JPS6419725A - Wet treatment equipment - Google Patents

Wet treatment equipment

Info

Publication number
JPS6419725A
JPS6419725A JP17460787A JP17460787A JPS6419725A JP S6419725 A JPS6419725 A JP S6419725A JP 17460787 A JP17460787 A JP 17460787A JP 17460787 A JP17460787 A JP 17460787A JP S6419725 A JPS6419725 A JP S6419725A
Authority
JP
Japan
Prior art keywords
treating
section
liquid
developing
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17460787A
Other languages
Japanese (ja)
Other versions
JP2601828B2 (en
Inventor
Masateru Wakui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17460787A priority Critical patent/JP2601828B2/en
Publication of JPS6419725A publication Critical patent/JPS6419725A/en
Application granted granted Critical
Publication of JP2601828B2 publication Critical patent/JP2601828B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To conduct wet treatment stably, and to remove nonuniformity on wet treatment by spraying a novel liquid against the surface to be treated at all times by a treating-liquid spray equipment. CONSTITUTION:A wet treater is composed of a continuous automatic line system mainly having a developing treating section, an etching treating section (a wafer etching treating section) and a peeling treating section. A developing tank 3 (or 4) for a developing treating section is constituted in such a manner that a substrate holding jig 40 and a vertical movable carriage 41A, etc., for a lifting gear 41 are interposed and the surface of a transparent glass substrate SUB is wet-treated. A treating-liquid spray equipment 3D is organized between an inserting port for the transparent glass substrate SUB in the developing tank 3 and a liquid tank section. The treating-liquid spray equipment 3D is constructed so as to spray a developer against the surface of the transparent glass substrate SUB developed and treated in the liquid tank section for the developing tank 3. A novel liquid is used as the sprayed developer.
JP17460787A 1987-07-15 1987-07-15 Wet processing equipment Expired - Fee Related JP2601828B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17460787A JP2601828B2 (en) 1987-07-15 1987-07-15 Wet processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17460787A JP2601828B2 (en) 1987-07-15 1987-07-15 Wet processing equipment

Publications (2)

Publication Number Publication Date
JPS6419725A true JPS6419725A (en) 1989-01-23
JP2601828B2 JP2601828B2 (en) 1997-04-16

Family

ID=15981541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17460787A Expired - Fee Related JP2601828B2 (en) 1987-07-15 1987-07-15 Wet processing equipment

Country Status (1)

Country Link
JP (1) JP2601828B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270488A (en) * 2001-03-09 2002-09-20 Toshiba Corp Film-forming system, pattern-forming system and method of manufacturing semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195646A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing mask for semiconductor element manufacture
JPS60238191A (en) * 1984-05-14 1985-11-27 日本電気株式会社 Method of washing mask housing cassette for exposure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195646A (en) * 1983-04-21 1984-11-06 Nec Corp Method and device for washing mask for semiconductor element manufacture
JPS60238191A (en) * 1984-05-14 1985-11-27 日本電気株式会社 Method of washing mask housing cassette for exposure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270488A (en) * 2001-03-09 2002-09-20 Toshiba Corp Film-forming system, pattern-forming system and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JP2601828B2 (en) 1997-04-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees