JPWO2007066572A1 - 静電チャック用電極シート及び静電チャック - Google Patents
静電チャック用電極シート及び静電チャック Download PDFInfo
- Publication number
- JPWO2007066572A1 JPWO2007066572A1 JP2007549093A JP2007549093A JPWO2007066572A1 JP WO2007066572 A1 JPWO2007066572 A1 JP WO2007066572A1 JP 2007549093 A JP2007549093 A JP 2007549093A JP 2007549093 A JP2007549093 A JP 2007549093A JP WO2007066572 A1 JPWO2007066572 A1 JP WO2007066572A1
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- electrode
- electrostatic chuck
- substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Controlling Sheets Or Webs (AREA)
Abstract
Description
第二電極層5を、縦200mm×横200mm(厚さ0.4μm)の平面領域の全面が電極となる平面電極とした以外は実施例1と同様にして双極型静電チャックXを作製した。この比較例1に係る静電チャックXについて、実施例1と同様にして、シリコンウエハ(比誘電率5.4)を吸着させた場合の第一電極層3と第二電極層5との間の静電容量C1と、何も吸着させていない場合の第一電極層3と第二電極層5との間の静電容量C2を求めた。結果を表1に示す。シリコンウエハが有る場合と無い場合とにおける静電容量の変化率〔(C1−C2)/C1〕は0.024であって、既存の基板検出装置で判別した場合に誤検知する可能性があると考えられる。
Claims (7)
- 第一絶縁層、第一電極層、電極間絶縁層、第二電極層、及び第二絶縁層が順次積層された積層構造を有して第一絶縁層側に基板を吸着させる静電チャック用の電極シートであって、第一電極層が、所定の平面領域内に複数の開口部を有し、第二電極層が、第一電極層の開口部を電極シートの深さ方向に投影した位置にあって投影した開口部と略同じ面積を持つ開口対応部と、開口対応部同士を連結する連結部とを有してなることを特徴とする静電チャック用電極シート。
- 第一電極層が碁盤状に配置された開口部を有し、第二電極層が開口対応部と連結部とによって碁盤格子状に形成されている請求項1に記載の静電チャック用電極シート。
- 第一電極層が、互いに隣接する開口部の最短距離Xと、この最短距離Xに平行な直線を仮想直線としてこの仮想直線に対しこれら隣接する開口部の重心をそれぞれ投影した場合の垂線の足によって得られる線分の長さLとが、L/X≧1.5、及びL≦2.5mmの関係を満たす請求項1又は2に記載の静電チャック用電極シート。
- 第一電極層の開口部が丸孔からなり、第二電極層が円形の開口対応部を有する請求項1〜3のいずれかに記載の静電チャック用電極シート。
- 基板を吸着した状態での第一電極層と第二電極層との間の静電容量C1と、基板を吸着していない状態での第一電極と第二電極との間の静電容量C2とが、(C1−C2)/C1≧0.03の関係を満たす請求項1〜4のいずれかに記載の静電チャック用電極シート。
- 請求項1〜5のいずれかに記載の電極シートを金属基盤に貼着してなることを特徴とする静電チャック。
- 電極シートが膜厚500〜1000μmのシリコーンゴムからなる柔軟層を介して金属基盤に貼着される請求項6に記載の静電チャック。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007549093A JP4825220B2 (ja) | 2005-12-06 | 2006-11-30 | 静電チャック用電極シート及び静電チャック |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005351441 | 2005-12-06 | ||
JP2005351441 | 2005-12-06 | ||
PCT/JP2006/323970 WO2007066572A1 (ja) | 2005-12-06 | 2006-11-30 | 静電チャック用電極シート及び静電チャック |
JP2007549093A JP4825220B2 (ja) | 2005-12-06 | 2006-11-30 | 静電チャック用電極シート及び静電チャック |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007066572A1 true JPWO2007066572A1 (ja) | 2009-05-21 |
JP4825220B2 JP4825220B2 (ja) | 2011-11-30 |
Family
ID=38122718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007549093A Active JP4825220B2 (ja) | 2005-12-06 | 2006-11-30 | 静電チャック用電極シート及び静電チャック |
Country Status (8)
Country | Link |
---|---|
US (1) | US7881036B2 (ja) |
EP (1) | EP1959488A4 (ja) |
JP (1) | JP4825220B2 (ja) |
KR (1) | KR100994299B1 (ja) |
CN (1) | CN101326627B (ja) |
HK (1) | HK1124688A1 (ja) |
TW (1) | TW200735258A (ja) |
WO (1) | WO2007066572A1 (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070223173A1 (en) * | 2004-03-19 | 2007-09-27 | Hiroshi Fujisawa | Bipolar Electrostatic Chuck |
CN101218668B (zh) * | 2005-07-08 | 2010-11-03 | 创意科技股份有限公司 | 静电吸盘以及静电吸盘用的电极片 |
JP4757839B2 (ja) * | 2007-05-24 | 2011-08-24 | 太平洋セメント株式会社 | ガラス質静電チャック及びその製造方法 |
KR20090057809A (ko) * | 2007-12-03 | 2009-06-08 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR101658758B1 (ko) | 2009-02-20 | 2016-09-21 | 엔지케이 인슐레이터 엘티디 | 세라믹스-금속 접합체 및 그 제조 방법 |
WO2011000689A1 (en) * | 2009-06-30 | 2011-01-06 | Asml Holding N.V. | Image-compensating addressable electrostatic chuck system |
WO2011001978A1 (ja) * | 2009-07-02 | 2011-01-06 | 株式会社クリエイティブ テクノロジー | 静電吸着構造体及びその製造方法 |
WO2012005294A1 (ja) * | 2010-07-09 | 2012-01-12 | 株式会社クリエイティブ テクノロジー | 静電チャック装置及びその製造方法 |
WO2012096982A1 (en) * | 2011-01-10 | 2012-07-19 | Sri International | Electroadhesive system for capturing objects |
JP5583877B1 (ja) * | 2012-11-06 | 2014-09-03 | 日本碍子株式会社 | サセプタ |
WO2015013142A1 (en) | 2013-07-22 | 2015-01-29 | Applied Materials, Inc. | An electrostatic chuck for high temperature process applications |
JP6423880B2 (ja) | 2013-08-05 | 2018-11-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | インシトゥで取り出すことができる静電チャック |
KR101812666B1 (ko) | 2013-08-05 | 2017-12-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 얇은 기판 취급을 위한 정전 캐리어 |
CN105408993A (zh) | 2013-08-06 | 2016-03-16 | 应用材料公司 | 局部加热的多区域基板支撑件 |
WO2015042302A1 (en) | 2013-09-20 | 2015-03-26 | Applied Materials, Inc. | Substrate carrier with integrated electrostatic chuck |
US9460950B2 (en) | 2013-12-06 | 2016-10-04 | Applied Materials, Inc. | Wafer carrier for smaller wafers and wafer pieces |
WO2015109342A2 (en) * | 2014-01-15 | 2015-07-23 | Board Of Regents, The University Of Texas System | Regenerative interface electrode |
KR20170002607A (ko) | 2014-05-09 | 2017-01-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 시스템 및 이를 사용하기 위한 방법 |
JP2017515301A (ja) | 2014-05-09 | 2017-06-08 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 保護カバーを有する基板キャリアシステム |
US9959961B2 (en) | 2014-06-02 | 2018-05-01 | Applied Materials, Inc. | Permanent magnetic chuck for OLED mask chucking |
WO2016035878A1 (ja) * | 2014-09-04 | 2016-03-10 | 日本碍子株式会社 | ウエハー保持台及びその製法 |
JP6279149B2 (ja) * | 2015-04-02 | 2018-02-14 | 株式会社アルバック | 吸着装置及び真空処理装置 |
JP2018518055A (ja) | 2015-06-04 | 2018-07-05 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 透明な静電キャリア |
CN109643682A (zh) * | 2016-06-01 | 2019-04-16 | 应用材料公司 | 静电卡盘及其制造方法 |
US11532497B2 (en) * | 2016-06-07 | 2022-12-20 | Applied Materials, Inc. | High power electrostatic chuck design with radio frequency coupling |
KR102643141B1 (ko) | 2016-11-03 | 2024-03-04 | 삼성디스플레이 주식회사 | 정전 척 및 정전 흡착 장치 |
TWI819046B (zh) * | 2018-08-02 | 2023-10-21 | 日商創意科技股份有限公司 | 靜電吸附體 |
CN111323460B (zh) * | 2018-12-13 | 2022-11-22 | 夏泰鑫半导体(青岛)有限公司 | 感测元件及应用其对静电吸附卡盘进行检测的方法 |
JP2023055411A (ja) | 2021-10-06 | 2023-04-18 | 株式会社クリエイティブテクノロジー | プレス金型用電気集塵機及びそれを用いたプレス金型 |
WO2023058652A1 (ja) | 2021-10-06 | 2023-04-13 | 株式会社クリエイティブテクノロジー | 電気集塵機及びそれを用いた集塵方法 |
Family Cites Families (10)
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US5444597A (en) | 1993-01-15 | 1995-08-22 | Blake; Julian G. | Wafer release method and apparatus |
EP0635870A1 (en) * | 1993-07-20 | 1995-01-25 | Applied Materials, Inc. | An electrostatic chuck having a grooved surface |
US5535507A (en) * | 1993-12-20 | 1996-07-16 | International Business Machines Corporation | Method of making electrostatic chuck with oxide insulator |
WO1995020838A1 (en) * | 1994-01-31 | 1995-08-03 | Applied Materials, Inc. | Electrostatic chuck with conformal insulator film |
US5764471A (en) * | 1996-05-08 | 1998-06-09 | Applied Materials, Inc. | Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck |
US6117246A (en) * | 1997-01-31 | 2000-09-12 | Applied Materials, Inc. | Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck |
TW525256B (en) | 1998-11-25 | 2003-03-21 | Applied Materials Inc | Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck |
JP4193264B2 (ja) | 1999-02-04 | 2008-12-10 | 日新イオン機器株式会社 | 監視回路付基板保持装置 |
JP4057977B2 (ja) * | 2003-08-08 | 2008-03-05 | 株式会社巴川製紙所 | 静電チャック装置用電極シート、静電チャック装置および吸着方法 |
US20070223173A1 (en) * | 2004-03-19 | 2007-09-27 | Hiroshi Fujisawa | Bipolar Electrostatic Chuck |
-
2006
- 2006-11-30 CN CN2006800461073A patent/CN101326627B/zh not_active Expired - Fee Related
- 2006-11-30 JP JP2007549093A patent/JP4825220B2/ja active Active
- 2006-11-30 US US12/085,349 patent/US7881036B2/en active Active
- 2006-11-30 WO PCT/JP2006/323970 patent/WO2007066572A1/ja active Application Filing
- 2006-11-30 KR KR1020087016260A patent/KR100994299B1/ko not_active IP Right Cessation
- 2006-11-30 EP EP06833773A patent/EP1959488A4/en not_active Withdrawn
- 2006-12-01 TW TW095144842A patent/TW200735258A/zh unknown
-
2009
- 2009-02-18 HK HK09101508.4A patent/HK1124688A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1959488A4 (en) | 2011-01-26 |
KR100994299B1 (ko) | 2010-11-12 |
JP4825220B2 (ja) | 2011-11-30 |
KR20080081014A (ko) | 2008-09-05 |
HK1124688A1 (en) | 2009-07-17 |
CN101326627A (zh) | 2008-12-17 |
CN101326627B (zh) | 2010-06-09 |
TWI369752B (ja) | 2012-08-01 |
US20090040681A1 (en) | 2009-02-12 |
US7881036B2 (en) | 2011-02-01 |
TW200735258A (en) | 2007-09-16 |
EP1959488A1 (en) | 2008-08-20 |
WO2007066572A1 (ja) | 2007-06-14 |
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