JPS5550625A - Surface treatment of thin plate - Google Patents
Surface treatment of thin plateInfo
- Publication number
- JPS5550625A JPS5550625A JP12381078A JP12381078A JPS5550625A JP S5550625 A JPS5550625 A JP S5550625A JP 12381078 A JP12381078 A JP 12381078A JP 12381078 A JP12381078 A JP 12381078A JP S5550625 A JPS5550625 A JP S5550625A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- wafer
- solution
- thin plate
- bubbles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
Abstract
PURPOSE: To decrease the unevenness in treatment due to the contact of bubbles in the process of surface treatment by moving a thin plate between the first and the second holders which constitute a combined body with the body being rotated, and by exposing one half of the thin plate from the surface level of the treatment solution.
CONSTITUTION: A semiconductor wafer 2 is inserted into a holder 1A and a holder 1B is attached to the other side in an inverted fashion, thereby a combined body 11 is constituted. Both holders are fixed by engage locks 12a and 12b, and shafts 13a and 13b are attached. The holder 1A is immersed in the buffer solution 9 in a tank 8 so that the contact plane of the holder 1A and 1B appears slightly above the surface of the solution 9. When the combined body rotates on the shafts 13a and 13b, at least one half of the wafer is exposed above the solution and moves from the holder 1A to the holder 1B. The bubbles, which are yielded and attached to the wafer in the etching process during which the wafer is immersed in the buffer solution, are spontaneously eliminated by the rotation, and unevenness caused by bubbles during the etching process is not yielded.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12381078A JPS5550625A (en) | 1978-10-06 | 1978-10-06 | Surface treatment of thin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12381078A JPS5550625A (en) | 1978-10-06 | 1978-10-06 | Surface treatment of thin plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5550625A true JPS5550625A (en) | 1980-04-12 |
Family
ID=14869886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12381078A Pending JPS5550625A (en) | 1978-10-06 | 1978-10-06 | Surface treatment of thin plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5550625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555192A (en) * | 1991-08-27 | 1993-03-05 | Mitsubishi Electric Corp | Surface processing apparatus for thin board substance such as wafer |
| JP2012064646A (en) * | 2010-09-14 | 2012-03-29 | Tokyo Electron Ltd | Substrate processing method, storage medium having program recorded therein for execution of substrate processing method and substrate processing apparatus |
-
1978
- 1978-10-06 JP JP12381078A patent/JPS5550625A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555192A (en) * | 1991-08-27 | 1993-03-05 | Mitsubishi Electric Corp | Surface processing apparatus for thin board substance such as wafer |
| JP2012064646A (en) * | 2010-09-14 | 2012-03-29 | Tokyo Electron Ltd | Substrate processing method, storage medium having program recorded therein for execution of substrate processing method and substrate processing apparatus |
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