JPS57160180A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57160180A JPS57160180A JP56046077A JP4607781A JPS57160180A JP S57160180 A JPS57160180 A JP S57160180A JP 56046077 A JP56046077 A JP 56046077A JP 4607781 A JP4607781 A JP 4607781A JP S57160180 A JPS57160180 A JP S57160180A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- photoresist film
- manufacture
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 4
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Abstract
PURPOSE:To accelerate the removal of a photoresist film, by reducing the thickness of an Au layer formed on the photoresist film to the same as that of a Cr layer formed thereunder or less. CONSTITUTION:The photoresist film 12 is applied on a substrate 11 to form the Cr layer 13 on the film 12 and the Au layer with same or less thickness of the layer 13 on the layer 13. Next, the film 12 and the metallic part on the film 12 are partly removed, and the substrate 11 having these double layers is immersed in photoresist film removing liquid. Because the Cr layer 13 warps upward by said treatment, the removing liquid is permeated into the film 12 with good efficiency.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56046077A JPS57160180A (en) | 1981-03-27 | 1981-03-27 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56046077A JPS57160180A (en) | 1981-03-27 | 1981-03-27 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57160180A true JPS57160180A (en) | 1982-10-02 |
Family
ID=12736925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56046077A Pending JPS57160180A (en) | 1981-03-27 | 1981-03-27 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57160180A (en) |
-
1981
- 1981-03-27 JP JP56046077A patent/JPS57160180A/en active Pending
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