JPS6434661A - Wafer polishing device - Google Patents
Wafer polishing deviceInfo
- Publication number
- JPS6434661A JPS6434661A JP62187743A JP18774387A JPS6434661A JP S6434661 A JPS6434661 A JP S6434661A JP 62187743 A JP62187743 A JP 62187743A JP 18774387 A JP18774387 A JP 18774387A JP S6434661 A JPS6434661 A JP S6434661A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing surface
- retaining ring
- polishing
- polishing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To enhance the flatness of the polishing surface of a wafer by providing radial grooves on a wafer retaining ring. CONSTITUTION:Even if a wafer retaining ring 3 is brought into contact with a polisher 6, polishing liquid is supplied to the space between the polishing surface of a wafer 8 and the polisher 6 though radial grooves. As a result, the temperature difference between the center of the polishing surface of the wafer 8 and the outer circumference thereof is decreased, and the difference in the polishing amount between the center of the polishing surface of the wafer 8 and the outer circumference thereof is decreased. Thus, the flatness of the polishing surface of the wafer 8 which has been retained in the wafer retaining ring 3 adhered to an elastic membrane 2 can be enhanced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62187743A JPS6434661A (en) | 1987-07-29 | 1987-07-29 | Wafer polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62187743A JPS6434661A (en) | 1987-07-29 | 1987-07-29 | Wafer polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6434661A true JPS6434661A (en) | 1989-02-06 |
Family
ID=16211419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62187743A Pending JPS6434661A (en) | 1987-07-29 | 1987-07-29 | Wafer polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6434661A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6146260A (en) * | 1998-08-03 | 2000-11-14 | Promos Technology, Inc. | Polishing machine |
| US6168684B1 (en) | 1997-12-04 | 2001-01-02 | Nec Corporation | Wafer polishing apparatus and polishing method |
| US6234876B1 (en) | 1997-09-01 | 2001-05-22 | United Microelectronics Corp | Chemical-mechanical polish machines and fabrication process using the same |
| JP2006297524A (en) * | 2005-04-19 | 2006-11-02 | Shin Etsu Chem Co Ltd | Guide ring for polishing rectangular substrate, polishing head, and method for polishing rectangular substrate |
-
1987
- 1987-07-29 JP JP62187743A patent/JPS6434661A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6234876B1 (en) | 1997-09-01 | 2001-05-22 | United Microelectronics Corp | Chemical-mechanical polish machines and fabrication process using the same |
| US6241582B1 (en) | 1997-09-01 | 2001-06-05 | United Microelectronics Corp. | Chemical mechanical polish machines and fabrication process using the same |
| US6293850B1 (en) | 1997-09-01 | 2001-09-25 | United Microelectronics Corp. | Chemical-mechanical polish machines and fabrication process using the same |
| US6168684B1 (en) | 1997-12-04 | 2001-01-02 | Nec Corporation | Wafer polishing apparatus and polishing method |
| US6146260A (en) * | 1998-08-03 | 2000-11-14 | Promos Technology, Inc. | Polishing machine |
| JP2006297524A (en) * | 2005-04-19 | 2006-11-02 | Shin Etsu Chem Co Ltd | Guide ring for polishing rectangular substrate, polishing head, and method for polishing rectangular substrate |
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