JPS5432267A - Liquid processing method for semiconductor wafer - Google Patents

Liquid processing method for semiconductor wafer

Info

Publication number
JPS5432267A
JPS5432267A JP9824677A JP9824677A JPS5432267A JP S5432267 A JPS5432267 A JP S5432267A JP 9824677 A JP9824677 A JP 9824677A JP 9824677 A JP9824677 A JP 9824677A JP S5432267 A JPS5432267 A JP S5432267A
Authority
JP
Japan
Prior art keywords
processing method
semiconductor wafer
liquid processing
plural number
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9824677A
Other languages
Japanese (ja)
Inventor
Seiji Yasuda
Masafumi Miyagawa
Kenichi Goto
Shinji Nagahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9824677A priority Critical patent/JPS5432267A/en
Publication of JPS5432267A publication Critical patent/JPS5432267A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To eliminate the uneven processing due to air bubbles, by immersing the wafer support mounting a plural number of semiconductor wafers with a distance each other in the processing solution such as etching solution and leaving it in air through lifting up, and by performing the combinated processes for a plural number of times.
COPYRIGHT: (C)1979,JPO&Japio
JP9824677A 1977-08-18 1977-08-18 Liquid processing method for semiconductor wafer Pending JPS5432267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9824677A JPS5432267A (en) 1977-08-18 1977-08-18 Liquid processing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9824677A JPS5432267A (en) 1977-08-18 1977-08-18 Liquid processing method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5432267A true JPS5432267A (en) 1979-03-09

Family

ID=14214588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9824677A Pending JPS5432267A (en) 1977-08-18 1977-08-18 Liquid processing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5432267A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012064646A (en) * 2010-09-14 2012-03-29 Tokyo Electron Ltd Substrate processing method, storage medium having program recorded therein for execution of substrate processing method and substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012064646A (en) * 2010-09-14 2012-03-29 Tokyo Electron Ltd Substrate processing method, storage medium having program recorded therein for execution of substrate processing method and substrate processing apparatus

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