JPS6417455A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6417455A
JPS6417455A JP62173308A JP17330887A JPS6417455A JP S6417455 A JPS6417455 A JP S6417455A JP 62173308 A JP62173308 A JP 62173308A JP 17330887 A JP17330887 A JP 17330887A JP S6417455 A JPS6417455 A JP S6417455A
Authority
JP
Japan
Prior art keywords
adhesive
grooves
case
plate
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62173308A
Other languages
English (en)
Inventor
Kunitaka Kamishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62173308A priority Critical patent/JPS6417455A/ja
Publication of JPS6417455A publication Critical patent/JPS6417455A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62173308A 1987-07-10 1987-07-10 Semiconductor device Pending JPS6417455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62173308A JPS6417455A (en) 1987-07-10 1987-07-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62173308A JPS6417455A (en) 1987-07-10 1987-07-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6417455A true JPS6417455A (en) 1989-01-20

Family

ID=15958042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62173308A Pending JPS6417455A (en) 1987-07-10 1987-07-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6417455A (ja)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186463A (ja) * 1997-12-22 1999-07-09 Sanyo Electric Co Ltd 混成集積回路装置
JP2006310381A (ja) * 2005-04-26 2006-11-09 Toyota Industries Corp 電子機器
JP2012204366A (ja) * 2011-03-23 2012-10-22 Mitsubishi Electric Corp 半導体装置
JP2014123659A (ja) * 2012-12-21 2014-07-03 Shindengen Electric Mfg Co Ltd 電子機器及びその製造方法
WO2017098593A1 (ja) * 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
JP6399272B1 (ja) * 2017-09-05 2018-10-03 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019015423A (ja) * 2017-07-04 2019-01-31 株式会社荏原製作所 消音装置およびこれを組立てる方法
JP2019015424A (ja) * 2017-07-04 2019-01-31 株式会社荏原製作所 消音ユニットおよびこれを製造する方法
WO2019049400A1 (ja) * 2017-09-05 2019-03-14 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019161146A (ja) * 2018-03-16 2019-09-19 三菱電機株式会社 電力用半導体装置及びその製造方法
JP2020057649A (ja) * 2018-09-28 2020-04-09 株式会社カネカ グラファイト複合体および半導体パッケージ
JP2020174159A (ja) * 2019-04-12 2020-10-22 富士電機株式会社 半導体装置及び半導体装置の製造方法
JPWO2021106114A1 (ja) * 2019-11-27 2021-06-03
JP2021111669A (ja) * 2020-01-08 2021-08-02 三菱電機株式会社 半導体装置および電力変換装置
JP2023048526A (ja) * 2021-09-28 2023-04-07 三菱電機株式会社 半導体装置
WO2024190589A1 (ja) * 2023-03-14 2024-09-19 新電元工業株式会社 半導体モジュール

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186463A (ja) * 1997-12-22 1999-07-09 Sanyo Electric Co Ltd 混成集積回路装置
JP2006310381A (ja) * 2005-04-26 2006-11-09 Toyota Industries Corp 電子機器
JP2012204366A (ja) * 2011-03-23 2012-10-22 Mitsubishi Electric Corp 半導体装置
JP2014123659A (ja) * 2012-12-21 2014-07-03 Shindengen Electric Mfg Co Ltd 電子機器及びその製造方法
WO2017098593A1 (ja) * 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
JP2019015423A (ja) * 2017-07-04 2019-01-31 株式会社荏原製作所 消音装置およびこれを組立てる方法
JP2019015424A (ja) * 2017-07-04 2019-01-31 株式会社荏原製作所 消音ユニットおよびこれを製造する方法
JP6399272B1 (ja) * 2017-09-05 2018-10-03 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
WO2019049400A1 (ja) * 2017-09-05 2019-03-14 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019161146A (ja) * 2018-03-16 2019-09-19 三菱電機株式会社 電力用半導体装置及びその製造方法
JP2020057649A (ja) * 2018-09-28 2020-04-09 株式会社カネカ グラファイト複合体および半導体パッケージ
JP2020174159A (ja) * 2019-04-12 2020-10-22 富士電機株式会社 半導体装置及び半導体装置の製造方法
JPWO2021106114A1 (ja) * 2019-11-27 2021-06-03
WO2021106114A1 (ja) * 2019-11-27 2021-06-03 三菱電機株式会社 半導体モジュール
CN114730745A (zh) * 2019-11-27 2022-07-08 三菱电机株式会社 半导体模块
US12131969B2 (en) 2019-11-27 2024-10-29 Mitsubishi Electric Corporation Semiconductor module
CN114730745B (zh) * 2019-11-27 2025-09-05 三菱电机株式会社 半导体模块
JP2021111669A (ja) * 2020-01-08 2021-08-02 三菱電機株式会社 半導体装置および電力変換装置
JP2023048526A (ja) * 2021-09-28 2023-04-07 三菱電機株式会社 半導体装置
WO2024190589A1 (ja) * 2023-03-14 2024-09-19 新電元工業株式会社 半導体モジュール

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