JPS54159170A - Tool for wafer processing - Google Patents

Tool for wafer processing

Info

Publication number
JPS54159170A
JPS54159170A JP6778278A JP6778278A JPS54159170A JP S54159170 A JPS54159170 A JP S54159170A JP 6778278 A JP6778278 A JP 6778278A JP 6778278 A JP6778278 A JP 6778278A JP S54159170 A JPS54159170 A JP S54159170A
Authority
JP
Japan
Prior art keywords
tool
hole
grooves
substrate
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6778278A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Tetsuya Takagaki
Hisao Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6778278A priority Critical patent/JPS54159170A/en
Publication of JPS54159170A publication Critical patent/JPS54159170A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To establish the tool in common use with heat treatment and other treatments, by forming through-hole and grooves at the cylindrical wall of semiconductor crystal or its oxide.
CONSTITUTION: The hollow cylinder of semiconductor single crystal, polycrystal or oxide crystal as material is divided into three equally, and the rectangular hole 5 is made at the center of the arc plate 1. The width of the hole 5 is made greater than the bottom plane 3 of the external circumference 2 at the both ends of the hole. The substrate containing grooves 6 are placed on the inner circumference surface in a given distance. The depth of the grooves is taken slightly broader than the thickness of substrate and the opening gas the taper 8. By taking the one side surface A of the tool as reference, the tool is provided at a given pitch, and one of them is made for dummy substrate. The tool of construction like this is possible for accurate machining, the center of weight is stable, and it can be commonly used heat treatment or the like by commonly using suitable carrying tool, and it is suited to the automatization of processing.
COPYRIGHT: (C)1979,JPO&Japio
JP6778278A 1978-06-07 1978-06-07 Tool for wafer processing Pending JPS54159170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6778278A JPS54159170A (en) 1978-06-07 1978-06-07 Tool for wafer processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6778278A JPS54159170A (en) 1978-06-07 1978-06-07 Tool for wafer processing

Publications (1)

Publication Number Publication Date
JPS54159170A true JPS54159170A (en) 1979-12-15

Family

ID=13354864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6778278A Pending JPS54159170A (en) 1978-06-07 1978-06-07 Tool for wafer processing

Country Status (1)

Country Link
JP (1) JPS54159170A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123339U (en) * 1983-02-08 1984-08-20 ホ−ヤ株式会社 board storage box
JPS6078137U (en) * 1983-11-02 1985-05-31 信越石英株式会社 Wafer transfer device
JPH0437027A (en) * 1990-06-01 1992-02-07 Toshiba Ceramics Co Ltd Wafer retaining boat

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123339U (en) * 1983-02-08 1984-08-20 ホ−ヤ株式会社 board storage box
JPS6314462Y2 (en) * 1983-02-08 1988-04-22
JPS6078137U (en) * 1983-11-02 1985-05-31 信越石英株式会社 Wafer transfer device
JPH0142340Y2 (en) * 1983-11-02 1989-12-12
JPH0437027A (en) * 1990-06-01 1992-02-07 Toshiba Ceramics Co Ltd Wafer retaining boat

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