JPS6419725A - Wet treatment equipment - Google Patents
Wet treatment equipmentInfo
- Publication number
- JPS6419725A JPS6419725A JP17460787A JP17460787A JPS6419725A JP S6419725 A JPS6419725 A JP S6419725A JP 17460787 A JP17460787 A JP 17460787A JP 17460787 A JP17460787 A JP 17460787A JP S6419725 A JPS6419725 A JP S6419725A
- Authority
- JP
- Japan
- Prior art keywords
- treating
- section
- liquid
- developing
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To conduct wet treatment stably, and to remove nonuniformity on wet treatment by spraying a novel liquid against the surface to be treated at all times by a treating-liquid spray equipment. CONSTITUTION:A wet treater is composed of a continuous automatic line system mainly having a developing treating section, an etching treating section (a wafer etching treating section) and a peeling treating section. A developing tank 3 (or 4) for a developing treating section is constituted in such a manner that a substrate holding jig 40 and a vertical movable carriage 41A, etc., for a lifting gear 41 are interposed and the surface of a transparent glass substrate SUB is wet-treated. A treating-liquid spray equipment 3D is organized between an inserting port for the transparent glass substrate SUB in the developing tank 3 and a liquid tank section. The treating-liquid spray equipment 3D is constructed so as to spray a developer against the surface of the transparent glass substrate SUB developed and treated in the liquid tank section for the developing tank 3. A novel liquid is used as the sprayed developer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17460787A JP2601828B2 (en) | 1987-07-15 | 1987-07-15 | Wet processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17460787A JP2601828B2 (en) | 1987-07-15 | 1987-07-15 | Wet processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6419725A true JPS6419725A (en) | 1989-01-23 |
JP2601828B2 JP2601828B2 (en) | 1997-04-16 |
Family
ID=15981541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17460787A Expired - Fee Related JP2601828B2 (en) | 1987-07-15 | 1987-07-15 | Wet processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2601828B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002270488A (en) * | 2001-03-09 | 2002-09-20 | Toshiba Corp | Film-forming system, pattern-forming system and method of manufacturing semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59195646A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Method and device for washing mask for semiconductor element manufacture |
JPS60238191A (en) * | 1984-05-14 | 1985-11-27 | 日本電気株式会社 | Method of washing mask housing cassette for exposure |
-
1987
- 1987-07-15 JP JP17460787A patent/JP2601828B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59195646A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Method and device for washing mask for semiconductor element manufacture |
JPS60238191A (en) * | 1984-05-14 | 1985-11-27 | 日本電気株式会社 | Method of washing mask housing cassette for exposure |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002270488A (en) * | 2001-03-09 | 2002-09-20 | Toshiba Corp | Film-forming system, pattern-forming system and method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2601828B2 (en) | 1997-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |