JPS5550626A - Surface treatment of thin plate - Google Patents

Surface treatment of thin plate

Info

Publication number
JPS5550626A
JPS5550626A JP12381178A JP12381178A JPS5550626A JP S5550626 A JPS5550626 A JP S5550626A JP 12381178 A JP12381178 A JP 12381178A JP 12381178 A JP12381178 A JP 12381178A JP S5550626 A JPS5550626 A JP S5550626A
Authority
JP
Japan
Prior art keywords
holder
combined body
thin plate
wafer
shafts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12381178A
Other languages
Japanese (ja)
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12381178A priority Critical patent/JPS5550626A/en
Publication of JPS5550626A publication Critical patent/JPS5550626A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To perform even treatment of surfaces and to enhance working efficiency by rotating a thin plate that is contained in a holder in the treatment process.
CONSTITUTION: A semiconductor wafer 2 is inserted into a holder 1A, and a holder 1B is attached to the other side in an inverted fashion, thereby a combined body 10 is constituted. The combined body 10 is fixed by engage locks 11a and 11b and shafts 12a and 12b are attached. When the holder 1A is immersed in etching liquid 9 in a tank 8 and the combined body 10 is rotated on the shafts at about 15RPM, the wafer travels between the holders 1A and 1B, with the wafer being inserted in grooves 4a and 4b. Since there is no stationary portion, uniform etching can be accomplished. The groove width can be made narrow and the number of wafers to be contained can be increased and working efficiency can be enhanced.
COPYRIGHT: (C)1980,JPO&Japio
JP12381178A 1978-10-06 1978-10-06 Surface treatment of thin plate Pending JPS5550626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12381178A JPS5550626A (en) 1978-10-06 1978-10-06 Surface treatment of thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12381178A JPS5550626A (en) 1978-10-06 1978-10-06 Surface treatment of thin plate

Publications (1)

Publication Number Publication Date
JPS5550626A true JPS5550626A (en) 1980-04-12

Family

ID=14869913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12381178A Pending JPS5550626A (en) 1978-10-06 1978-10-06 Surface treatment of thin plate

Country Status (1)

Country Link
JP (1) JPS5550626A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201467A (en) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd Television receiver
JPS5978436A (en) * 1982-10-27 1984-05-07 Shimadzu Corp Display of scanning picture
JPS6194344U (en) * 1984-11-24 1986-06-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201467A (en) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd Television receiver
JPS5978436A (en) * 1982-10-27 1984-05-07 Shimadzu Corp Display of scanning picture
JPS6194344U (en) * 1984-11-24 1986-06-18

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