JPS5533090A - Etching method - Google Patents
Etching methodInfo
- Publication number
- JPS5533090A JPS5533090A JP9238579A JP9238579A JPS5533090A JP S5533090 A JPS5533090 A JP S5533090A JP 9238579 A JP9238579 A JP 9238579A JP 9238579 A JP9238579 A JP 9238579A JP S5533090 A JPS5533090 A JP S5533090A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etching
- etching speed
- auxiliary
- speed distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE: To uniformly correct the etching speed distribution in a substrate by disposing an auxiliary substrate of the same material and similar thickness as the etching substrate adjacent thereto.
CONSTITUTION: An auxiliary substrate 27 is disposed adjacent to a substrate 26 on a specimen base 25 to thereby remarkably reduce the irregularity of the electric field distribution over the substrate 27 and reduce it considerably over the substrate 26. Accordingly, it can readily improve the uniformity of the etching speed distribution in the substrate 26.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9238579A JPS5533090A (en) | 1979-07-19 | 1979-07-19 | Etching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9238579A JPS5533090A (en) | 1979-07-19 | 1979-07-19 | Etching method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5533090A true JPS5533090A (en) | 1980-03-08 |
Family
ID=14052949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9238579A Pending JPS5533090A (en) | 1979-07-19 | 1979-07-19 | Etching method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5533090A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60201632A (en) * | 1984-03-27 | 1985-10-12 | Anelva Corp | Dry etching apparatus |
JPH01124218A (en) * | 1987-11-09 | 1989-05-17 | Fujitsu Ltd | Dry etching |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
-
1979
- 1979-07-19 JP JP9238579A patent/JPS5533090A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60201632A (en) * | 1984-03-27 | 1985-10-12 | Anelva Corp | Dry etching apparatus |
JPH0523053B2 (en) * | 1984-03-27 | 1993-03-31 | Anelva Corp | |
JPH01124218A (en) * | 1987-11-09 | 1989-05-17 | Fujitsu Ltd | Dry etching |
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