JPS6031964U - Weight structure for wafer polishing equipment - Google Patents
Weight structure for wafer polishing equipmentInfo
- Publication number
- JPS6031964U JPS6031964U JP1983124712U JP12471283U JPS6031964U JP S6031964 U JPS6031964 U JP S6031964U JP 1983124712 U JP1983124712 U JP 1983124712U JP 12471283 U JP12471283 U JP 12471283U JP S6031964 U JPS6031964 U JP S6031964U
- Authority
- JP
- Japan
- Prior art keywords
- wafer polishing
- weight structure
- polishing equipment
- divided
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はポリッシング装置斜視図、第2図および第3図
は本考案によるポリッシング第1図装置重り構造の実施
例を示す斜視図である。FIG. 1 is a perspective view of a polishing device, and FIGS. 2 and 3 are perspective views showing an embodiment of the weight structure of the polishing device shown in FIG. 1 according to the present invention.
Claims (1)
孔を通って二分割され、かつ二分割された各部分が互い
に係脱し得る如く、一方の分割部分には係合部が形成さ
れ、他方の分割部分には前記係合部と係脱可能な被係合
部が形成されていることを特徴とするウェハーポリッシ
ング装置重り構造。 、(2)前記保合部は蟻状に形成され、かつ前記被係合
部は蟻溝状に形成されてなる実用新案登録請求の範囲第
(1)項に記載のウェハーポリッシング装置用重り構造
。(1) A mounting hole is formed in the center, and an engaging part is formed in one of the divided parts so that it is divided into two parts through this mounting hole, and the two parts can be engaged and disengaged from each other. . A weight structure for a wafer polishing apparatus, wherein the other divided portion is formed with an engaged portion that is removable from the engaging portion. (2) The weight structure for a wafer polishing apparatus according to claim (1), wherein the retaining portion is formed in a dovetail shape, and the engaged portion is formed in a dovetail groove shape. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983124712U JPS6031964U (en) | 1983-08-11 | 1983-08-11 | Weight structure for wafer polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983124712U JPS6031964U (en) | 1983-08-11 | 1983-08-11 | Weight structure for wafer polishing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6031964U true JPS6031964U (en) | 1985-03-04 |
Family
ID=30284189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983124712U Pending JPS6031964U (en) | 1983-08-11 | 1983-08-11 | Weight structure for wafer polishing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6031964U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006055921A (en) * | 2004-08-18 | 2006-03-02 | Koushin Special Glass Co Ltd | Polishing tool |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5553324U (en) * | 1978-10-06 | 1980-04-10 | ||
JPH031426U (en) * | 1989-05-23 | 1991-01-09 |
-
1983
- 1983-08-11 JP JP1983124712U patent/JPS6031964U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5553324U (en) * | 1978-10-06 | 1980-04-10 | ||
JPH031426U (en) * | 1989-05-23 | 1991-01-09 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006055921A (en) * | 2004-08-18 | 2006-03-02 | Koushin Special Glass Co Ltd | Polishing tool |
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