JPWO2013150920A1 - 半導体デバイスの製造方法及び基板処理システム - Google Patents
半導体デバイスの製造方法及び基板処理システム Download PDFInfo
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- JPWO2013150920A1 JPWO2013150920A1 JP2014509113A JP2014509113A JPWO2013150920A1 JP WO2013150920 A1 JPWO2013150920 A1 JP WO2013150920A1 JP 2014509113 A JP2014509113 A JP 2014509113A JP 2014509113 A JP2014509113 A JP 2014509113A JP WO2013150920 A1 JPWO2013150920 A1 JP WO2013150920A1
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- 229910000449 hafnium oxide Inorganic materials 0.000 claims abstract description 11
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims abstract description 11
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- 229910002367 SrTiO Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
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- 150000004703 alkoxides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
Description
ソース・ドレイン及びチャネルが形成された被処理体上に酸化ハフニウム及び酸化ジルコニウムを含むゲート絶縁膜を成膜する工程と、
前記絶縁膜を600℃以下の温度で結晶化熱処理する工程と、
を含み、
前記結晶化熱処理後の前記絶縁膜の比誘電率が27以上である、
半導体デバイスの製造方法が提供される。
3 プラズマ処理装置
4 結晶化処理装置
6、7 ロードロック室
20 制御部
22 記憶部
200 基板処理システム
G ゲートバルブ
W 半導体ウエハ
図1に、本発明の実施形態に係る半導体デバイスの効果を説明するための一例となる図であって、混合絶縁膜の熱処理温度と比誘電率との関係を説明するための概略図を示す。図1の横軸は、絶縁膜の熱処理温度を示し、縦軸は絶縁膜の比誘電率を示す。
第1の実施形態では、ZrO2及びHfO2の混合膜である酸化ジルコニウムハフニウム(HfZrOx)膜について説明した。第2の実施形態では、ZrO2及びHfO2を積層した積層膜について説明する。
本発明の実施形態に係る絶縁膜を、HfO2の結晶化温度(約600℃)以上の温度で熱処理する場合、特に、HfO2の層は、比較的比誘電率が高いCubic相よりも、比較的比誘電率が低いMonoclinic相が、熱力学的に析出しやすい。そのため、ZrO2のCubic相とHfO2のMonoclinic相とが競合しながら結晶化が進行し、得られる絶縁膜の比誘電率が低下することがある。
次に、本実施形態の絶縁膜が、より高い比誘電率を有すると共に、リーク電流特性に優れることを確認した実施形態について説明する。
本発明の実施形態に係る、半導体デバイスの製造方法を説明する。なお、ここでは、被処理体としてシリコンウエハを使用してゲート絶縁膜を成膜する場合について述べるが、本発明はこの点において限定されない。
次に、本実施形態の半導体デバイスの製造方法を実施するための、基板処理システムについて、図12を参照して説明する。
なお、本実施形態では、2つの成膜装置を用いているが、1つの成膜装置において、HfO2とZrO2の添加、混合、積層膜を形成しても良い。
次に、成膜装置1、2の構成について、図13を参照しながら説明する。
図13に、本発明の実施形態に係る成膜装置1(又は2)の構成例を示す概略図を示す。なお、成膜装置1(及び2)による本実施形態の絶縁膜の好ましい成膜方法として、ALD又はCVDにより成膜する場合の、成膜装置の例について、説明するが、図示しないPVDにより成膜する構成であっても良い。
次に、プラズマ窒化処理を実施するための、プラズマ処理装置3について、図14を参照しながら説明する。図14に、本発明の実施の形態に係るプラズマ処理装置3の構成例を示す概略図を示す。
次に、結晶化熱処理を実施するための、結晶化処理装置4について、図15を参照しながら説明する。図15に、本発明の実施の形態に係る結晶化処理装置4の構成例を示す概略図を示す。
されるようになっている。
Claims (6)
- ソース・ドレイン及びチャネルが形成された被処理体上に酸化ハフニウム及び酸化ジルコニウムを含むゲート絶縁膜を成膜する工程と、
前記絶縁膜を600℃以下の温度で結晶化熱処理する工程と、
を含み、
前記結晶化熱処理後の前記絶縁膜の比誘電率が27以上である、
半導体デバイスの製造方法。 - 前記絶縁膜中の前記酸化ハフニウムの含有量は、5モル%〜50モル%である、請求項1に記載の半導体デバイスの製造方法。
- 前記絶縁膜を成膜する工程は、前記酸化ハフニウム及び前記酸化ジルコニウムの積層膜を成膜する工程を含む、請求項1に記載の半導体デバイスの製造方法。
- 前記積層膜を成膜する工程は、
前記被処理体上に、前記酸化ハフニウムを成膜する第1の成膜工程と、
前記酸化ハフニウム上に前記酸化ジルコニウムを成膜する第2の成膜工程と、
を含み、
前記第1の成膜工程と前記第2の成膜工程との間に、成膜された前記酸化ハフニウムを、プラズマ窒化処理する工程を含む、
請求項3に記載の半導体デバイスの製造方法。 - 前記絶縁膜を成膜する工程は、酸化ジルコニウムハフニウムを成膜する工程を含む、請求項1に記載の半導体デバイスの製造方法。
- ソース・ドレイン及びチャネルが形成された被処理体上に酸化ハフニウム及び酸化ジルコニウムを含むゲート絶縁膜を成膜する成膜装置と、
前記被処理体を結晶化熱処理する結晶化熱処理装置と、
前記成膜装置と前記結晶化熱処理装置とを制御する制御部と、
を含む、基板処理システムであって、
前記制御部は、前記結晶化熱処理を600℃以下の温度で行うように前記結晶化熱処理装置を制御し、かつ、前記絶縁膜中の前記酸化ハフニウムの含有量が5モル%〜50モル%となるように前記成膜装置を制御する、
基板処理システム。
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