JPS58429U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58429U
JPS58429U JP1981093958U JP9395881U JPS58429U JP S58429 U JPS58429 U JP S58429U JP 1981093958 U JP1981093958 U JP 1981093958U JP 9395881 U JP9395881 U JP 9395881U JP S58429 U JPS58429 U JP S58429U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
tin
alloy
ground chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981093958U
Other languages
English (en)
Japanese (ja)
Other versions
JPS638136Y2 (enFirst
Inventor
田中　俊範
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981093958U priority Critical patent/JPS58429U/ja
Publication of JPS58429U publication Critical patent/JPS58429U/ja
Application granted granted Critical
Publication of JPS638136Y2 publication Critical patent/JPS638136Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP1981093958U 1981-06-25 1981-06-25 半導体装置 Granted JPS58429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981093958U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981093958U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS58429U true JPS58429U (ja) 1983-01-05
JPS638136Y2 JPS638136Y2 (enFirst) 1988-03-10

Family

ID=29888914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981093958U Granted JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS58429U (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS638136Y2 (enFirst) 1988-03-10

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