JPS6419724A - Wet treatment equipment - Google Patents

Wet treatment equipment

Info

Publication number
JPS6419724A
JPS6419724A JP17460687A JP17460687A JPS6419724A JP S6419724 A JPS6419724 A JP S6419724A JP 17460687 A JP17460687 A JP 17460687A JP 17460687 A JP17460687 A JP 17460687A JP S6419724 A JPS6419724 A JP S6419724A
Authority
JP
Japan
Prior art keywords
treating section
etching
peeling
developing
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17460687A
Other languages
Japanese (ja)
Other versions
JP2601827B2 (en
Inventor
Masateru Wakui
Ryuzo Nashimoto
Hiroshi Suzuki
Kenkichi Suzuki
Itaru Masakawa
Takeo Sawaguchi
Kazuo Shirohashi
Hidekazu Hirata
Kazuo Sunahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17460687A priority Critical patent/JP2601827B2/en
Publication of JPS6419724A publication Critical patent/JPS6419724A/en
Application granted granted Critical
Publication of JP2601827B2 publication Critical patent/JP2601827B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To remove nonuniformity on treatment, and to conduct stabilized wet treatment continuously in a large quantity by forming substrates to be treated to a sheet shape, holding the surfaces to be treated so as to be made perpendicular substantially and executing wet treatment. CONSTITUTION:A wet treater is composed of a continuous automatic line system mainly having a developing treating section, an etching treating section and a peeling treating section. In the developing treating section, a photo-resist film applied onto the surface of a transparent glass substrate SUB is developed in a first developing tank 3 or a second developing tank 4, and an etching mask is shaped. In the etching treating section, an etching mask shaped by a photo-resist film is used in etching tanks 13a, 13b, 13c, and the layer of a semiconductor thin-film formed onto the surface of the transparent glass substrate is shaped to a specified pattern. In the peeling treating section, the substrate is carried to a first peeling tank 21 and a second peeling tank 22 in succession, and the etching mask formed onto the surface of the transparent glass substrate SUB is peeled.
JP17460687A 1987-07-15 1987-07-15 Wet processing equipment Expired - Fee Related JP2601827B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17460687A JP2601827B2 (en) 1987-07-15 1987-07-15 Wet processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17460687A JP2601827B2 (en) 1987-07-15 1987-07-15 Wet processing equipment

Publications (2)

Publication Number Publication Date
JPS6419724A true JPS6419724A (en) 1989-01-23
JP2601827B2 JP2601827B2 (en) 1997-04-16

Family

ID=15981521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17460687A Expired - Fee Related JP2601827B2 (en) 1987-07-15 1987-07-15 Wet processing equipment

Country Status (1)

Country Link
JP (1) JP2601827B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195646A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing mask for semiconductor element manufacture
JPS59195653A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing photomask
JPS6084823A (en) * 1983-10-15 1985-05-14 Mitsubishi Electric Corp Device for etching semiconductor wafer
JPS61121337A (en) * 1984-11-16 1986-06-09 Matsushita Electric Ind Co Ltd Treatment of wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195646A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing mask for semiconductor element manufacture
JPS59195653A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing photomask
JPS6084823A (en) * 1983-10-15 1985-05-14 Mitsubishi Electric Corp Device for etching semiconductor wafer
JPS61121337A (en) * 1984-11-16 1986-06-09 Matsushita Electric Ind Co Ltd Treatment of wafer

Also Published As

Publication number Publication date
JP2601827B2 (en) 1997-04-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees