JPS6419740A - Substrate holding jig for wet processor - Google Patents
Substrate holding jig for wet processorInfo
- Publication number
- JPS6419740A JPS6419740A JP17460987A JP17460987A JPS6419740A JP S6419740 A JPS6419740 A JP S6419740A JP 17460987 A JP17460987 A JP 17460987A JP 17460987 A JP17460987 A JP 17460987A JP S6419740 A JPS6419740 A JP S6419740A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate sub
- processed
- make
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To avoid the uneven wet processing while effectively draining the processing liquid by a method wherein a substrate to be subjected to single wafer processing is held to make the surface to be processed perpendicular while holding the substrate by two holding sides intersecting with each other at a specific angle. CONSTITUTION:The title wet processor is composed of a continuous automatized line system provided with a developing part, an etching part and a peeling off part. In this processor, a transparent glass substrate SUB (to be processed) is subjected to single wafer processing and held by a substrate holding jig 40 to make the surface (to be processed) of the substrate SUB perpendicular. Furthermore, the jig 40 is constituted so that respective holding sides 40A, 40B may make a specific angle to a horizontal plane to obliquely hold the transparent substrate SUB. Consequently, the liquid can be dripped actively from one point of the substrate SUB so that the wet processing liquid may be drained immediately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17460987A JP2591753B2 (en) | 1987-07-15 | 1987-07-15 | Substrate holding jig for wet processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17460987A JP2591753B2 (en) | 1987-07-15 | 1987-07-15 | Substrate holding jig for wet processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6419740A true JPS6419740A (en) | 1989-01-23 |
| JP2591753B2 JP2591753B2 (en) | 1997-03-19 |
Family
ID=15981578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17460987A Expired - Fee Related JP2591753B2 (en) | 1987-07-15 | 1987-07-15 | Substrate holding jig for wet processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2591753B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11202473A (en) * | 1998-01-16 | 1999-07-30 | Dainippon Printing Co Ltd | Mask preparation device |
| JP2014009132A (en) * | 2012-06-29 | 2014-01-20 | Hoya Corp | Glass substrate holder, and production method of glass substrate of cover glass for electronic apparatus |
| CN109913827A (en) * | 2019-03-29 | 2019-06-21 | 太湖金张科技股份有限公司 | A kind of sputtering process protective device and its application method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178436U (en) * | 1981-05-06 | 1982-11-11 |
-
1987
- 1987-07-15 JP JP17460987A patent/JP2591753B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178436U (en) * | 1981-05-06 | 1982-11-11 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11202473A (en) * | 1998-01-16 | 1999-07-30 | Dainippon Printing Co Ltd | Mask preparation device |
| JP2014009132A (en) * | 2012-06-29 | 2014-01-20 | Hoya Corp | Glass substrate holder, and production method of glass substrate of cover glass for electronic apparatus |
| CN109913827A (en) * | 2019-03-29 | 2019-06-21 | 太湖金张科技股份有限公司 | A kind of sputtering process protective device and its application method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2591753B2 (en) | 1997-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |