JPS5340279A - Surface processing method for semiconductor element substrate - Google Patents

Surface processing method for semiconductor element substrate

Info

Publication number
JPS5340279A
JPS5340279A JP11464876A JP11464876A JPS5340279A JP S5340279 A JPS5340279 A JP S5340279A JP 11464876 A JP11464876 A JP 11464876A JP 11464876 A JP11464876 A JP 11464876A JP S5340279 A JPS5340279 A JP S5340279A
Authority
JP
Japan
Prior art keywords
processing method
semiconductor element
element substrate
surface processing
reversely
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11464876A
Other languages
Japanese (ja)
Inventor
Tetsuo Masuda
Kazuhiko Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11464876A priority Critical patent/JPS5340279A/en
Publication of JPS5340279A publication Critical patent/JPS5340279A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)

Abstract

PURPOSE: A conjunction edge surface exposed to the semiconductor substrate surface is soaked and etched in the alkali boiled solution to which disodium ethylene diamine tetraacetate is added, thereby preventing the deterioration of current amplification factor and the increase of collector-reversely-directional current value.
COPYRIGHT: (C)1978,JPO&Japio
JP11464876A 1976-09-27 1976-09-27 Surface processing method for semiconductor element substrate Pending JPS5340279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11464876A JPS5340279A (en) 1976-09-27 1976-09-27 Surface processing method for semiconductor element substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11464876A JPS5340279A (en) 1976-09-27 1976-09-27 Surface processing method for semiconductor element substrate

Publications (1)

Publication Number Publication Date
JPS5340279A true JPS5340279A (en) 1978-04-12

Family

ID=14643055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11464876A Pending JPS5340279A (en) 1976-09-27 1976-09-27 Surface processing method for semiconductor element substrate

Country Status (1)

Country Link
JP (1) JPS5340279A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03219000A (en) * 1989-11-09 1991-09-26 Nippon Steel Corp Etching method and washing method for silicon wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03219000A (en) * 1989-11-09 1991-09-26 Nippon Steel Corp Etching method and washing method for silicon wafer

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