JPS6232622B2 - - Google Patents

Info

Publication number
JPS6232622B2
JPS6232622B2 JP58052102A JP5210283A JPS6232622B2 JP S6232622 B2 JPS6232622 B2 JP S6232622B2 JP 58052102 A JP58052102 A JP 58052102A JP 5210283 A JP5210283 A JP 5210283A JP S6232622 B2 JPS6232622 B2 JP S6232622B2
Authority
JP
Japan
Prior art keywords
coating
lead frame
layer
present
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58052102A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58175852A (ja
Inventor
Tomoaki Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58052102A priority Critical patent/JPS58175852A/ja
Publication of JPS58175852A publication Critical patent/JPS58175852A/ja
Publication of JPS6232622B2 publication Critical patent/JPS6232622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58052102A 1983-03-28 1983-03-28 半導体装置 Granted JPS58175852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58052102A JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58052102A JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49114645A Division JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Publications (2)

Publication Number Publication Date
JPS58175852A JPS58175852A (ja) 1983-10-15
JPS6232622B2 true JPS6232622B2 (enFirst) 1987-07-15

Family

ID=12905482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58052102A Granted JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS58175852A (enFirst)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437127U (enFirst) * 1987-08-28 1989-03-06
JPS6437126U (enFirst) * 1987-08-28 1989-03-06
US6983551B2 (en) 2000-08-23 2006-01-10 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US7332376B2 (en) 2000-08-28 2008-02-19 Micron Technology, Inc. Method of encapsulating packaged microelectronic devices with a barrier

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0612796B2 (ja) * 1984-06-04 1994-02-16 株式会社日立製作所 半導体装置
JPH0210761A (ja) * 1988-06-28 1990-01-16 Mitsui High Tec Inc リードフレーム及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437127U (enFirst) * 1987-08-28 1989-03-06
JPS6437126U (enFirst) * 1987-08-28 1989-03-06
US6983551B2 (en) 2000-08-23 2006-01-10 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US7332376B2 (en) 2000-08-28 2008-02-19 Micron Technology, Inc. Method of encapsulating packaged microelectronic devices with a barrier

Also Published As

Publication number Publication date
JPS58175852A (ja) 1983-10-15

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