JPS6419724A - Wet treatment equipment - Google Patents
Wet treatment equipmentInfo
- Publication number
- JPS6419724A JPS6419724A JP17460687A JP17460687A JPS6419724A JP S6419724 A JPS6419724 A JP S6419724A JP 17460687 A JP17460687 A JP 17460687A JP 17460687 A JP17460687 A JP 17460687A JP S6419724 A JPS6419724 A JP S6419724A
- Authority
- JP
- Japan
- Prior art keywords
- treating section
- etching
- peeling
- developing
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To remove nonuniformity on treatment, and to conduct stabilized wet treatment continuously in a large quantity by forming substrates to be treated to a sheet shape, holding the surfaces to be treated so as to be made perpendicular substantially and executing wet treatment. CONSTITUTION:A wet treater is composed of a continuous automatic line system mainly having a developing treating section, an etching treating section and a peeling treating section. In the developing treating section, a photo-resist film applied onto the surface of a transparent glass substrate SUB is developed in a first developing tank 3 or a second developing tank 4, and an etching mask is shaped. In the etching treating section, an etching mask shaped by a photo-resist film is used in etching tanks 13a, 13b, 13c, and the layer of a semiconductor thin-film formed onto the surface of the transparent glass substrate is shaped to a specified pattern. In the peeling treating section, the substrate is carried to a first peeling tank 21 and a second peeling tank 22 in succession, and the etching mask formed onto the surface of the transparent glass substrate SUB is peeled.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17460687A JP2601827B2 (en) | 1987-07-15 | 1987-07-15 | Wet processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17460687A JP2601827B2 (en) | 1987-07-15 | 1987-07-15 | Wet processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6419724A true JPS6419724A (en) | 1989-01-23 |
JP2601827B2 JP2601827B2 (en) | 1997-04-16 |
Family
ID=15981521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17460687A Expired - Fee Related JP2601827B2 (en) | 1987-07-15 | 1987-07-15 | Wet processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2601827B2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59195646A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Method and device for washing mask for semiconductor element manufacture |
JPS59195653A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Method and device for washing photomask |
JPS6084823A (en) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | Device for etching semiconductor wafer |
JPS61121337A (en) * | 1984-11-16 | 1986-06-09 | Matsushita Electric Ind Co Ltd | Treatment of wafer |
-
1987
- 1987-07-15 JP JP17460687A patent/JP2601827B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59195646A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Method and device for washing mask for semiconductor element manufacture |
JPS59195653A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Method and device for washing photomask |
JPS6084823A (en) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | Device for etching semiconductor wafer |
JPS61121337A (en) * | 1984-11-16 | 1986-06-09 | Matsushita Electric Ind Co Ltd | Treatment of wafer |
Also Published As
Publication number | Publication date |
---|---|
JP2601827B2 (en) | 1997-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |