JPS6464228A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS6464228A
JPS6464228A JP62221515A JP22151587A JPS6464228A JP S6464228 A JPS6464228 A JP S6464228A JP 62221515 A JP62221515 A JP 62221515A JP 22151587 A JP22151587 A JP 22151587A JP S6464228 A JPS6464228 A JP S6464228A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
section
bonding pads
main surface
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62221515A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0579169B2 (enExample
Inventor
Takashi Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62221515A priority Critical patent/JPS6464228A/ja
Publication of JPS6464228A publication Critical patent/JPS6464228A/ja
Publication of JPH0579169B2 publication Critical patent/JPH0579169B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP62221515A 1987-09-03 1987-09-03 Semiconductor integrated circuit Granted JPS6464228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62221515A JPS6464228A (en) 1987-09-03 1987-09-03 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221515A JPS6464228A (en) 1987-09-03 1987-09-03 Semiconductor integrated circuit

Publications (2)

Publication Number Publication Date
JPS6464228A true JPS6464228A (en) 1989-03-10
JPH0579169B2 JPH0579169B2 (enExample) 1993-11-01

Family

ID=16767922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221515A Granted JPS6464228A (en) 1987-09-03 1987-09-03 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS6464228A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2978287B1 (en) 2013-03-21 2022-08-31 Tanigurogumi Corporation Soldering device and method

Also Published As

Publication number Publication date
JPH0579169B2 (enExample) 1993-11-01

Similar Documents

Publication Publication Date Title
MY120226A (en) Thin type semiconductor device, module structure using the device and method of mounting the device on board.
EP0863549B1 (en) Semiconductor device comprising a wiring substrate
MY133357A (en) A semiconductor device and a method of manufacturing the same
SG80675A1 (en) Semiconductor device and its manufacturing method
JPH02201948A (ja) 半導体装置パッケージ
JPS6464228A (en) Semiconductor integrated circuit
JPS57107059A (en) Semiconductor package
US6211563B1 (en) Semiconductor package with an improved leadframe
JPH08236665A (ja) 樹脂封止型半導体装置及びその製造方法
JPS57136352A (en) Semiconductor device of resin potted type
JPS6224654A (ja) 半導体パツケ−ジ
JPS6482656A (en) Sealing structure for hybrid integrated circuit
JPS5789276A (en) Photo chip element
KR100352120B1 (ko) 리드프레임의 구조 및 이를 이용한 반도체 패키지
JPH0352260A (ja) 電子回路装置
JPH09121003A (ja) 半導体パッケージ
JPS5736859A (en) Integrated circuit device
JPH05190586A (ja) 半導体装置
JPS57128085A (en) Manufacture of display unit with light emitting diode
JPS6484725A (en) Pellet mounting method
JPS6436030A (en) Semiconductor device
JPS61177763A (ja) 半導体装置
JPS5552231A (en) Semiconductor attaching device
JPS57136339A (en) Resin sealing type semiconductor device
KR930009035A (ko) 접착리드를 이용한 반도체 패키지 구조 및 그 제조방법