JPS5340279A - Surface processing method for semiconductor element substrate - Google Patents
Surface processing method for semiconductor element substrateInfo
- Publication number
- JPS5340279A JPS5340279A JP11464876A JP11464876A JPS5340279A JP S5340279 A JPS5340279 A JP S5340279A JP 11464876 A JP11464876 A JP 11464876A JP 11464876 A JP11464876 A JP 11464876A JP S5340279 A JPS5340279 A JP S5340279A
- Authority
- JP
- Japan
- Prior art keywords
- processing method
- semiconductor element
- element substrate
- surface processing
- reversely
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
PURPOSE: A conjunction edge surface exposed to the semiconductor substrate surface is soaked and etched in the alkali boiled solution to which disodium ethylene diamine tetraacetate is added, thereby preventing the deterioration of current amplification factor and the increase of collector-reversely-directional current value.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11464876A JPS5340279A (en) | 1976-09-27 | 1976-09-27 | Surface processing method for semiconductor element substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11464876A JPS5340279A (en) | 1976-09-27 | 1976-09-27 | Surface processing method for semiconductor element substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5340279A true JPS5340279A (en) | 1978-04-12 |
Family
ID=14643055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11464876A Pending JPS5340279A (en) | 1976-09-27 | 1976-09-27 | Surface processing method for semiconductor element substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5340279A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03219000A (en) * | 1989-11-09 | 1991-09-26 | Nippon Steel Corp | Etching method and washing method for silicon wafer |
-
1976
- 1976-09-27 JP JP11464876A patent/JPS5340279A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03219000A (en) * | 1989-11-09 | 1991-09-26 | Nippon Steel Corp | Etching method and washing method for silicon wafer |
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