JPS5511720A - Wafer grinder - Google Patents
Wafer grinderInfo
- Publication number
- JPS5511720A JPS5511720A JP8089178A JP8089178A JPS5511720A JP S5511720 A JPS5511720 A JP S5511720A JP 8089178 A JP8089178 A JP 8089178A JP 8089178 A JP8089178 A JP 8089178A JP S5511720 A JPS5511720 A JP S5511720A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- flowing
- adsorber
- semiconductor wafer
- prevented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To prevent a generation of surface scratch and internal strain of the semiconductor wafer, with a cooling water, including chips, prevented from flowing on the wafer surfaces, by means of holding the wafer through an adsorber in a position higher than the table level. CONSTITUTION:To a table 1 of the grinder is fixed an adsorber 7 by a bolt 8, and a semiconductor wafer 4 is held by the adsorber plate 7 in the method of vacuum suction through a suction hole 2, and placed in a position higher than a surface level of the table 1. The wafer 4 is ground by a rotary edge 5 having a cooling water feeding nozzle 6. The cooling liquid, including chips, not flowing on the semiconductor wafer 4 but flowing in the table 1, a generation of surface scratch and internal strain in the wafer is prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8089178A JPS5511720A (en) | 1978-07-05 | 1978-07-05 | Wafer grinder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8089178A JPS5511720A (en) | 1978-07-05 | 1978-07-05 | Wafer grinder |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13404485A Division JPS6119553A (en) | 1985-06-21 | 1985-06-21 | Method of grinding wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5511720A true JPS5511720A (en) | 1980-01-26 |
Family
ID=13730969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8089178A Pending JPS5511720A (en) | 1978-07-05 | 1978-07-05 | Wafer grinder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5511720A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61249258A (en) * | 1985-04-26 | 1986-11-06 | Shibayama Kikai Kk | Fremoving method for semiconductor silicon wafer in automatic surface grinder |
-
1978
- 1978-07-05 JP JP8089178A patent/JPS5511720A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61249258A (en) * | 1985-04-26 | 1986-11-06 | Shibayama Kikai Kk | Fremoving method for semiconductor silicon wafer in automatic surface grinder |
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