EP0403287A3 - Method of polishing semiconductor wafer - Google Patents

Method of polishing semiconductor wafer Download PDF

Info

Publication number
EP0403287A3
EP0403287A3 EP19900306519 EP90306519A EP0403287A3 EP 0403287 A3 EP0403287 A3 EP 0403287A3 EP 19900306519 EP19900306519 EP 19900306519 EP 90306519 A EP90306519 A EP 90306519A EP 0403287 A3 EP0403287 A3 EP 0403287A3
Authority
EP
European Patent Office
Prior art keywords
semiconductor wafer
thickness
polishing semiconductor
plate
regulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19900306519
Other languages
German (de)
French (fr)
Other versions
EP0403287A2 (en
EP0403287B1 (en
Inventor
Yasuaki Nakazato
Hiroo Ogawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of EP0403287A2 publication Critical patent/EP0403287A2/en
Publication of EP0403287A3 publication Critical patent/EP0403287A3/en
Application granted granted Critical
Publication of EP0403287B1 publication Critical patent/EP0403287B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A semiconductor wafer (12) is ground or polished to a desired thickness by pressing the wafer against a rotating turntable (13), characterised in that the semiconductor wafer is bonded to a plate (11), and a thickness-regulating member (15) whose surface is more resistant to polishing/grinding than the semiconductor wafer is arranged on the plate.
By way of example, the thickness-regulating member comprises a silicon matrix and has a silicon oxide film at the surface.
EP90306519A 1989-06-16 1990-06-14 Method of polishing semiconductor wafer Expired - Lifetime EP0403287B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP153748/89 1989-06-16
JP1153748A JPH0319336A (en) 1989-06-16 1989-06-16 Polishing of semiconductor wafer

Publications (3)

Publication Number Publication Date
EP0403287A2 EP0403287A2 (en) 1990-12-19
EP0403287A3 true EP0403287A3 (en) 1991-10-23
EP0403287B1 EP0403287B1 (en) 1994-10-05

Family

ID=15569254

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90306519A Expired - Lifetime EP0403287B1 (en) 1989-06-16 1990-06-14 Method of polishing semiconductor wafer

Country Status (3)

Country Link
EP (1) EP0403287B1 (en)
JP (1) JPH0319336A (en)
DE (1) DE69013065T2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366924A (en) * 1992-03-16 1994-11-22 At&T Bell Laboratories Method of manufacturing an integrated circuit including planarizing a wafer
GB2275129B (en) * 1992-05-26 1997-01-08 Toshiba Kk Method for planarizing a layer on a semiconductor wafer
US5445996A (en) * 1992-05-26 1995-08-29 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor device having a amorphous layer
JP2778659B2 (en) 1993-12-24 1998-07-23 キヤノン株式会社 Light guide, illumination device, and image reading device
JP3983887B2 (en) * 1998-04-09 2007-09-26 沖電気工業株式会社 Substrate polishing jig and semiconductor wafer polishing method
CN105199610B (en) * 2015-10-16 2017-12-19 郑州磨料磨具磨削研究所有限公司 A kind of sapphire polishing composition and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2979868A (en) * 1957-11-29 1961-04-18 Siemens Ag Lapping device for semiconductor wafers
US3559346A (en) * 1969-02-04 1971-02-02 Bell Telephone Labor Inc Wafer polishing apparatus and method
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
FR2521895A1 (en) * 1982-02-23 1983-08-26 Ansermoz Raymond Multiple work holder for lapidary grinding - uses suction to hold work in place with adjustable stops governing finished work thickness
JPS6451268A (en) * 1987-08-19 1989-02-27 Sanyo Electric Co Mechanical polishing method
JPS6471663A (en) * 1987-09-08 1989-03-16 Hitachi Cable Lapping method for gaas wafer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3351687B2 (en) * 1996-08-05 2002-12-03 株式会社東芝 Filter operation device and filter operation method used for noise cancellation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2979868A (en) * 1957-11-29 1961-04-18 Siemens Ag Lapping device for semiconductor wafers
US3559346A (en) * 1969-02-04 1971-02-02 Bell Telephone Labor Inc Wafer polishing apparatus and method
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
FR2521895A1 (en) * 1982-02-23 1983-08-26 Ansermoz Raymond Multiple work holder for lapidary grinding - uses suction to hold work in place with adjustable stops governing finished work thickness
JPS6451268A (en) * 1987-08-19 1989-02-27 Sanyo Electric Co Mechanical polishing method
JPS6471663A (en) * 1987-09-08 1989-03-16 Hitachi Cable Lapping method for gaas wafer

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 13, no. 244 (M-834)(3592) 07 June 1989, & JP-A-01 051 268 (SANYO) 27 February 1989, *
SOVIET INVENTIONS ILLUSTRATED, Sections P/Q, week 8544, 11 December 1985. Derwent Publications Ltd., London GB. *

Also Published As

Publication number Publication date
DE69013065D1 (en) 1994-11-10
EP0403287A2 (en) 1990-12-19
DE69013065T2 (en) 1995-01-26
JPH0319336A (en) 1991-01-28
EP0403287B1 (en) 1994-10-05

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