JPS6393897A - めつき液噴射式めつき処理装置 - Google Patents

めつき液噴射式めつき処理装置

Info

Publication number
JPS6393897A
JPS6393897A JP23682586A JP23682586A JPS6393897A JP S6393897 A JPS6393897 A JP S6393897A JP 23682586 A JP23682586 A JP 23682586A JP 23682586 A JP23682586 A JP 23682586A JP S6393897 A JPS6393897 A JP S6393897A
Authority
JP
Japan
Prior art keywords
plating
plating solution
plating liquid
cell
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23682586A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459400B2 (enrdf_load_stackoverflow
Inventor
Atsuhiko Sato
敦彦 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP23682586A priority Critical patent/JPS6393897A/ja
Publication of JPS6393897A publication Critical patent/JPS6393897A/ja
Publication of JPH0459400B2 publication Critical patent/JPH0459400B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP23682586A 1986-10-03 1986-10-03 めつき液噴射式めつき処理装置 Granted JPS6393897A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23682586A JPS6393897A (ja) 1986-10-03 1986-10-03 めつき液噴射式めつき処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23682586A JPS6393897A (ja) 1986-10-03 1986-10-03 めつき液噴射式めつき処理装置

Publications (2)

Publication Number Publication Date
JPS6393897A true JPS6393897A (ja) 1988-04-25
JPH0459400B2 JPH0459400B2 (enrdf_load_stackoverflow) 1992-09-22

Family

ID=17006339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23682586A Granted JPS6393897A (ja) 1986-10-03 1986-10-03 めつき液噴射式めつき処理装置

Country Status (1)

Country Link
JP (1) JPS6393897A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019049046A (ja) * 2017-07-27 2019-03-28 セムシスコ ゲーエムベーハーSemsysco GmbH 化学および電解の少なくとも一方の表面処理のための分布システム
JP2019056174A (ja) * 2017-07-27 2019-04-11 セムシスコ ゲーエムベーハーSemsysco GmbH 化学および電解の少なくとも一方の表面処理のための分布システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52111844A (en) * 1976-03-17 1977-09-19 Toyo Giken Kougiyou Kk Method of circulating liquid in surface treating means
JPS6026693A (ja) * 1983-07-25 1985-02-09 C Uyemura & Co Ltd 高速電解装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52111844A (en) * 1976-03-17 1977-09-19 Toyo Giken Kougiyou Kk Method of circulating liquid in surface treating means
JPS6026693A (ja) * 1983-07-25 1985-02-09 C Uyemura & Co Ltd 高速電解装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019049046A (ja) * 2017-07-27 2019-03-28 セムシスコ ゲーエムベーハーSemsysco GmbH 化学および電解の少なくとも一方の表面処理のための分布システム
JP2019056174A (ja) * 2017-07-27 2019-04-11 セムシスコ ゲーエムベーハーSemsysco GmbH 化学および電解の少なくとも一方の表面処理のための分布システム
US11105014B2 (en) 2017-07-27 2021-08-31 Semsysco Gmbh Distribution system for chemical and/or electrolytic surface treatment

Also Published As

Publication number Publication date
JPH0459400B2 (enrdf_load_stackoverflow) 1992-09-22

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