JPS6359840B2 - - Google Patents
Info
- Publication number
- JPS6359840B2 JPS6359840B2 JP26571984A JP26571984A JPS6359840B2 JP S6359840 B2 JPS6359840 B2 JP S6359840B2 JP 26571984 A JP26571984 A JP 26571984A JP 26571984 A JP26571984 A JP 26571984A JP S6359840 B2 JPS6359840 B2 JP S6359840B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- dividing
- shaped groove
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 230000002950 deficient Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- DZCLVBQEPZQZNN-UHFFFAOYSA-N copper;phenol Chemical compound [Cu].OC1=CC=CC=C1 DZCLVBQEPZQZNN-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 206010027175 memory impairment Diseases 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26571984A JPS61142098A (ja) | 1984-12-17 | 1984-12-17 | プリント配線板の加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26571984A JPS61142098A (ja) | 1984-12-17 | 1984-12-17 | プリント配線板の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61142098A JPS61142098A (ja) | 1986-06-28 |
JPS6359840B2 true JPS6359840B2 (enrdf_load_stackoverflow) | 1988-11-21 |
Family
ID=17421057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26571984A Granted JPS61142098A (ja) | 1984-12-17 | 1984-12-17 | プリント配線板の加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61142098A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401126B (zh) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
-
1984
- 1984-12-17 JP JP26571984A patent/JPS61142098A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401126B (zh) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
Also Published As
Publication number | Publication date |
---|---|
JPS61142098A (ja) | 1986-06-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4432037A (en) | Multi-layer printed circuit board and method for determining the actual position of internally located terminal areas | |
US5266380A (en) | Method and apparatus for visual verification of proper assembly and alignment of layers in a multi-layer printed circuit board | |
JPS6359840B2 (enrdf_load_stackoverflow) | ||
KR100315073B1 (ko) | 회로기판 | |
JPH0418718B2 (enrdf_load_stackoverflow) | ||
JPS61140192A (ja) | プリント配線板の製造方法 | |
JPS6156486A (ja) | 厚膜基板 | |
JP3420147B2 (ja) | プリント配線母板の加工方法及びプリント配線母板 | |
JP2941182B2 (ja) | プリント基板及びその切断方法 | |
JPH07243985A (ja) | プリント配線板の精度確認方法 | |
JPS63142694A (ja) | プリント配線板 | |
CN112985320B (zh) | 电路板 | |
JP3225616B2 (ja) | プリント配線板およびプリント配線板の精度確認方法 | |
JP3514961B2 (ja) | 割基板の識別方法およびその製造方法ならびに割基板 | |
JPS60240179A (ja) | ガイドマ−ク | |
JP3063725B2 (ja) | キー溝形成マーク付きプリント基板及びこのプリント基板におけるキー溝の形成位置ずれ判別方法 | |
KR100194092B1 (ko) | 인쇄회로기판의 기계 가공시 쏠림 체크방법 | |
JPH09214080A (ja) | プリント配線板 | |
JPH0426795B2 (enrdf_load_stackoverflow) | ||
JPH0621606A (ja) | プリント配線板の外形、内形補助加工の確認方法 | |
JPH03191590A (ja) | プリント配線基板 | |
EP0357307A2 (en) | Printed-wiring board | |
JPS587654Y2 (ja) | 印刷配線板 | |
JPH06152081A (ja) | プリント配線板 | |
JP2002094197A (ja) | プリント配線板及びその層間位置ずれの検出方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |