JPS6078137U - Wafer transfer device - Google Patents

Wafer transfer device

Info

Publication number
JPS6078137U
JPS6078137U JP17080883U JP17080883U JPS6078137U JP S6078137 U JPS6078137 U JP S6078137U JP 17080883 U JP17080883 U JP 17080883U JP 17080883 U JP17080883 U JP 17080883U JP S6078137 U JPS6078137 U JP S6078137U
Authority
JP
Japan
Prior art keywords
holding jig
transfer device
wafer transfer
arm
transfer arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17080883U
Other languages
Japanese (ja)
Other versions
JPH0142340Y2 (en
Inventor
俊幸 加藤
博至 木村
Original Assignee
信越石英株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越石英株式会社 filed Critical 信越石英株式会社
Priority to JP17080883U priority Critical patent/JPS6078137U/en
Publication of JPS6078137U publication Critical patent/JPS6078137U/en
Application granted granted Critical
Publication of JPH0142340Y2 publication Critical patent/JPH0142340Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例を示す全体の側面図、第2図は第1図に
示される保持用治具と搬送アームとの係合状態を示す横
断面図、第3図〜第8図は本考案の実施例を示すもので
、第3図は全体の側面図、第4図は要部の斜視図、第5
図、第9図および第10図は保持用治具と搬送アームと
の係合状態を示す横断面図、第6図〜第8図は搬送アー
ムの他の実施例を示す斜視図である。 図面中、11・・・保持用治具、13・・・被係合部、
14.21,23,25・・・搬送アーム、15・・・
切欠、16.22. 24.26・・・係合部、17・
・・熱処理室、18・・・アーム駆動部。
Fig. 1 is an overall side view showing the conventional example, Fig. 2 is a cross-sectional view showing the engagement state of the holding jig and the transfer arm shown in Fig. 1, and Figs. 3 to 8 are the main parts. Fig. 3 shows an overall side view, Fig. 4 is a perspective view of the main parts, and Fig. 5 shows an embodiment of the invention.
9 and 10 are cross-sectional views showing the engaged state of the holding jig and the transfer arm, and FIGS. 6 to 8 are perspective views showing other embodiments of the transfer arm. In the drawings, 11... Holding jig, 13... Engaged portion,
14.21, 23, 25...transport arm, 15...
Notch, 16.22. 24.26...Engagement part, 17.
...Heat treatment chamber, 18...Arm drive section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数のウェーハを保持する保持用治具と、この保持用治
具を支持する搬送アームと、この搬送アームを適宜駆動
することにより前記保持用治具を熱処理室に搬入し、か
つ搬出するアーム駆動部とを備えたウェーハ搬送装置に
おいて、前記保持用治具の両側には被係合部がそれぞれ
外方に向って形成され、かつ前記搬送アームは下部に長
手方向の切欠が設けられていると共に両側内方に前記保
持用治具の被係合部に係合可能な構成としたことを特徴
とするウェーハ搬送装置。
A holding jig that holds a plurality of wafers, a transfer arm that supports the holding jig, and an arm drive that carries the holding jig into and out of the heat treatment chamber by appropriately driving the transfer arm. In the wafer transfer device, engaged portions are formed on both sides of the holding jig, each facing outward, and the transfer arm is provided with a longitudinal notch at the bottom thereof, and A wafer transfer device characterized in that the wafer transfer device is configured to be capable of engaging with the engaged portions of the holding jig inwardly on both sides.
JP17080883U 1983-11-02 1983-11-02 Wafer transfer device Granted JPS6078137U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17080883U JPS6078137U (en) 1983-11-02 1983-11-02 Wafer transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17080883U JPS6078137U (en) 1983-11-02 1983-11-02 Wafer transfer device

Publications (2)

Publication Number Publication Date
JPS6078137U true JPS6078137U (en) 1985-05-31
JPH0142340Y2 JPH0142340Y2 (en) 1989-12-12

Family

ID=30372780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17080883U Granted JPS6078137U (en) 1983-11-02 1983-11-02 Wafer transfer device

Country Status (1)

Country Link
JP (1) JPS6078137U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024236U (en) * 1989-06-12 1990-01-11

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS54159170A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Tool for wafer processing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS54159170A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Tool for wafer processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024236U (en) * 1989-06-12 1990-01-11

Also Published As

Publication number Publication date
JPH0142340Y2 (en) 1989-12-12

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