JPS5681951A - Holder of semiconductor substrate - Google Patents

Holder of semiconductor substrate

Info

Publication number
JPS5681951A
JPS5681951A JP15703280A JP15703280A JPS5681951A JP S5681951 A JPS5681951 A JP S5681951A JP 15703280 A JP15703280 A JP 15703280A JP 15703280 A JP15703280 A JP 15703280A JP S5681951 A JPS5681951 A JP S5681951A
Authority
JP
Japan
Prior art keywords
substrate
holder
sic
chemicalproof
polluted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15703280A
Other languages
Japanese (ja)
Inventor
Hisashi Muraoka
Hideo Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15703280A priority Critical patent/JPS5681951A/en
Publication of JPS5681951A publication Critical patent/JPS5681951A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To protect the substrate, the contact surface thereof is turned into SiC, from being polluted by a method wherein the semiconductor substrate is supported with a material having an excellent heatproof and chemicalproof property and the material is suitably shaped so that it is easily attached to or detached from a carrying and processing devices. CONSTITUTION:The holder is made of SiC or by coating SiC on ZrC, C and Al2O3. A frame section is provided on its circumference to prevent the slipping off of the substrate and a radial groove 41a is formed on the peripheral fringe of the concaved section supporting the substrate to simplify the taking out of a wafer. In this constitution, the holder has an excellent heatproof and chemicalproof property and the substrate is not polluted by heat treatment. Also the holder is convenient in carrying the substrate and a processing can be performed without conducting replacement of the substrare, thereby enabling to increase working efficiency.
JP15703280A 1980-11-10 1980-11-10 Holder of semiconductor substrate Pending JPS5681951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15703280A JPS5681951A (en) 1980-11-10 1980-11-10 Holder of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15703280A JPS5681951A (en) 1980-11-10 1980-11-10 Holder of semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5681951A true JPS5681951A (en) 1981-07-04

Family

ID=15640691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15703280A Pending JPS5681951A (en) 1980-11-10 1980-11-10 Holder of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5681951A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086844A (en) * 1983-09-22 1985-05-16 バリアン・アソシエイツ・インコーポレイテツド Plural wafer holder for wafer transfer device
JPS63157925U (en) * 1987-04-02 1988-10-17
JPH06151555A (en) * 1992-11-12 1994-05-31 Mitsui Eng & Shipbuild Co Ltd Semiconductor transfer jig

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834482A (en) * 1971-09-04 1973-05-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834482A (en) * 1971-09-04 1973-05-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086844A (en) * 1983-09-22 1985-05-16 バリアン・アソシエイツ・インコーポレイテツド Plural wafer holder for wafer transfer device
JPS63157925U (en) * 1987-04-02 1988-10-17
JPH06151555A (en) * 1992-11-12 1994-05-31 Mitsui Eng & Shipbuild Co Ltd Semiconductor transfer jig
JP2621749B2 (en) * 1992-11-12 1997-06-18 三井造船株式会社 Jig for semiconductor transportation

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