JPS571654A - Polishing of thin piece - Google Patents

Polishing of thin piece

Info

Publication number
JPS571654A
JPS571654A JP7208780A JP7208780A JPS571654A JP S571654 A JPS571654 A JP S571654A JP 7208780 A JP7208780 A JP 7208780A JP 7208780 A JP7208780 A JP 7208780A JP S571654 A JPS571654 A JP S571654A
Authority
JP
Japan
Prior art keywords
grinding
wafer
ground
desired thickness
standard plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7208780A
Other languages
Japanese (ja)
Inventor
Hirokazu Fukuda
Koji Shinohara
Mitsuo Yoshikawa
Yoshio Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7208780A priority Critical patent/JPS571654A/en
Publication of JPS571654A publication Critical patent/JPS571654A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To properly detect the time when a wafer is ground to a desired thickness by grinding the wafer and a standard plate having different color at the same time and discriminating grinder dust, in grinding semiconductor wafers. CONSTITUTION:When a semiconductor wafer 3 is ground through the contact with a grinding fixed plate 6, and a desired thickness is obtained, the surface of the standard plate 4 which is made of carbon and has different colour from the water contacts with the grinding fixed plate 6, and the standard plate 4 is ground a little, and black color of carbon mixes with lapping agent. Through discrimination of this formed color, grinding operation is stopped, and the wafer 3 having a desired thickness can be obtained.
JP7208780A 1980-05-28 1980-05-28 Polishing of thin piece Pending JPS571654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7208780A JPS571654A (en) 1980-05-28 1980-05-28 Polishing of thin piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7208780A JPS571654A (en) 1980-05-28 1980-05-28 Polishing of thin piece

Publications (1)

Publication Number Publication Date
JPS571654A true JPS571654A (en) 1982-01-06

Family

ID=13479261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7208780A Pending JPS571654A (en) 1980-05-28 1980-05-28 Polishing of thin piece

Country Status (1)

Country Link
JP (1) JPS571654A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6095905A (en) * 1998-07-01 2000-08-01 Molecular Optoelectronics Corporation Polishing fixture and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6095905A (en) * 1998-07-01 2000-08-01 Molecular Optoelectronics Corporation Polishing fixture and method
US6238274B1 (en) 1998-07-01 2001-05-29 Molecular Optoelectronics Corporation Polishing method for a device

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