JPH0621606A - Method of confirming auxiliary processing of external and internal shape of printed wiring board - Google Patents

Method of confirming auxiliary processing of external and internal shape of printed wiring board

Info

Publication number
JPH0621606A
JPH0621606A JP20044492A JP20044492A JPH0621606A JP H0621606 A JPH0621606 A JP H0621606A JP 20044492 A JP20044492 A JP 20044492A JP 20044492 A JP20044492 A JP 20044492A JP H0621606 A JPH0621606 A JP H0621606A
Authority
JP
Japan
Prior art keywords
processing
printed wiring
wiring board
conductive pattern
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20044492A
Other languages
Japanese (ja)
Inventor
Satoshi Matsunaga
敏 松永
Shin Kawakami
伸 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
CMK Corp
Original Assignee
Nippon CMK Corp
CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp, CMK Corp filed Critical Nippon CMK Corp
Priority to JP20044492A priority Critical patent/JPH0621606A/en
Priority to GB9313780A priority patent/GB2268631A/en
Publication of JPH0621606A publication Critical patent/JPH0621606A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To confirm the auxiliary processing of the external and internal shape of printed wiring board with a measuring instrument. CONSTITUTION:In case of processing the external shape and internal shapes of a printed wiring board two times or more to at least a single printed wiring board, the conductive pattern 5 made by etching is provided independently, and also at each processing of external and internal auxiliary processing, the circuit parts 3a and 3b of the conductive pattern 5 are cut by mold pins 4a and 4b, and then the existence of conductivity of the conductive pattern 5 is judged, whereby the completion of external and internal shape processing is confirmed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】プリント配線板の外形、内形補助
加工の施工を確認する方法に関する。
[Industrial application] The present invention relates to a method for confirming the outer shape of a printed wiring board and the construction of inner shape auxiliary processing.

【0002】[0002]

【従来の技術】電子機器の軽薄短小化が進むにつれて、
プリント配線板も高密度配線化するとともに高多層化し
たものが各方面で使用され、益々高精度化が要求されて
きているのが現状である。
2. Description of the Related Art As electronic devices become lighter, thinner, smaller and smaller,
In the present situation, the printed wiring board is used in various fields with high density wiring and a high number of layers, and there is a growing demand for higher precision.

【0003】具体的には、プリント配線板に搭載される
電子部品が小型化され、I,Cも高集積化が進むととも
にその端子数も多くなり、従って、端子間スペースも狭
くなるとともに端子を挿入する穴の精度も厳しくなって
きている。
Specifically, as electronic components mounted on a printed wiring board are downsized, and I and C are highly integrated, the number of terminals is increased, so that the space between terminals is narrowed and the terminals are The accuracy of the holes to insert is becoming severe.

【0004】このような高精度なプリント配線板を単一
製品として仕上げる外形、内形加工に関する従来の加工
方法として、一般に、産業用のプリント配線板はルータ
加工により、また、民生用プリント配線板は金型プレス
による加工が行はれている。
As a conventional processing method relating to the outer shape and inner shape processing for finishing such a highly accurate printed wiring board as a single product, generally, an industrial printed wiring board is processed by a router, and a consumer printed wiring board is used. Is processed by a die press.

【0005】しかし、高密度配線化が高度に進んできた
現状では民生用プリント配線板といえども、金型プレス
により1回の加工で外形、内形加工を行うことは、部品
穴間のクラックや、基材の欠け等の重大な不良が発生し
やすいため、加工困難な製品が多々でてきている。
However, in the present situation where high-density wiring has been advanced to a high degree, even in the case of a consumer printed wiring board, it is necessary to perform the outer shape and the inner shape processing with a die press in a single operation because of the cracks between the component holes. Also, since many serious defects such as chipping of the base material are likely to occur, many products are difficult to process.

【0006】従って、このような外形、内形加工を1回
で行うことによる不良の原因を防止するためには、金型
加工の他に加工の一部をルータを併用して行うか、また
は、金型加工の分野を分散して2つ以上の金型を用いる
ことで対処しているのが実情である。
Therefore, in order to prevent the cause of defects caused by performing the outer shape and inner shape processing in a single operation, a part of the processing is performed in combination with the router in addition to the die processing, or The reality is that the field of mold processing is distributed and two or more molds are used.

【0007】また、このように分散加工をすると、分散
加工の各工程が確実に行われたかどうかを確認する必要
が生じる。そして、その確認の方法として、従来、目視
または電気的手段が用いられている。
Further, when the distributed processing is carried out in this way, it becomes necessary to confirm whether or not each step of the distributed processing has been carried out with certainty. Then, as a method of confirming the same, visual inspection or electrical means has been conventionally used.

【0008】この種の加工の確認方法の例として、特公
平2−56839号公報に開示された発明が知られてい
る。そして、同公報記載の発明は、図5および図6に示
すように、2つの独立した配線回路11,12が一体の
基板13上に形成され、それぞれの回路11,12の領
域にまたがる境界線14上の両端付近に独立した導体パ
ターン15,16を1個ずつ形成しておき、境界線14
上にてVカット加工14aを施工した時に(図6)、導
体パターン15,16がVカット加工14aにより切断
分離されるようにしている。
The invention disclosed in Japanese Patent Publication No. 2-56839 is known as an example of a method of confirming this kind of processing. In the invention described in the publication, as shown in FIGS. 5 and 6, two independent wiring circuits 11 and 12 are formed on an integrated substrate 13 and a boundary line extending over the regions of the respective circuits 11 and 12. Independent conductor patterns 15 and 16 are formed in the vicinity of both ends on the boundary line 14 respectively.
When the V-cut processing 14a is applied (FIG. 6), the conductor patterns 15 and 16 are cut and separated by the V-cut processing 14a.

【0009】前記Vカット加工にて導体パターン15,
16が分断されることにより導体パターン15,16に
導通がなくなる。この導通の有無のチェックを計測器に
より判定することにより、Vカットが施工されたか否か
を確認する方法が提案されている。
Conductor pattern 15 by the V-cut processing,
Since the 16 is divided, the conductor patterns 15 and 16 are not electrically connected. There has been proposed a method of confirming whether or not a V cut has been performed by determining the presence or absence of continuity with a measuring instrument.

【0010】[0010]

【発明が解決しようとする課題】しかしながら、前記従
来のプリント配線板の外形、内形加工において、その外
形、内形加工を分散して施工すると、分散した一部の加
工が補助的な要素となるため、加工工程が確実に施工さ
れずに次工程に流れる恐れがある。
However, when the external shape and the internal shape processing of the conventional printed wiring board are distributed and the external shape and the internal shape processing are dispersed, some of the distributed processing becomes an auxiliary element. Therefore, there is a risk that the processing step will not be carried out reliably and will flow to the next step.

【0011】また、分散した各加工工程が確実に施工さ
れているか否かを確認する従来の検査方法においても、
工程を飛ばしたことを見逃しやすいために、欠陥製品が
生じるという問題があった。
Further, in the conventional inspection method for confirming whether or not the dispersed processing steps are surely carried out,
There is a problem that defective products occur because it is easy to overlook the skipped steps.

【0012】よって本発明は前記問題点に鑑みてなされ
たものであり、すくなくとも単一のプリント配線板に対
して、外形、内形加工の分散加工を行うことにより、加
工工程が施工されないまま次工程に流れても、流れてき
た製品を計測器にてチェックすることにより、外形、内
形補助加工が施工されているか否かを確認する方法の提
供を目的とするものである。
Therefore, the present invention has been made in view of the above problems, and by carrying out distributed processing of outer shape and inner shape processing on at least a single printed wiring board, it is possible to carry out the following without processing steps. It is an object of the present invention to provide a method for checking whether or not external shape / inner shape auxiliary processing has been performed by checking the flowing product with a measuring instrument even if it flows to the process.

【0013】[0013]

【課題を解決するための手段】上記目的を達成するため
本発明のプリント配線板の外形、内形補助加工の確認方
法は、プリント配線板の外形、内形補助加工において、
少なくとも単一のプリント配線板に対して外形、内形補
助加工を2回以上施工する場合の、前記外形、内形補助
加工の施工を確認する方法として、前記内外形等の加工
に対応する加工確認用の導電パターンを独立して設ける
とともに、外形、内形補助加工のそれぞれの加工時に前
記それぞれの加工に対応する導電パターンを切断し、そ
の後に前記導電パターンの導通の有無を判定することに
より外形、内形補助加工の施工を確認することを特徴と
するものである。
In order to achieve the above object, the method of confirming the outer shape and inner shape auxiliary processing of a printed wiring board according to the present invention is:
As a method of confirming the external shape and the internal shape auxiliary processing when the external shape and the internal shape auxiliary processing are applied more than once to at least a single printed wiring board, the processing corresponding to the internal shape and the like By independently providing a conductive pattern for confirmation, by cutting the conductive pattern corresponding to each of the outer shape and the inner shape auxiliary processing at each processing, and then determining whether the conductive pattern is conductive or not. It is characterized by confirming the construction of the outer shape and inner shape auxiliary processing.

【0014】[0014]

【作用】本発明のプリント配線板の外形、内形補助加工
の確認方法によれば、独立して設けられた導電パターン
を外形、内形補助加工のそれぞれの加工時に切断し、そ
の後に、導電パターンの導通を計測器にて判定した際
に、導通が無ければ、外形、内形補助加工が施工された
ものとし、導通があった場合は、施工されていないとし
て確認される。
According to the method for confirming the outer shape and the inner shape auxiliary processing of the printed wiring board of the present invention, the independently provided conductive pattern is cut at each of the outer shape and the inner shape auxiliary processing, and then the conductive pattern is formed. When there is no continuity when the continuity of the pattern is determined by the measuring instrument, it is determined that the outer shape and inner shape auxiliary processing has been performed, and when there is continuity, it is confirmed that the continuity has not been performed.

【0015】[0015]

【実施例1】図1および図2は本発明の実施例1を示
し、図1は導電パターンの平面図である。本実施例では
外形、内形補助加工を1次および2次の2回に分けて施
工する場合の施工の確認について説明する。
Embodiment 1 FIGS. 1 and 2 show Embodiment 1 of the present invention, and FIG. 1 is a plan view of a conductive pattern. In the present embodiment, the confirmation of the construction when the outer shape and the inner shape auxiliary machining are divided into the primary and secondary machining twice will be described.

【0016】図1に示すように2本の導電パターンはそ
の両端のランド2を回路3にて接続するとともに、回路
3の幅を金型ピン4a,4bの径(0.8mm)より細
い形状に形成している。
As shown in FIG. 1, the two conductive patterns have lands 2 on both ends thereof connected by a circuit 3, and the width of the circuit 3 is smaller than the diameter (0.8 mm) of the mold pins 4a and 4b. Is formed.

【0017】前記構成の2本の導電パターン1のそれぞ
れに、外形、内形補助加工の1次加工用として、2次
加工用としての印を付けておく。
Each of the two conductive patterns 1 having the above-mentioned structure is marked as a secondary processing for the primary processing of the outer shape and the inner shape auxiliary processing.

【0018】前記導電パターン1は、プリント配線板の
製造に際して、ワークサイズに加工された基板面に対
し、プリント配線回路を銅箔にて形成する通常のエッチ
ング工程において、プリント配線板の配線回路に対して
独立した2か所に同時に形成する。
In the production of a printed wiring board, the conductive pattern 1 is applied to the wiring circuit of the printed wiring board in a usual etching process of forming a printed wiring circuit with copper foil on a substrate surface processed into a work size. On the other hand, they are simultaneously formed in two independent places.

【0019】つぎに、その後のプリント配線板の製造工
程としてソルダーレジストおよびシンボルマークの印刷
をした後、ワークサイズのプリント配線板を外形、内形
加工金型プレスの打ち抜きサイズに裁断する(不図
示)。
Next, after a solder resist and a symbol mark are printed in the subsequent manufacturing process of the printed wiring board, the printed wiring board of the work size is cut into the outer shape and the punching size of the inner working die press (not shown). ).

【0020】前記裁断されたプリント配線板に対して、
図2に示すように、内形のみの金型による1次加工を行
う。その加工と同時に、1次加工用の導電パターン1
の回路3を金型ピン4aにて打ち抜く。
With respect to the cut printed wiring board,
As shown in FIG. 2, primary processing is performed using only the inner die. Simultaneously with the processing, the conductive pattern 1 for the primary processing
The circuit 3 is punched with the die pin 4a.

【0021】つぎに、2次加工として、外形および内形
の1部を加工する際に、同時に、2次加工用の導電パ
ターン1の回路3を金型ピン4bにて打ち抜く。
Next, as the secondary processing, at the time of processing a part of the outer shape and the inner shape, at the same time, the circuit 3 of the conductive pattern 1 for the secondary processing is punched by the die pin 4b.

【0022】その後、2か所の導電パターン1の導通の
有無を計測器によりチェックし、2か所とも導通が無け
れば、1次および2次の外形および内形の加工が施工さ
れたものとして確認することができる。
After that, the presence or absence of electrical continuity of the conductive pattern 1 at the two locations is checked by a measuring instrument, and if there is no electrical continuity at the two locations, it is considered that the primary and secondary outer shapes and internal shapes have been processed. You can check.

【0023】また、導電パターン1が導通した場合は、
導通した導電パターン1に対応する加工が未加工になっ
ていると判定される。
When the conductive pattern 1 is conductive,
It is determined that the processing corresponding to the conductive pattern 1 that has been conducted is unprocessed.

【0024】本実施例によれば、独立して2か所に設け
た導電パターン1を、外形、内形の1次及び2次の加工
の後に計測器にてその導通の有無をチェックすることに
より、外形、内形補助加工の施工を確認することができ
る。また、確認用の導電パターン1は一般回路と同時に
形成できるので導電パターン1の成形工程を追加する必
要がない。
According to the present embodiment, the conductive pattern 1 independently provided at two places is checked for continuity by the measuring instrument after the primary and secondary machining of the outer shape and the inner shape. This makes it possible to confirm the external shape and the internal shape auxiliary processing. Further, since the conductive pattern 1 for confirmation can be formed at the same time as the general circuit, it is not necessary to add the step of molding the conductive pattern 1.

【0025】[0025]

【実施例2】図3及び図4は本発明の実施例2を示し、
図3は導電パターンの平面図である。本実施例も外形、
内形補助加工を1次および2次の2回に分けて施工する
場合である。
Second Embodiment FIGS. 3 and 4 show a second embodiment of the present invention.
FIG. 3 is a plan view of the conductive pattern. Also in this embodiment,
This is a case where the inner shape auxiliary processing is performed in two steps, the first and the second.

【0026】図3に示すように、導電パターン5は、両
端のランド2を並列な2本の回路3a,3bにて接続
し、回路3aを1次加工用として、回路3bを2次加
工用としての印を付けておく。
As shown in FIG. 3, in the conductive pattern 5, the lands 2 at both ends are connected by two parallel circuits 3a and 3b. The circuit 3a is used for primary processing and the circuit 3b is used for secondary processing. Mark as.

【0027】本実施例では、前記導電パターン5を配線
回路に対し独立して1か所だけに設ける点が実施例1と
異にするもので、その他の構成については前記実施例1
と同様であるので同一部材、同一構成部分について同一
符号を付してその説明を省略する。
This embodiment is different from the first embodiment in that the conductive pattern 5 is provided in only one place independently of the wiring circuit, and other configurations are the same as those in the first embodiment.
The same members and the same components are designated by the same reference numerals and the description thereof will be omitted.

【0028】前記構成の導電パターン5に対し、図4に
示すように、外形、内形の1次加工の際に金型ピン4a
にて1次加工用の導電パターン3aを、2次加工の際に
金型ピン4bにて2次加工用の導電パターン3bを打ち
抜く。その後に、計測器によるチェックにて導電パター
ン5の導通の有無を判定することにより、外形、内形補
助加工の施工を確認をすることができる。
As shown in FIG. 4, with respect to the conductive pattern 5 having the above-mentioned structure, the die pin 4a is used in the primary processing of the outer shape and the inner shape.
The conductive pattern 3a for the primary processing is punched out, and the conductive pattern 3b for the secondary processing is punched out by the die pin 4b during the secondary processing. After that, by checking the presence or absence of conduction of the conductive pattern 5 by a check with a measuring device, it is possible to confirm the construction of the outer shape and the inner shape auxiliary processing.

【0029】前記導電パターン5の導通チェックにおい
て導通がなけば外形、内形補助加工が施工されたものと
し、導通があった場合は、並列に設けられている回路の
内、打ち抜かれていない回路に対応する加工が未加工と
なっていることが確認される。
If there is no continuity in the continuity check of the conductive pattern 5, it is assumed that the outer shape and inner shape auxiliary processing has been carried out. It is confirmed that the processing corresponding to is unprocessed.

【0030】なお、外形、内形補助加工を2回以上施工
する場合は、前記実施例1においては、施工数に応じた
数の導電パターン1を設ければよく、前記実施例2にお
いては、導電パターン5の並列回路3a,3bを施工数
に応じた数にすればよい。
In the case of performing the outer shape and inner shape auxiliary machining more than once, in the first embodiment, it is sufficient to provide the conductive patterns 1 in the number corresponding to the number of constructions. In the second embodiment, The number of parallel circuits 3a and 3b of the conductive pattern 5 may be set according to the number of constructions.

【0031】また、前記実施例1,2における導電パタ
ーンは加工確認後に基板より切除し得る位置に配設して
実施することが望ましい。
Further, it is desirable that the conductive patterns in the first and second embodiments are arranged at a position where they can be cut off from the substrate after confirmation of processing.

【0032】[0032]

【発明の効果】本発明によれば、プリント配線板の外
形、内形補助加工を目視によらず、計測器によるチェッ
クにて一般回路の検査と同時にかつ、容易に確認するこ
とができるとともに、検査の自動化が可能になる。
According to the present invention, the outer shape and inner shape auxiliary processing of a printed wiring board can be checked at the same time and easily as a general circuit by a check with a measuring device without visually observing. The inspection can be automated.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1を示す外形、内形補助加工確
認用導電パターンの平面図。
FIG. 1 is a plan view of an outer shape and an inner shape auxiliary processing confirmation conductive pattern showing a first embodiment of the present invention.

【図2】同導電パターンの回路を金型ピンにて切断した
平面図。
FIG. 2 is a plan view in which a circuit having the same conductive pattern is cut by a mold pin.

【図3】本発明の実施例2を示す外形、内形補助加工確
認用導電パターンの平面図。
FIG. 3 is a plan view of an outer shape and an inner shape auxiliary processing confirmation conductive pattern showing a second embodiment of the present invention.

【図4】同導電パターンの回路を金型ピンにて切断した
平面図。
FIG. 4 is a plan view in which a circuit having the same conductive pattern is cut by a mold pin.

【図5】従来のプリント配線板のVカット加工の確認方
法の説明図。
FIG. 5 is an explanatory diagram of a conventional method for confirming V-cut processing of a printed wiring board.

【図6】同Vカット加工部の拡大図。FIG. 6 is an enlarged view of the V-cut processing portion.

【符号の説明】[Explanation of symbols]

1、5 導電パターン 2 ランド 3 回路 4 金型ピン 1, 5 Conductive pattern 2 Land 3 Circuit 4 Mold pin

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 プリント配線板の外形、内形補助加工
を、少なくとも単一のプリント配線板に対して2回以上
施工する場合において、前記内外形等の加工に対応する
加工確認用の導電パターンを独立して設けるとともに、
外形、内形補助加工のそれぞれの加工時に前記それぞれ
の加工に対応する導電パターンを切断し、その後に前記
導電パターンの導通の有無を判定することにより、外
形、内形補助加工の施工を確認するプリント配線板の外
形、内形補助加工の確認方法。
1. A conductive pattern for processing confirmation, which corresponds to the processing of the inner and outer shapes, when the outer shape and inner shape auxiliary processing of the printed wiring board is carried out at least twice on a single printed wiring board. With independent,
Confirm the execution of the outer shape and inner shape auxiliary processing by cutting the conductive pattern corresponding to each of the outer shape and inner shape auxiliary processing and then determining whether or not the conductive pattern is conductive. How to check the external shape and internal shape auxiliary processing of a printed wiring board.
JP20044492A 1992-07-03 1992-07-03 Method of confirming auxiliary processing of external and internal shape of printed wiring board Pending JPH0621606A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP20044492A JPH0621606A (en) 1992-07-03 1992-07-03 Method of confirming auxiliary processing of external and internal shape of printed wiring board
GB9313780A GB2268631A (en) 1992-07-03 1993-07-02 Testing printed circuit board construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20044492A JPH0621606A (en) 1992-07-03 1992-07-03 Method of confirming auxiliary processing of external and internal shape of printed wiring board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP24266292A Division JPH06152081A (en) 1992-08-19 1992-08-19 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH0621606A true JPH0621606A (en) 1994-01-28

Family

ID=16424403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20044492A Pending JPH0621606A (en) 1992-07-03 1992-07-03 Method of confirming auxiliary processing of external and internal shape of printed wiring board

Country Status (2)

Country Link
JP (1) JPH0621606A (en)
GB (1) GB2268631A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613981B2 (en) * 1991-03-11 1997-05-28 富山日本電気株式会社 Inspection method of printed wiring board

Also Published As

Publication number Publication date
GB9313780D0 (en) 1993-08-18
GB2268631A (en) 1994-01-12

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