JPS641056B2 - - Google Patents
Info
- Publication number
- JPS641056B2 JPS641056B2 JP13493182A JP13493182A JPS641056B2 JP S641056 B2 JPS641056 B2 JP S641056B2 JP 13493182 A JP13493182 A JP 13493182A JP 13493182 A JP13493182 A JP 13493182A JP S641056 B2 JPS641056 B2 JP S641056B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- aluminum electrode
- wiring layer
- electrode wiring
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 39
- 229910052782 aluminium Inorganic materials 0.000 description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 22
- 239000011229 interlayer Substances 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 8
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13493182A JPS5925246A (ja) | 1982-08-02 | 1982-08-02 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13493182A JPS5925246A (ja) | 1982-08-02 | 1982-08-02 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5925246A JPS5925246A (ja) | 1984-02-09 |
| JPS641056B2 true JPS641056B2 (enrdf_load_stackoverflow) | 1989-01-10 |
Family
ID=15139898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13493182A Granted JPS5925246A (ja) | 1982-08-02 | 1982-08-02 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5925246A (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53107285A (en) * | 1977-03-02 | 1978-09-19 | Hitachi Ltd | Production of wiring structural body |
| JPS55138856A (en) * | 1979-04-18 | 1980-10-30 | Oki Electric Ind Co Ltd | Method of fabricating semiconductor device |
| IT1153991B (it) * | 1980-10-29 | 1987-01-21 | Rca Corp | Metodo per creare una struttura a metallizzazione dielettrico |
-
1982
- 1982-08-02 JP JP13493182A patent/JPS5925246A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5925246A (ja) | 1984-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5266519A (en) | Method for forming a metal conductor in semiconductor device | |
| US4816895A (en) | Integrated circuit device with an improved interconnection line | |
| JPS5968953A (ja) | モノリシツク集積回路の製造方法 | |
| KR900007757B1 (ko) | 반도체장치 및 그 제조방법 | |
| JPS641056B2 (enrdf_load_stackoverflow) | ||
| JPS5910064B2 (ja) | 多層配線構造の製造方法 | |
| JPH10209276A (ja) | 配線形成方法 | |
| JPS61242039A (ja) | 半導体装置 | |
| JPH04127454A (ja) | 半導体装置 | |
| JPH077765B2 (ja) | 半導体装置の製造方法 | |
| KR100240268B1 (ko) | 반도체 장치의 알루미늄 합금 배선 형성방법 | |
| KR100303796B1 (ko) | 반도체장치의금속배선형성방법 | |
| JPS63164344A (ja) | 半導体装置 | |
| JPH04196251A (ja) | 半導体装置 | |
| JPH03171758A (ja) | 半導体装置及びその製造方法 | |
| JPS61203654A (ja) | 半導体装置及びその製造方法 | |
| JPS58110055A (ja) | 半導体装置 | |
| KR0173178B1 (ko) | 반도체 금속막 식각공정 | |
| JP2998719B2 (ja) | 半導体装置 | |
| JPH0618239B2 (ja) | 半導体装置 | |
| KR910000807Y1 (ko) | 반도체소자의 다층배선구조 | |
| JPS6146051A (ja) | 配線方法 | |
| JPH0383340A (ja) | 半導体素子のAl多層配線構造 | |
| JPH06177255A (ja) | 半導体集積回路装置の製造方法 | |
| JPH0691079B2 (ja) | 半導体装置の製造方法 |