JPWO2011111784A1 - 接着材リール - Google Patents

接着材リール Download PDF

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Publication number
JPWO2011111784A1
JPWO2011111784A1 JP2011513812A JP2011513812A JPWO2011111784A1 JP WO2011111784 A1 JPWO2011111784 A1 JP WO2011111784A1 JP 2011513812 A JP2011513812 A JP 2011513812A JP 2011513812 A JP2011513812 A JP 2011513812A JP WO2011111784 A1 JPWO2011111784 A1 JP WO2011111784A1
Authority
JP
Japan
Prior art keywords
adhesive
adhesive layer
mass
tape
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011513812A
Other languages
English (en)
Japanese (ja)
Inventor
松田　和也
和也 松田
貴志 関
貴志 関
藤縄　貢
貢 藤縄
忠恭 藤枝
忠恭 藤枝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2011111784A1 publication Critical patent/JPWO2011111784A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
JP2011513812A 2010-03-12 2011-03-10 接着材リール Pending JPWO2011111784A1 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010056270 2010-03-12
JP2010056270 2010-03-12
JP2010086330 2010-04-02
JP2010086330 2010-04-02
PCT/JP2011/055671 WO2011111784A1 (ja) 2010-03-12 2011-03-10 接着材リール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013210199A Division JP2014037544A (ja) 2010-03-12 2013-10-07 接着材リール

Publications (1)

Publication Number Publication Date
JPWO2011111784A1 true JPWO2011111784A1 (ja) 2013-06-27

Family

ID=44563582

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2011513812A Pending JPWO2011111784A1 (ja) 2010-03-12 2011-03-10 接着材リール
JP2013210199A Pending JP2014037544A (ja) 2010-03-12 2013-10-07 接着材リール
JP2014251690A Active JP5928567B2 (ja) 2010-03-12 2014-12-12 接着材リール

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013210199A Pending JP2014037544A (ja) 2010-03-12 2013-10-07 接着材リール
JP2014251690A Active JP5928567B2 (ja) 2010-03-12 2014-12-12 接着材リール

Country Status (5)

Country Link
JP (3) JPWO2011111784A1 (enrdf_load_stackoverflow)
KR (2) KR20120113803A (enrdf_load_stackoverflow)
CN (2) CN104403589B (enrdf_load_stackoverflow)
TW (1) TWI435841B (enrdf_load_stackoverflow)
WO (1) WO2011111784A1 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046896B2 (ja) * 2012-01-30 2016-12-21 デクセリアルズ株式会社 フィルム巻装体、及びフィルム巻装体の製造方法
JP5997306B2 (ja) * 2015-02-18 2016-09-28 株式会社ホンマ コーナー部用粘着テープ
KR102615097B1 (ko) * 2015-11-25 2023-12-18 가부시끼가이샤 레조낙 회로 접속용 접착제 조성물 및 구조체
DE102016200810A1 (de) * 2016-01-21 2017-07-27 Tesa Se Abroller, Verwendung eines Abrollers, Klebeband zur Verklebung von Bauteilen und Verklebung von zwei Bauteilen
KR102786355B1 (ko) * 2016-01-29 2025-03-24 가부시끼가이샤 레조낙 접착제 필름 및 그의 제조 방법, 접착제 테이프, 및 접착제 필름용 릴
WO2019182009A1 (ja) * 2018-03-23 2019-09-26 リンテック株式会社 ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法
JP2020073404A (ja) * 2019-09-30 2020-05-14 日立化成株式会社 異方導電フィルム用リール及び異方導電フィルム巻
JP7446095B2 (ja) * 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749504A (ja) * 1993-08-06 1995-02-21 Hitachi Electron Eng Co Ltd 異方性導電テープのカット目検出装置
JPH09199543A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd チップの実装装置
JPH1051115A (ja) * 1996-07-29 1998-02-20 Sony Corp 異方性導電膜貼付け装置及び異方性導電膜分割方法
JPH10310743A (ja) * 1997-05-12 1998-11-24 Hitachi Chem Co Ltd 異方導電性接着テープの貼付け方法および装置
JPH1150017A (ja) * 1997-08-06 1999-02-23 Matsushita Electric Ind Co Ltd 異方性導電材の貼着装置および貼着方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP2001171033A (ja) * 1999-12-17 2001-06-26 Sony Chem Corp 多層異方性導電膜積層体
JP2002031809A (ja) * 2000-07-17 2002-01-31 Stanley Electric Co Ltd 液晶装置の製造方法
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004202738A (ja) * 2002-12-24 2004-07-22 Hitachi Chem Co Ltd 接着材テープの接続方法
JP2004211018A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
JP2004323622A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2006086245A (ja) * 2004-09-15 2006-03-30 Casio Comput Co Ltd 粘着性接着材の転写方法
JP2009004354A (ja) * 2007-05-23 2009-01-08 Hitachi Chem Co Ltd 接着材リール及びこれを用いた回路接続体の製造方法
WO2009031472A1 (ja) * 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 接着剤及びそれを用いた接続構造体
WO2009118944A1 (ja) * 2008-03-28 2009-10-01 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜転写具及び接続方法
JP2010013661A (ja) * 2004-06-09 2010-01-21 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3045427B2 (ja) * 1992-06-22 2000-05-29 ソニー株式会社 異方性導電膜の貼付け方法および装置
CN100548840C (zh) * 2002-07-30 2009-10-14 日立化成工业株式会社 粘接材料带连接体及粘接材料带的连接方法

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749504A (ja) * 1993-08-06 1995-02-21 Hitachi Electron Eng Co Ltd 異方性導電テープのカット目検出装置
JPH09199543A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd チップの実装装置
JPH1051115A (ja) * 1996-07-29 1998-02-20 Sony Corp 異方性導電膜貼付け装置及び異方性導電膜分割方法
JPH10310743A (ja) * 1997-05-12 1998-11-24 Hitachi Chem Co Ltd 異方導電性接着テープの貼付け方法および装置
JPH1150017A (ja) * 1997-08-06 1999-02-23 Matsushita Electric Ind Co Ltd 異方性導電材の貼着装置および貼着方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP2001171033A (ja) * 1999-12-17 2001-06-26 Sony Chem Corp 多層異方性導電膜積層体
JP2002031809A (ja) * 2000-07-17 2002-01-31 Stanley Electric Co Ltd 液晶装置の製造方法
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004202738A (ja) * 2002-12-24 2004-07-22 Hitachi Chem Co Ltd 接着材テープの接続方法
JP2004211018A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
JP2004323622A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2010013661A (ja) * 2004-06-09 2010-01-21 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2006086245A (ja) * 2004-09-15 2006-03-30 Casio Comput Co Ltd 粘着性接着材の転写方法
JP2009004354A (ja) * 2007-05-23 2009-01-08 Hitachi Chem Co Ltd 接着材リール及びこれを用いた回路接続体の製造方法
WO2009031472A1 (ja) * 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 接着剤及びそれを用いた接続構造体
WO2009118944A1 (ja) * 2008-03-28 2009-10-01 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜転写具及び接続方法

Also Published As

Publication number Publication date
TW201139259A (en) 2011-11-16
JP2015083691A (ja) 2015-04-30
TWI435841B (zh) 2014-05-01
KR101763458B1 (ko) 2017-07-31
JP2014037544A (ja) 2014-02-27
KR20140054438A (ko) 2014-05-08
KR20120113803A (ko) 2012-10-15
CN104403589B (zh) 2017-01-11
CN102712834B (zh) 2014-11-26
WO2011111784A1 (ja) 2011-09-15
CN104403589A (zh) 2015-03-11
CN102712834A (zh) 2012-10-03
JP5928567B2 (ja) 2016-06-01

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