JPS5533090A - Etching method - Google Patents

Etching method

Info

Publication number
JPS5533090A
JPS5533090A JP9238579A JP9238579A JPS5533090A JP S5533090 A JPS5533090 A JP S5533090A JP 9238579 A JP9238579 A JP 9238579A JP 9238579 A JP9238579 A JP 9238579A JP S5533090 A JPS5533090 A JP S5533090A
Authority
JP
Japan
Prior art keywords
substrate
etching
etching speed
auxiliary
speed distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9238579A
Other languages
Japanese (ja)
Inventor
Katsuzo Ukai
Kunio Hanazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP9238579A priority Critical patent/JPS5533090A/en
Publication of JPS5533090A publication Critical patent/JPS5533090A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To uniformly correct the etching speed distribution in a substrate by disposing an auxiliary substrate of the same material and similar thickness as the etching substrate adjacent thereto.
CONSTITUTION: An auxiliary substrate 27 is disposed adjacent to a substrate 26 on a specimen base 25 to thereby remarkably reduce the irregularity of the electric field distribution over the substrate 27 and reduce it considerably over the substrate 26. Accordingly, it can readily improve the uniformity of the etching speed distribution in the substrate 26.
COPYRIGHT: (C)1980,JPO&Japio
JP9238579A 1979-07-19 1979-07-19 Etching method Pending JPS5533090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9238579A JPS5533090A (en) 1979-07-19 1979-07-19 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9238579A JPS5533090A (en) 1979-07-19 1979-07-19 Etching method

Publications (1)

Publication Number Publication Date
JPS5533090A true JPS5533090A (en) 1980-03-08

Family

ID=14052949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9238579A Pending JPS5533090A (en) 1979-07-19 1979-07-19 Etching method

Country Status (1)

Country Link
JP (1) JPS5533090A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201632A (en) * 1984-03-27 1985-10-12 Anelva Corp Dry etching apparatus
JPH01124218A (en) * 1987-11-09 1989-05-17 Fujitsu Ltd Dry etching

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474021A (en) * 1966-01-12 1969-10-21 Ibm Method of forming openings using sequential sputtering and chemical etching

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474021A (en) * 1966-01-12 1969-10-21 Ibm Method of forming openings using sequential sputtering and chemical etching

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201632A (en) * 1984-03-27 1985-10-12 Anelva Corp Dry etching apparatus
JPH0523053B2 (en) * 1984-03-27 1993-03-31 Anelva Corp
JPH01124218A (en) * 1987-11-09 1989-05-17 Fujitsu Ltd Dry etching

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