JPS638136Y2 - - Google Patents

Info

Publication number
JPS638136Y2
JPS638136Y2 JP1981093958U JP9395881U JPS638136Y2 JP S638136 Y2 JPS638136 Y2 JP S638136Y2 JP 1981093958 U JP1981093958 U JP 1981093958U JP 9395881 U JP9395881 U JP 9395881U JP S638136 Y2 JPS638136 Y2 JP S638136Y2
Authority
JP
Japan
Prior art keywords
chip
alloy
ground
metal
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981093958U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58429U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981093958U priority Critical patent/JPS58429U/ja
Publication of JPS58429U publication Critical patent/JPS58429U/ja
Application granted granted Critical
Publication of JPS638136Y2 publication Critical patent/JPS638136Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP1981093958U 1981-06-25 1981-06-25 半導体装置 Granted JPS58429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981093958U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981093958U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS58429U JPS58429U (ja) 1983-01-05
JPS638136Y2 true JPS638136Y2 (enFirst) 1988-03-10

Family

ID=29888914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981093958U Granted JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS58429U (enFirst)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS58429U (ja) 1983-01-05

Similar Documents

Publication Publication Date Title
US5550407A (en) Semiconductor device having an aluminum alloy wiring line
JPS638136Y2 (enFirst)
JPS62281435A (ja) 半導体装置
JPS6232622B2 (enFirst)
JP2891427B2 (ja) 半導体素子のＡｌ電極パッド構造
JPS62287657A (ja) 半導体装置
JPS5815252A (ja) バンプ構造
JPS6482644A (en) Semiconductor device
JPH0717976B2 (ja) 半導体装置
JPS6244817B2 (enFirst)
JPS6312385B2 (enFirst)
JPH0333068Y2 (enFirst)
JPH0455531B2 (enFirst)
JP2721259B2 (ja) ワイヤボンディング方法及びそれに使用する銅系リードフレーム
JPS6244545Y2 (enFirst)
JPS62105457A (ja) 半導体装置
JPH0565051B2 (enFirst)
JP3540249B2 (ja) 半導体デバイスパッケージの外部リードを外部電極に接続する方法
JPH0685147A (ja) 電子機器およびその製造方法
JP2530360B2 (ja) 半導体素子用ヒ―トシンク材料
JPH04171858A (ja) 半導体装置
JPS61278158A (ja) 半導体装置用リ−ドフレ−ム
JPS57155737A (en) Package structure of semiconductor element
JPH0565052B2 (enFirst)
JPH03169057A (ja) 半導体装置