859A1 (en) | 2015-10-15 |
CN104755575B (zh) | 2018-02-09 |
KR101602611B1 (ko) | 2016-03-10 |
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