JPH02125490A - Printed circuit board - Google Patents

Abstract

PURPOSE:To accurately determine a position even without a measuring unit by forming a conductor pattern having an inner profile substantially similar to a hole at the position of an automatic mounting reference hole. CONSTITUTION:Deviation detection patterns 4a, 4b, 4c, 4d are formed by a photoprinting method simultaneously with a surface mounting pad 1, a through hole 2, and a conductive pattern 3. Then, automatic mounting reference holes 5a, 5b, 5c, 5d are formed by a numerical control perforator. For example, if an automatic mounting reference hole 5'' ls largely deviated from a maximum allowable value in an improper state of a deviation detection pattern 4, the deviation of the hole can be easily and accurately confirmed by visual observation without using the unit by adding the deviation detection pattern to be rapidly determine the propriety.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed wiring board, and more particularly to a printed wiring board having a plurality of automatic mounting reference hole displacement detection patterns with circular conductive patterns around the periphery. .

[Conventional technology]

Conventionally, in printed wiring boards (hereinafter referred to as wiring boards) that employ the hole-filling method, when the reference hole is machined at the same time as the through hole, copper plating is formed on the hole wall of the automatic mounting reference hole (hereinafter referred to as reference hole). The remaining hole diameter is not satisfactory. For this reason, after forming the pad 1, through hole 2, and conductive pattern 3 as shown in FIG. 3(A), as shown in FIG. 3(B) K,
Reference holes 5a to 5b are formed. In other words, non-through holes are formed by processing the reference holes 5a to 5d after the copper plating process.

At this time, since the processing of the reference holes 5a to 5d and the processing of the through hole 2 are separate processes, the positional accuracy of the reference holes 5a to 5d, the pad 1, and the through hole 2 is not satisfactory. For this reason, a separate measuring device must be used to determine pass/fail.

[Problem to be solved by the invention]

The above-described conventional printed wiring board has the disadvantage of poor efficiency because the positions of the reference holes, pads, and through holes are measured with a measuring machine and then judged as pass/fail.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a printed wiring board in which the above-mentioned drawbacks are overcome and the position can be determined accurately without using a measuring device.

[Means to solve the problem]

The structure of the printed wiring board of the present invention is characterized in that a conductor pattern having an inner contour substantially similar to the first hole is formed at the position of the automatic mounting reference hole.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

1(A) and 1(B) are plan views sequentially showing a method for manufacturing a printed wiring board according to an embodiment of the present invention, and FIG. 2(A) to FIG. FIG. 3 is a plan view showing a main part of the automatic mounting reference hole displacement detection pattern shown in FIG. First, Figure 1 (
In A), in the printed wiring board of this embodiment, the misalignment detection patterns 4a, 4b, 4c, and 4d are placed on the surface mounting pads 1,
The through holes 2 and the conductive pattern 3 are simultaneously formed by a photo printing method.

Next, in FIG. 1(B), automatic mounting reference holes 5a, 5
b.

Holes 5c and 5d are formed using a numerical control (N/C') drilling machine.

2(A) to 2(C), the automatic mounting reference holes 5a to 5d shown in FIG. 1(B) are respectively formed.
FIG. 2(A) shows an ideal state in which the automatic mounting reference hole 5 is drilled in the center of the deviation detection pattern 4, and the automatic mounting reference hole 5 is shown in FIG. It can be visually confirmed that there is no misalignment and that it is formed in good condition. Here, the gap ΔD between the automatic mounting reference hole 5 and the deviation detection pattern 4 is set to the maximum allowable deviation amount of the automatic mounting reference hole 5.

FIG. 2(B) shows a state in which the automatic mounting reference hole 5' is shifted leftward by ΔD, and the automatic mounting reference hole 5' is in contact with the shift detection pattern 4, but within the maximum allowable value.

FIG. 2(C) shows a defective state in which the automatic mounting reference hole 5'' has deviated by a larger amount than the maximum allowable value, and the deviation detection pattern 4 is affected.As described above, the deviation detection pattern is attached. In particular, the amount of deviation of the automatic mounting reference hole can be easily and accurately confirmed visually without using a measuring device, and pass/fail can be quickly determined.

In this example, the maximum permissible deviation of the gap between the automatic mounting reference hole and the deviation detection pattern is set and explained, but it is possible to change the size of the gap and provide multiple gaps. It is possible to further improve the

In the printed wiring board of the present invention, a plurality of first displacement detection patterns each having an inner contour similar to that of the holes are formed at positions to be a plurality of automatic mounting reference holes provided on the main surface of the printed wiring board.
a second step of forming the automatic mounting reference hole in the deviation detection pattern; and a third step of visually inspecting the positional deviation of the automatic mounting reference hole formed in the deviation detection pattern. The process is carried out accordingly. Particularly in the first step, it is preferable that the deviation detection pattern is formed simultaneously with the surface mounting pad, the conductive pattern, etc.

〔Effect of the invention〕

As described above, the present invention has the advantage that it is possible to easily determine the amount of deviation of the automatic mounting reference hole and the direction of the deviation without using a measuring device.

[Brief explanation of the drawing]

1(A) and 1(B) are plan views sequentially showing a method for manufacturing a printed wiring board according to an embodiment of the present invention, FIG. 2(A),
2(B) and 2(C) are plan views showing the main parts of the deviation detection pattern in FIG. 1(I3), and FIG. 3(A) and 3.
Figure (I3) is a plan view sequentially showing a conventional method for manufacturing a printed wiring board. 1... Surface mounting pad, 2... Through hole, 3... Conductive pattern, 4a to 4
d...Displacement detection pattern, 5a to 5d, 5
', 5''...Automatic mounting reference hole. Agent: Patent Attorney Shinto Uchihara - Rough

Claims (1)

[Claims] A printed wiring board characterized in that a conductor pattern having an inner contour substantially similar to that of the hole is formed at the position of the automatic mounting reference hole.