JPS637029B2 - - Google Patents
Info
- Publication number
- JPS637029B2 JPS637029B2 JP57153687A JP15368782A JPS637029B2 JP S637029 B2 JPS637029 B2 JP S637029B2 JP 57153687 A JP57153687 A JP 57153687A JP 15368782 A JP15368782 A JP 15368782A JP S637029 B2 JPS637029 B2 JP S637029B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- glass
- diode
- diameter part
- large diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 15
- 238000007789 sealing Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000005394 sealing glass Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15368782A JPS5943558A (ja) | 1982-09-02 | 1982-09-02 | ダイオ−ド電極部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15368782A JPS5943558A (ja) | 1982-09-02 | 1982-09-02 | ダイオ−ド電極部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5943558A JPS5943558A (ja) | 1984-03-10 |
| JPS637029B2 true JPS637029B2 (sv) | 1988-02-15 |
Family
ID=15567947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15368782A Granted JPS5943558A (ja) | 1982-09-02 | 1982-09-02 | ダイオ−ド電極部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5943558A (sv) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6071148U (ja) * | 1983-10-24 | 1985-05-20 | ローム株式会社 | ダイオ−ド |
| JPS61129849A (ja) * | 1984-11-28 | 1986-06-17 | Toshiba Corp | リ−ドレス半導体装置 |
| JPS61182040U (sv) * | 1985-04-30 | 1986-11-13 | ||
| JPS6355549U (sv) * | 1986-09-29 | 1988-04-14 | ||
| US5248902A (en) * | 1991-08-30 | 1993-09-28 | General Instrument Corporation | Surface mounting diode |
| SG107595A1 (en) | 2002-06-18 | 2004-12-29 | Micron Technology Inc | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assembles and packages including such semiconductor devices or packages and associated methods |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
| JPS5869953A (ja) * | 1981-10-21 | 1983-04-26 | 株式会社 平井技研 | 屋根側部装置 |
| JPS58168269A (ja) * | 1982-03-29 | 1983-10-04 | Nec Home Electronics Ltd | リ−ドレスダイオ−ド |
-
1982
- 1982-09-02 JP JP15368782A patent/JPS5943558A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
| JPS5869953A (ja) * | 1981-10-21 | 1983-04-26 | 株式会社 平井技研 | 屋根側部装置 |
| JPS58168269A (ja) * | 1982-03-29 | 1983-10-04 | Nec Home Electronics Ltd | リ−ドレスダイオ−ド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5943558A (ja) | 1984-03-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS637029B2 (sv) | ||
| US20190229044A1 (en) | Lead frame with plated lead tips | |
| JPS59154054A (ja) | ワイヤおよびそれを用いた半導体装置 | |
| JPH0590465A (ja) | 半導体装置 | |
| JPS6097654A (ja) | 封止型半導体装置 | |
| JPH06232317A (ja) | 多端子電子部品とその製造方法 | |
| JPS61144834A (ja) | 樹脂封止型半導体装置 | |
| JPS622560A (ja) | 樹脂封止型半導体装置 | |
| JPS6171652A (ja) | 半導体装置 | |
| JPS6318334B2 (sv) | ||
| JPH0341475Y2 (sv) | ||
| JPH0810207Y2 (ja) | 樹脂封止形半導体装置 | |
| JPS6193654A (ja) | 樹脂封止型半導体装置 | |
| JPS6347341B2 (sv) | ||
| JPH0529870A (ja) | チツプ型表面波デバイス | |
| JP2005158778A (ja) | リードフレームの製造方法及び半導体装置の製造方法 | |
| JPS629734Y2 (sv) | ||
| JPH0214194Y2 (sv) | ||
| JP2561415Y2 (ja) | 半導体装置 | |
| JPS5882543A (ja) | レジンモ−ルド型半導体装置 | |
| JPS61131554A (ja) | 半導体装置の外装方法 | |
| JPH04162466A (ja) | 半導体装置用リードフレーム | |
| JPH0555433A (ja) | 半導体装置 | |
| JPH051246U (ja) | 表面実装型半導体装置用リードフレーム | |
| JPH02244746A (ja) | 樹脂封止型半導体装置 |