JPS5232668A - Semiconductor waffer processing equipment - Google Patents
Semiconductor waffer processing equipmentInfo
- Publication number
- JPS5232668A JPS5232668A JP10806275A JP10806275A JPS5232668A JP S5232668 A JPS5232668 A JP S5232668A JP 10806275 A JP10806275 A JP 10806275A JP 10806275 A JP10806275 A JP 10806275A JP S5232668 A JPS5232668 A JP S5232668A
- Authority
- JP
- Japan
- Prior art keywords
- waffer
- semiconductor
- processing equipment
- wafer
- becomes possible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: The wafer is made touch the revolving grinder at three points including an eccentric guide ring. In this way, a good molding becomes possible with a uniform circumference of the wafer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10806275A JPS5232668A (en) | 1975-09-08 | 1975-09-08 | Semiconductor waffer processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10806275A JPS5232668A (en) | 1975-09-08 | 1975-09-08 | Semiconductor waffer processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5232668A true JPS5232668A (en) | 1977-03-12 |
JPS5342661B2 JPS5342661B2 (en) | 1978-11-14 |
Family
ID=14474922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10806275A Granted JPS5232668A (en) | 1975-09-08 | 1975-09-08 | Semiconductor waffer processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5232668A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6722964B2 (en) | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58163484U (en) * | 1982-04-28 | 1983-10-31 | 釜屋化学工業株式会社 | Quantitative discharge container for powder and granular materials |
JPS61144073U (en) * | 1985-02-26 | 1986-09-05 |
-
1975
- 1975-09-08 JP JP10806275A patent/JPS5232668A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6722964B2 (en) | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
US6935932B2 (en) | 2000-04-04 | 2005-08-30 | Ebara Corporation | Polishing apparatus and method |
US7108589B2 (en) | 2000-04-04 | 2006-09-19 | Ebara Corporation | Polishing apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
JPS5342661B2 (en) | 1978-11-14 |
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