JPS5433676A - Wafer processing unit - Google Patents

Wafer processing unit

Info

Publication number
JPS5433676A
JPS5433676A JP9959077A JP9959077A JPS5433676A JP S5433676 A JPS5433676 A JP S5433676A JP 9959077 A JP9959077 A JP 9959077A JP 9959077 A JP9959077 A JP 9959077A JP S5433676 A JPS5433676 A JP S5433676A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
wafer
processing unit
placing
bottom
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9959077A
Inventor
Akihiko Sato
Masao Tsugi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To make uniform the effect of processing, by placing the rotary roller at the bottom of the processing vessel including etching solution, placing the wafer tool of box shape having opening at the bottom and the wafer containing grooves longitudinally equal distance on the inner wall, and by turning the wafer projected in the roller.
COPYRIGHT: (C)1979,JPO&Japio
JP9959077A 1977-08-22 1977-08-22 Wafer processing unit Pending JPS5433676A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9959077A JPS5433676A (en) 1977-08-22 1977-08-22 Wafer processing unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9959077A JPS5433676A (en) 1977-08-22 1977-08-22 Wafer processing unit

Publications (1)

Publication Number Publication Date
JPS5433676A true true JPS5433676A (en) 1979-03-12

Family

ID=14251300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9959077A Pending JPS5433676A (en) 1977-08-22 1977-08-22 Wafer processing unit

Country Status (1)

Country Link
JP (1) JPS5433676A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5667752U (en) * 1979-10-27 1981-06-05
JPS5758435U (en) * 1980-09-19 1982-04-06
JPS6052624U (en) * 1983-09-16 1985-04-13
JPS631328U (en) * 1986-06-23 1988-01-07
US4897369A (en) * 1987-06-29 1990-01-30 SGS-Thompson Microelectronics S.p.A. Method for shaping the edges of slices of semiconductor material
JPH04151837A (en) * 1990-10-16 1992-05-25 Shin Etsu Handotai Co Ltd Etching equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5667752U (en) * 1979-10-27 1981-06-05
JPS5758435U (en) * 1980-09-19 1982-04-06
JPS6327784Y2 (en) * 1980-09-19 1988-07-27
JPS6052624U (en) * 1983-09-16 1985-04-13
JPS631328U (en) * 1986-06-23 1988-01-07
US4897369A (en) * 1987-06-29 1990-01-30 SGS-Thompson Microelectronics S.p.A. Method for shaping the edges of slices of semiconductor material
JPH04151837A (en) * 1990-10-16 1992-05-25 Shin Etsu Handotai Co Ltd Etching equipment

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