JPS5511720A - Wafer grinder - Google Patents

Wafer grinder

Info

Publication number
JPS5511720A
JPS5511720A JP8089178A JP8089178A JPS5511720A JP S5511720 A JPS5511720 A JP S5511720A JP 8089178 A JP8089178 A JP 8089178A JP 8089178 A JP8089178 A JP 8089178A JP S5511720 A JPS5511720 A JP S5511720A
Authority
JP
Japan
Prior art keywords
wafer
flowing
adsorber
semiconductor wafer
prevented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8089178A
Other languages
Japanese (ja)
Inventor
Toshio Tsuboya
Yasushi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8089178A priority Critical patent/JPS5511720A/en
Publication of JPS5511720A publication Critical patent/JPS5511720A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To prevent a generation of surface scratch and internal strain of the semiconductor wafer, with a cooling water, including chips, prevented from flowing on the wafer surfaces, by means of holding the wafer through an adsorber in a position higher than the table level. CONSTITUTION:To a table 1 of the grinder is fixed an adsorber 7 by a bolt 8, and a semiconductor wafer 4 is held by the adsorber plate 7 in the method of vacuum suction through a suction hole 2, and placed in a position higher than a surface level of the table 1. The wafer 4 is ground by a rotary edge 5 having a cooling water feeding nozzle 6. The cooling liquid, including chips, not flowing on the semiconductor wafer 4 but flowing in the table 1, a generation of surface scratch and internal strain in the wafer is prevented.
JP8089178A 1978-07-05 1978-07-05 Wafer grinder Pending JPS5511720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8089178A JPS5511720A (en) 1978-07-05 1978-07-05 Wafer grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8089178A JPS5511720A (en) 1978-07-05 1978-07-05 Wafer grinder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13404485A Division JPS6119553A (en) 1985-06-21 1985-06-21 Method of grinding wafer

Publications (1)

Publication Number Publication Date
JPS5511720A true JPS5511720A (en) 1980-01-26

Family

ID=13730969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8089178A Pending JPS5511720A (en) 1978-07-05 1978-07-05 Wafer grinder

Country Status (1)

Country Link
JP (1) JPS5511720A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61249258A (en) * 1985-04-26 1986-11-06 Shibayama Kikai Kk Fremoving method for semiconductor silicon wafer in automatic surface grinder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61249258A (en) * 1985-04-26 1986-11-06 Shibayama Kikai Kk Fremoving method for semiconductor silicon wafer in automatic surface grinder

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