JPS6359840B2 - - Google Patents

Info

Publication number
JPS6359840B2
JPS6359840B2 JP26571984A JP26571984A JPS6359840B2 JP S6359840 B2 JPS6359840 B2 JP S6359840B2 JP 26571984 A JP26571984 A JP 26571984A JP 26571984 A JP26571984 A JP 26571984A JP S6359840 B2 JPS6359840 B2 JP S6359840B2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
dividing
shaped groove
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP26571984A
Other languages
Japanese (ja)
Other versions
JPS61142098A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP26571984A priority Critical patent/JPS61142098A/en
Publication of JPS61142098A publication Critical patent/JPS61142098A/en
Publication of JPS6359840B2 publication Critical patent/JPS6359840B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 産業上の利用分野 本発明は電子機器に使用されるプリント配線板
の加工方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for processing printed wiring boards used in electronic equipment.

従来の技術 従来電子機器の製造において、そのキヤビネツ
トのデザインやスペースの関係からプリント配線
板を複数個に分割し、これを上記キヤビネツト内
の所定の位置に適宜配設することが多い。そのた
めには、自動半田付装置に使用して、半田付工程
等の能率を考慮して、電子部品を取付けた後に複
数のプリント回路板(プリント配線板に電子部品
を実装したものをいう)に分割できるように予じ
めプリント配線板に連続したミシン目状の分割線
を設けていた。しかしながら、近年電子機器の小
型化、軽量化が増々進むにつれ、プリント配線板
も高密度配線が要求され、従来のミシン目孔を明
けるだけのスペースがないものが増えてきた。ま
た、ミシン目孔状の分割線はパンチング加工の容
易な紙ベース積層板等からなるプリント配線板に
は利用できるが、ガラスベース積層板等への利用
は困難であつた。
2. Description of the Related Art Conventionally, in the manufacture of electronic equipment, a printed wiring board is often divided into a plurality of pieces due to the design of the cabinet and space limitations, and these pieces are appropriately arranged at predetermined positions within the cabinet. To do this, it is necessary to use automatic soldering equipment to connect multiple printed circuit boards (printed wiring boards with electronic components mounted on them) after mounting electronic components, taking into consideration the efficiency of the soldering process. A continuous perforation-like parting line was previously provided on the printed wiring board so that it could be divided. However, as electronic devices have become increasingly smaller and lighter in recent years, printed wiring boards are also required to have high-density wiring, and an increasing number of printed wiring boards do not have enough space to make conventional perforations. Furthermore, perforated parting lines can be used for printed wiring boards made of paper-based laminates and the like that can be easily punched, but it has been difficult to use them for glass-based laminates and the like.

前記欠点を解消する方法として、例えば実公昭
55−42453号公報に示されるようにプリント配線
板の対応する両面上に一端から他端にかけてV字
状の溝を一直線状に設けて分断線(Vカツトとも
いう)として利用する方法が多く使用されてい
る。
As a method to eliminate the above-mentioned drawbacks, for example, Jikosho
As shown in Publication No. 55-42453, a method often used is to provide a V-shaped groove in a straight line from one end to the other on corresponding both sides of a printed wiring board and use it as a dividing line (also called a V-cut). has been done.

発明が解決しようとする問題点 このような従来のプリント配線板の分断線加工
方法は通常プリント配線板の端面を基準にして、
端面から一定の距離の所定位置にくるように分断
線がくるようにVカツト加工を施される。大量生
産用プリント配線板の端面はパンチングまたはシ
ユアリング等で加工する場合が多く、凹凸が多い
ということ及びVカツト加工機自身の加工ばらつ
きがあることから端面から所定の位置に分断線が
正確に加工できずにばらつきが大きい。したがつ
て、電子部品を実装後のプリント回路板に分断線
で切断後、電子機器のキヤビネツトに組立てると
きに、プリント回路板の寸法が合わないという不
具合を生じるため、Vカツト加工後にプリント配
線板の端面からVカツト加工までの寸法を全数測
定する必要があつた。
Problems to be Solved by the Invention In the conventional printed wiring board dividing line processing method, the end surface of the printed wiring board is usually used as a reference.
V-cut processing is performed so that the dividing line is at a predetermined position a certain distance from the end face. The end faces of printed wiring boards for mass production are often processed by punching or shearing, and there are many unevenness, and the V-cut processing machine itself has processing variations, so it is difficult to accurately form parting lines at predetermined positions from the end face. It cannot be done and there is a large variation. Therefore, when electronic components are mounted on a printed circuit board, the dimensions of the printed circuit board do not match when assembled into the cabinet of an electronic device after cutting the printed circuit board along parting lines. It was necessary to measure all dimensions from the end face to the V-cut.

さらに、プリント配線板が大量に生産される中
で、Vカツト加工が施こされていないものが生ず
ることがあり、仮にそのような不良が発見されず
にプリント配線板に電子部品を取り付け、半田付
後に発見された場合、部品材料コスト、工数等の
無駄が多くなるという問題があつた。
Furthermore, as printed wiring boards are produced in large quantities, some are produced that do not have the V-cut process, and if such defects are not discovered and electronic components are mounted on the printed wiring board and then soldered. If the problem is discovered after installation, there is a problem in that there will be a lot of waste in parts material costs and man-hours.

本発明は上記の問題点を解決するもので、Vカ
ツト加工またはUカツト加工等の位置寸法のチエ
ツク及び加工忘れ等を容易に検出しようとするも
のである。
The present invention is intended to solve the above-mentioned problems, and is intended to easily check the positional dimensions of V-cut machining, U-cut machining, etc., and easily detect forgetting of machining.

問題点を解決するための手段 この問題点を解決するために本発明は、複数の
プリント回路板に分断するための線状の分断溝加
工を施こすに際し、予じめプリント配線板の端縁
部で、分断溝と対応する個所に切り欠きのV状溝
を形成するとともにそのV状溝近傍にずれ確認用
の微小目盛を形成しようとするものである。
Means for Solving the Problem In order to solve this problem, the present invention provides that, when performing linear dividing groove processing for dividing the printed circuit board into a plurality of printed circuit boards, the edges of the printed circuit board are At the same time, a notched V-shaped groove is formed at a location corresponding to the dividing groove, and a minute scale for checking deviation is formed near the V-shaped groove.

作 用 この構成によれば、Vカツト加工やUカツト加
工等の分断溝の位置はプリント配線板の端縁部に
設けられたV状溝の切り欠きの突部とその分断溝
の位置ずれをチエツクすればどの程度ずれている
か目視で判断できる。さらに、上記のプリント配
線板の端縁部の十状溝の切り欠き部を検査すれば
Vカツト加工やUカツト加工等の加工忘れも目視
で容易に検出できる。
According to this configuration, the position of the dividing groove in V-cut processing, U-cut processing, etc. is determined by adjusting the position of the dividing groove between the protrusion of the notch of the V-shaped groove provided at the edge of the printed wiring board and the dividing groove. By checking, you can visually determine how much the deviation is. Further, by inspecting the cutout portion of the cross-shaped groove at the edge of the printed wiring board, it is possible to easily detect visually any omissions in processing such as V-cut processing or U-cut processing.

実施例 以下本発明の一実施例について添付図面に基づ
いて説明する。
Embodiment An embodiment of the present invention will be described below based on the accompanying drawings.

第1図、第2図および第3図において、1はプ
リント配線板、2はVカツト加工による分断溝、
3はV状溝の切り欠き、4はずれ確認用の微小目
盛であり、本発明によるプリント配線板の加工方
法を示す概略図である。
In FIGS. 1, 2, and 3, 1 is a printed wiring board, 2 is a dividing groove formed by V-cut processing,
3 is a notch of a V-shaped groove, and 4 is a microscale for checking misalignment, and is a schematic diagram showing a method of processing a printed wiring board according to the present invention.

ここでプリント配線板は、紙フエノール積層
板、紙エポキシ積層板、紙ポリエステル積層板、
ガラスエポキシ積層板、コンポジツトタイプの積
層板およびセラミツク基板等の絶縁基板上に、銅
箔回路、銀、銅、カーボン等の導電ペースト印刷
による回路等の導電回路パターンを形成したもの
である。
Here, printed wiring boards include paper phenol laminates, paper epoxy laminates, paper polyester laminates,
A conductive circuit pattern such as a copper foil circuit or a circuit printed with a conductive paste of silver, copper, carbon, etc. is formed on an insulating substrate such as a glass epoxy laminate, a composite type laminate, or a ceramic substrate.

一例として紙フエノール銅張積層板を使用して
本発明によるプリント配線板の加工方法について
説明する。
A method of processing a printed wiring board according to the present invention will be described using a paper phenol copper-clad laminate as an example.

紙フエノール銅張積層板上にエツチングレジス
トをスクリーン印刷し、エツチング液で不要部の
銅箔を除去し、銅箔による導電回路パターンを形
成する。次に、必要であれば、半田付けする部分
及び端子部分を残して全面にソルダーレジスタを
スクリーン印刷する。
Etching resist is screen printed on the paper phenol copper clad laminate, unnecessary portions of the copper foil are removed using an etching solution, and a conductive circuit pattern is formed using the copper foil. Next, if necessary, screen print a solder resistor on the entire surface except for the parts to be soldered and the terminal parts.

次に、電子部品の配置図を示すためのロードマ
ツプまたはサービスマツプをスクリーン印刷する
が、この時同時にVカツト加工やUカツト加工の
分断線と直角方向になるよう微小目盛を、V状溝
の切り欠きを設ける予定の位置に近傍に設けてお
く。微小目盛は例えば、目盛線の太さが0.10mm、
目盛線間の距離が0.10mmとしておく。この微小目
盛は、前述の銅箔をエツチング加工する場合に、
銅箔による微小目盛のパターンを設けることもで
きる。次に、電子部品の組込み工程で使用するワ
ークサイズにするための外形加工を金型を利用し
てパンチングが加工を施こすと同時に、電子部品
挿入用の貫通孔も合わせて設けることにより複数
のプリント配線板1(第2図では4ケのプリント
配線板)が得られる。ここで、上記パンチング加
工時に、電子部品実装後にプリント回路板を分割
するための分断溝2と対応する位置でしかもプリ
ント配線板の両端縁部にV状溝の切り欠きを設け
ておく。
Next, a road map or service map to show the layout of electronic components is screen printed. At the same time, minute scales are cut in the V-shaped grooves so that they are perpendicular to the dividing line of the V-cut or U-cut. Place the notch near the location where you plan to make the notch. For example, the thickness of the scale line is 0.10mm,
The distance between the scale lines is 0.10mm. This minute scale is used when etching the copper foil mentioned above.
A pattern of minute scales made of copper foil can also be provided. Next, punching is performed using a mold to form the external shape of the workpiece to the size used in the electronic component assembly process, and at the same time, through-holes for inserting electronic components are also provided to create multiple A printed wiring board 1 (four printed wiring boards in FIG. 2) is obtained. Here, during the punching process, V-shaped groove notches are provided at both end edges of the printed wiring board at positions corresponding to dividing grooves 2 for dividing the printed circuit board after electronic components are mounted.

次いで、上記のプリント配線板1の両端縁部に
設けられたV状溝の突部を通過するように分断溝
2が位置するように設定し、分断溝2の加工を施
こす。
Next, the dividing grooves 2 are set so as to pass through the protrusions of the V-shaped grooves provided at both end edges of the printed wiring board 1, and the dividing grooves 2 are processed.

このようにプリント配線板を加工すれば、Vカ
ツト加工またはUカツト加工時の位置合せが、プ
リント配線板の端面を基準にする場合よりも容易
であり、正確になる。さらに、第4図の示すよう
に分断線4または5が所定の位置からずれると、
V状溝の切り欠き3の突部が露呈するのでずれて
いることが目視で容易に検出される。さらに、そ
のV状溝近くの微小目盛と交差する分断線の位置
からずれの大きさを数値として試み取ることがで
きるから、良否の判断基準の数値と比較すること
により容易に不良品と良品を選別することができ
る。また、プリント配線板の端縁部のV状溝の切
り欠き3の部分を検査すれば、分断線加工が施こ
されているかいないかは容易に判別することがで
きるので、例え、分断溝加工忘れがあつても容易
に検出することができる。
By processing the printed wiring board in this manner, alignment during V-cut processing or U-cut processing is easier and more accurate than when using the end face of the printed wiring board as a reference. Furthermore, if the dividing line 4 or 5 deviates from the predetermined position as shown in FIG.
Since the protrusion of the notch 3 of the V-shaped groove is exposed, misalignment can be easily detected visually. Furthermore, since the magnitude of the deviation can be measured as a numerical value from the position of the dividing line that intersects with the minute scale near the V-shaped groove, it is easy to distinguish between defective and non-defective products by comparing it with the numerical value used as the standard for determining pass/fail. Can be sorted. In addition, by inspecting the notch 3 of the V-shaped groove at the edge of the printed wiring board, it is possible to easily determine whether dividing line processing has been performed or not. Even if there is forgetfulness, it can be easily detected.

発明の効果 以上のように本発明によれば、プリント配線板
の端縁部にV状溝の切り欠きを設け、しかもずれ
確認用の微小目盛を設けるからこの切り欠きを基
準にして、複数のプリント回路板に分割するため
の分断溝を設けるから、分断溝の位置精度が高く
なり、しかも、分断溝の位置ずれ不良および分断
溝加工忘れを目視で容易に検出できることにな
り、産業上利用価値の大なるものである。
Effects of the Invention As described above, according to the present invention, a notch in the form of a V-shaped groove is provided at the edge of the printed wiring board, and a fine scale for checking deviation is provided. Since dividing grooves are provided to divide the printed circuit board, the positional accuracy of the dividing grooves is high, and it is also possible to easily visually detect defective positioning of the dividing grooves or forgetting to process the dividing grooves, which has great industrial value. It is a great thing.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示すプリント配線
板の部分拡大した平面図、第2図は本発明の一実
施例を示すプリント配線板の平面図、第3図はそ
の側面図、第4図は本発明の実施例説明に際し
て、分断溝のずれを示すプリント配線板の平面図
である。 1……プリント配線板、2……分断溝、3……
V状溝の切り欠き、4……微小目盛。
Fig. 1 is a partially enlarged plan view of a printed wiring board showing an embodiment of the present invention, Fig. 2 is a plan view of a printed wiring board showing an embodiment of the invention, and Fig. 3 is a side view thereof. FIG. 4 is a plan view of a printed wiring board showing misalignment of dividing grooves when explaining an embodiment of the present invention. 1...Printed wiring board, 2...Dividing groove, 3...
V-shaped groove notch, 4...microscale.

Claims (1)

【特許請求の範囲】[Claims] 1 複数のプリント回路板に分断するための直線
状の分断溝を施こすに際し、予じめプリント配線
板の端縁部で、上記分断溝と対応する個所に、切
り欠きのV状溝を設けるとともに、そのV状溝近
傍にずれ確認用の微小目盛を形成することを特徴
とするプリント配線板の加工方法。
1. When creating linear dividing grooves for dividing into multiple printed circuit boards, a cutout V-shaped groove is provided in advance at the edge of the printed wiring board at a location corresponding to the dividing groove. A method for processing a printed wiring board, characterized in that a minute scale for checking deviation is formed near the V-shaped groove.
JP26571984A 1984-12-17 1984-12-17 Method of machining printed wiring board Granted JPS61142098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26571984A JPS61142098A (en) 1984-12-17 1984-12-17 Method of machining printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26571984A JPS61142098A (en) 1984-12-17 1984-12-17 Method of machining printed wiring board

Publications (2)

Publication Number Publication Date
JPS61142098A JPS61142098A (en) 1986-06-28
JPS6359840B2 true JPS6359840B2 (en) 1988-11-21

Family

ID=17421057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26571984A Granted JPS61142098A (en) 1984-12-17 1984-12-17 Method of machining printed wiring board

Country Status (1)

Country Link
JP (1) JPS61142098A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401126B (en) * 2006-09-28 2013-07-11 Hitachi Via Mechanics Ltd Shape processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401126B (en) * 2006-09-28 2013-07-11 Hitachi Via Mechanics Ltd Shape processing method

Also Published As

Publication number Publication date
JPS61142098A (en) 1986-06-28

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