TW200735258A - Thin slice electrode of electrostatic sucking disc - Google Patents

Thin slice electrode of electrostatic sucking disc

Info

Publication number
TW200735258A
TW200735258A TW095144842A TW95144842A TW200735258A TW 200735258 A TW200735258 A TW 200735258A TW 095144842 A TW095144842 A TW 095144842A TW 95144842 A TW95144842 A TW 95144842A TW 200735258 A TW200735258 A TW 200735258A
Authority
TW
Taiwan
Prior art keywords
thin slice
sucking disc
electrode
electrode layer
electrostatic sucking
Prior art date
Application number
TW095144842A
Other languages
English (en)
Other versions
TWI369752B (zh
Inventor
Hiroshi Fujisawa
Kinya Miyashita
Original Assignee
Creative Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Tech Corp filed Critical Creative Tech Corp
Publication of TW200735258A publication Critical patent/TW200735258A/zh
Application granted granted Critical
Publication of TWI369752B publication Critical patent/TWI369752B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)
TW095144842A 2005-12-06 2006-12-01 Thin slice electrode of electrostatic sucking disc TW200735258A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005351441 2005-12-06

Publications (2)

Publication Number Publication Date
TW200735258A true TW200735258A (en) 2007-09-16
TWI369752B TWI369752B (zh) 2012-08-01

Family

ID=38122718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144842A TW200735258A (en) 2005-12-06 2006-12-01 Thin slice electrode of electrostatic sucking disc

Country Status (8)

Country Link
US (1) US7881036B2 (zh)
EP (1) EP1959488A4 (zh)
JP (1) JP4825220B2 (zh)
KR (1) KR100994299B1 (zh)
CN (1) CN101326627B (zh)
HK (1) HK1124688A1 (zh)
TW (1) TW200735258A (zh)
WO (1) WO2007066572A1 (zh)

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* Cited by examiner, † Cited by third party
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JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
KR100976320B1 (ko) * 2005-07-08 2010-08-16 가부시키가이샤 크리에이티브 테크놀러지 정전척 및 정전척용 전극 시트
JP4757839B2 (ja) * 2007-05-24 2011-08-24 太平洋セメント株式会社 ガラス質静電チャック及びその製造方法
KR20090057809A (ko) * 2007-12-03 2009-06-08 주식회사 에이디피엔지니어링 기판합착장치
WO2010095720A1 (ja) * 2009-02-20 2010-08-26 日本碍子株式会社 セラミックス－金属接合体及びその製法
US8477472B2 (en) * 2009-06-30 2013-07-02 Asml Holding N.V. Image-compensating addressable electrostatic chuck system
KR101806926B1 (ko) * 2009-07-02 2017-12-08 가부시키가이샤 크리에이티브 테크놀러지 양면 흡착 구조체, 양면 흡착 구조체의 제조방법, 및 양면 흡착 구조체를 이용한 피흡착물의 흡착방법
WO2012005294A1 (ja) * 2010-07-09 2012-01-12 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法
US20140064905A1 (en) * 2011-01-10 2014-03-06 Sri International Electroadhesive System for Capturing Objects
KR101413898B1 (ko) * 2012-11-06 2014-06-30 엔지케이 인슐레이터 엘티디 서셉터
WO2015013142A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
KR102139682B1 (ko) 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
KR101876501B1 (ko) 2013-08-05 2018-07-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
KR101905158B1 (ko) 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
KR20160058917A (ko) 2013-09-20 2016-05-25 어플라이드 머티어리얼스, 인코포레이티드 통합된 정전 척을 갖는 기판 캐리어
US9460950B2 (en) 2013-12-06 2016-10-04 Applied Materials, Inc. Wafer carrier for smaller wafers and wafer pieces
US10406365B2 (en) * 2014-01-15 2019-09-10 Board Of Regents, The University Of Texas System Regenerative interface electrode
CN106575720B (zh) 2014-05-09 2019-01-15 应用材料公司 具有保护覆盖物的基板载体系统
JP2017516294A (ja) 2014-05-09 2017-06-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板キャリアシステム及びそれを使用するための方法
US9959961B2 (en) 2014-06-02 2018-05-01 Applied Materials, Inc. Permanent magnetic chuck for OLED mask chucking
TWI582061B (zh) * 2014-09-04 2017-05-11 Ngk Insulators Ltd Wafer fixed table and its preparation method
WO2016159239A1 (ja) * 2015-04-02 2016-10-06 株式会社アルバック 吸着装置及び真空処理装置
US10332773B2 (en) 2015-06-04 2019-06-25 Applied Materials, Inc. Transparent electrostatic carrier
WO2017209325A1 (ko) * 2016-06-01 2017-12-07 (주)브이앤아이솔루션 정전척 및 그 제조방법
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
KR102643141B1 (ko) 2016-11-03 2024-03-04 삼성디스플레이 주식회사 정전 척 및 정전 흡착 장치
DE102017128568A1 (de) * 2017-12-01 2019-06-06 Infineon Technologies Ag Halbleiterchip mit einer vielzahl von externen kontakten, chip-anordnung und verfahren zum überprüfen einer ausrichtung einer position eines halbleiterchips
TWI819046B (zh) * 2018-08-02 2023-10-21 日商創意科技股份有限公司 靜電吸附體
CN111323460B (zh) * 2018-12-13 2022-11-22 夏泰鑫半导体(青岛)有限公司 感测元件及应用其对静电吸附卡盘进行检测的方法
KR20240066182A (ko) 2021-10-06 2024-05-14 가부시키가이샤 크리에이티브 테크놀러지 전기 집진기 및 그것을 이용한 집진 방법
JP2023055411A (ja) 2021-10-06 2023-04-18 株式会社クリエイティブテクノロジー プレス金型用電気集塵機及びそれを用いたプレス金型

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Publication number Priority date Publication date Assignee Title
US5444597A (en) 1993-01-15 1995-08-22 Blake; Julian G. Wafer release method and apparatus
EP0635870A1 (en) * 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
US5535507A (en) * 1993-12-20 1996-07-16 International Business Machines Corporation Method of making electrostatic chuck with oxide insulator
KR100404631B1 (ko) * 1994-01-31 2004-02-05 어플라이드 머티어리얼스, 인코포레이티드 두께가일정한절연체막을갖는정전기척
US5764471A (en) * 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
TW525256B (en) * 1998-11-25 2003-03-21 Applied Materials Inc Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JP4193264B2 (ja) 1999-02-04 2008-12-10 日新イオン機器株式会社 監視回路付基板保持装置
JP4057977B2 (ja) * 2003-08-08 2008-03-05 株式会社巴川製紙所 静電チャック装置用電極シート、静電チャック装置および吸着方法
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック

Also Published As

Publication number Publication date
KR100994299B1 (ko) 2010-11-12
EP1959488A1 (en) 2008-08-20
WO2007066572A1 (ja) 2007-06-14
HK1124688A1 (en) 2009-07-17
EP1959488A4 (en) 2011-01-26
JPWO2007066572A1 (ja) 2009-05-21
JP4825220B2 (ja) 2011-11-30
KR20080081014A (ko) 2008-09-05
US7881036B2 (en) 2011-02-01
CN101326627A (zh) 2008-12-17
TWI369752B (zh) 2012-08-01
US20090040681A1 (en) 2009-02-12
CN101326627B (zh) 2010-06-09

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