CN109539940A - The inclined distance measurement method in the hole of laser drilling - Google Patents
The inclined distance measurement method in the hole of laser drilling Download PDFInfo
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- CN109539940A CN109539940A CN201811407880.9A CN201811407880A CN109539940A CN 109539940 A CN109539940 A CN 109539940A CN 201811407880 A CN201811407880 A CN 201811407880A CN 109539940 A CN109539940 A CN 109539940A
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- Prior art keywords
- hole
- positioning disc
- laser drilling
- location hole
- measurement method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to printed circuit board technology fields, specifically disclose a kind of inclined distance measurement method in hole of laser drilling, comprising the following steps: provide core plate；It is synchronous to etch several positioning discs in logicalnot circuit graphics field when etching the line pattern of the core plate；It is synchronous to make a location hole in the corresponding position of each positioning disc in laser drilling；The radius of the positioning disc is different and the radius of each positioning disc is all larger than the radius of location hole；Hole offset distance when judging laser drilling according to the positional relationship between each location hole and positioning disc corresponding with the location hole from.The inclined distance measurement method in the hole of laser drilling provided by the invention, can be measured in the case where not removing line layer the hole offset distance of laser drilling from.
Description
Technical field
The present invention relates to printed circuit board technology field more particularly to a kind of inclined distance measurement methods in the hole of laser drilling.
Background technique
Core plate generally comprises two outer copper foils and is located in the middle substrate.After etching line pattern on the outer copper foil,
It generally also needs to make some fabrication holes on core plate, these fabrication holes possibly serve for mounting hole, insert hole or via hole etc..
However, because the influence of equipment precision or machined parameters etc., inevitably there is deviation in bore position and target position.Hole location is necessary
Match with line pattern, once deviating, these deviations are often difficult to measure, or even need thoroughly to remove outer-layer circuit
It can just measure.In this way, just greatly increase recognition cycle, and removing line layer can generate part copper scale and instead glue and wipe
Yarn road, it is also possible to copper scale be caused to be adhered among route a problem that forming short circuit.
Therefore, it is necessary to a kind of method, can be measured in the case where not removing line layer the hole offset distance of laser drilling from.
Summary of the invention
It is an advantage of the invention to provide a kind of inclined distance measurement methods in the hole of laser drilling, can not remove
Measured in the case where line layer the hole offset distance of laser drilling from.
To achieve these objectives, the present invention provides a kind of inclined distance measurement method in hole of laser drilling, comprising the following steps:
Core plate is provided；
It is synchronous to etch several positioning discs in logicalnot circuit graphics field when etching the line pattern of the core plate；
It is synchronous to make a location hole in the corresponding position of each positioning disc in laser drilling；The setting circle
The radius of piece is different and the radius of each positioning disc is all larger than the radius of location hole；
When judging laser drilling according to the positional relationship between each location hole and positioning disc corresponding with the location hole
Hole offset distance from.
Preferably, it the step: is closed according to the position between each location hole and positioning disc corresponding with the location hole
System judges hole offset distance when laser drilling from including:
When location hole is located in corresponding positioning disc and location hole and positioning disc are nontangential, the hole of laser drilling is inclined
Distance is less than the radial difference of both positioning disc and location hole；
When location hole is with corresponding positioning disc inscribe, the hole offset distance of laser drilling is from equal to positioning disc and location hole
The radial difference of the two；
When other than some or all of location hole falling on corresponding positioning disc, the hole offset distance of laser drilling is fixed from being greater than
The radial difference of both circle of position piece and location hole.
Preferably, the axis of all positioning discs is in the same plane.
Preferably, the positioning disc is arranged successively from small to large according to the size of radius.
Preferably, the distance between adjacent positioning disc is equal, and the radial difference phase between adjacent positioning disc
Deng.
The beneficial effects of the present invention are: a kind of inclined distance measurement method in hole of laser drilling is provided, it is several by being arranged
The not equal positioning disc of radius, hole offset distance when then by the positional relationship of location hole and positioning disc to laser drilling from into
Row range estimation can measure the hole offset distance of laser drilling from being simple and efficient in the case where not removing line layer.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the schematic diagram that each location hole that embodiment provides is respectively positioned in corresponding positioning disc；
Fig. 2 is the third location hole that provides of embodiment and the schematic diagram of corresponding positioning disc inscribe；
Fig. 3 is the schematic diagram that the third location hole that embodiment provides intersects with corresponding positioning disc.
In figure:
1, core plate；2, positioning disc；3, location hole.
Specific embodiment
To enable the purpose of the present invention, feature, advantage more obvious and understandable, implement below in conjunction with the present invention
Attached drawing in example, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that reality disclosed below
Applying example is only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
In the description of the present invention, it is to be understood that, when a component is considered as " connection " another component, it can
To be directly to another component or may be simultaneously present the component being centrally located.When a component is considered as " setting
Set " another component, it, which can be, is set up directly on another component or may be simultaneously present the component being centrally located.
In addition, the indicating positions such as term " length " " short " "inner" "outside" or positional relationship for the orientation that is shown based on attached drawing or
Person's positional relationship is merely for convenience of the description present invention, rather than the device or original part of indication or suggestion meaning must have this
Specific orientation is operated with specific orientation construction, should not be understood as limitation of the invention with this.
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
The present embodiment provides a kind of inclined distance measurement methods in the hole of laser drilling, comprising the following steps:
S10: core plate 1 is provided.
Specifically, core plate 1 successively includes upper copper, substrate and lower copper foil from top to bottom.
S20: core plate 1 is etched.
Generally, it only needs to etch in upper copper and lower copper foil when traditional core plate 1 is etched required
Line pattern.In the present embodiment, when etching the line pattern of the core plate 1, synchronization is etched in logicalnot circuit graphics field
Several positioning discs 2.
S30: it drills to core plate 1.
Specifically, it in laser drilling, while producing the fabrication holes such as mounting hole, insert hole or via hole, needs
It is synchronous to make a location hole 3 in the corresponding position of each positioning disc 2.Preferably, the radius of the positioning disc 2 is not respectively
It is identical, and the radius of each positioning disc 2 is all larger than the radius of location hole 3.Preferably, positioning disc 2 can be located at and use
It does at the tabulare or rim charge positioned.
S40: judged according to the positional relationship between each location hole 3 and positioning disc 2 corresponding with the location hole 3 radium-shine
Hole offset distance when drilling from.
Specifically, on the one hand, obtained since positioning disc 2 etches together with line pattern, so positioning disc 2 with
Positioning between line pattern is very accurate；On the other hand, location hole 3 is and the techniques such as mounting hole, insert hole or via hole
Hole synchronous processing obtains, so the positioning between the fabrication holes such as location hole 3 and mounting hole, insert hole or via hole is also very
Precisely.Therefore, by comparing the concentricity of location hole 3 and positioning disc 2, so that it may judge the hole location and line map of laser drilling
Deviation situation between shape.Further, the concentricity of location hole 3 and positioning disc 2 can be converted to location hole 3 and positioning again
The radial difference of disk 2.
Further, when location hole 3 is located in corresponding positioning disc 2 and location hole 3 and positioning disc 2 are nontangential,
The hole offset distance of laser drilling is from the radial difference for being less than both positioning disc 2 and location hole 3；
When location hole 3 is with corresponding 2 inscribe of positioning disc, the hole offset distance of laser drilling is from equal to positioning disc 2 and calmly
The radial difference in both position holes 3；When other than some or all of location hole 3 falling on corresponding positioning disc 2, laser drilling
Hole offset distance is from the radial difference for being greater than both positioning disc 2 and location hole 3.Preferably, judge for convenience, all positioning
The axis of disk 2 is in the same plane；The positioning disc 2 is arranged successively from small to large according to the size of radius, and adjacent determines
The distance between circle of position piece 2 is equal, and the radial difference between adjacent positioning disc 2 is equal.
Specifically, as long as observing the positional relationship between each location hole 3 and corresponding positioning disc 2, so that it may device to hole
Offset distance is simple and convenient without increasing measuring tool from one general judgement of progress.For example, the radius of location hole 3 is 2mil；
Positioning disc 2 has 5, and radius is followed successively by 3.5mil, 4mil, 4.5mil, 5mil, 5.5mil:
As shown in Figure 1, illustrating the hole of this 5 location holes 3 if each location hole 3 is respectively positioned in corresponding positioning disc 2
Inclined situation is successively: it is not more than 1.5mil, is not more than 2mil, is not more than 2.5mil, is not more than 3mil, no more than 3.5mil, it is comprehensive
On, the hole offset distance of this laser drilling is from no more than 1.5mil；
As shown in Fig. 2, if first and second location hole 3 be partially or entirely located in corresponding positioning disc 2 it
Outside, third location hole 3 and corresponding 2 inscribe of positioning disc, and the 4th and the 5th location hole 3 are respectively positioned on corresponding positioning
In disk 2, then illustrate the inclined situation in hole of this each location hole 3 be successively: greater than 1.5mil, be greater than 2mil, be equal to 2.5mil, no
Greater than 3mil, it is not more than 3.5mil, to sum up, the hole offset distance of this laser drilling is from equal to 2.5mil；
As shown in figure 3, if first and second location hole 3 be partially or entirely located in corresponding positioning disc 2 it
Outside, 3 part of third location hole is intersected with corresponding positioning disc 2, and the 4th and the 5th location hole 3 be respectively positioned on it is corresponding
In positioning disc 2, then illustrate the inclined situation in hole of this each location hole 3 be successively: greater than 1.5mil, greater than 2mil, be greater than
2.5mil, no more than 3mil, be not more than 3.5mil, to sum up, the hole offset distance of this laser drilling is from being greater than 2.5mil and be not more than
3mil。
So analogize, change by visual observation it may determine that be hole offset distance from approximate range, adjust between positioning disc 2
Internal diameter difference between spacing and adjacent positioning disc 2 can also further be adjusted the accuracy of measurement result.This
Cumbersome analysis directly can be verified process visualizing, letter by the inclined distance measurement method in hole for the laser drilling that embodiment provides
It is single efficient.
Specifically, for laser drilling, if positioning disc 2 is replaced using positioning copper ring, due to positioning the centre of copper ring
It is hollow out, when laser drilling is easy to burn the resin on periphery, so as to cause the judging result for influencing visualizing.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (5)
1. a kind of inclined distance measurement method in the hole of laser drilling, which comprises the following steps:
It provides core plate (1)；
It is synchronous to etch several positioning discs in logicalnot circuit graphics field when etching the line pattern of the core plate (1)
(2)；
It is synchronous to make a location hole (3) in the corresponding position of each positioning disc (2) in laser drilling；The positioning
The radius of disk (2) is different and the radius of each positioning disc (2) is all larger than the radiuses of location hole (3)；
Radium-shine brill is judged according to the positional relationship between each location hole (3) and positioning disc (2) corresponding with location hole (3)
Hole offset distance when hole from.
2. the inclined distance measurement method in the hole of laser drilling according to claim 1, which is characterized in that the step: according to
Positional relationship between each location hole (3) and positioning disc (2) corresponding with location hole (3) judges hole when laser drilling
Offset distance is from including:
When location hole (3) are located in corresponding positioning disc (2) and location hole (3) and positioning disc (2) are nontangential, radium-shine brill
The hole offset distance in hole is from the radial difference for being less than both positioning disc (2) and location hole (3)；
When location hole (3) is with corresponding positioning disc (2) inscribe, the hole offset distance of laser drilling from be equal to positioning disc (2) with
The radial difference of both location holes (3)；
When some or all of location hole (3) is fallen on other than corresponding positioning disc (2), the hole offset distance of laser drilling is from being greater than
The radial difference of positioning disc (2) and location hole (3) the two.
3. the inclined distance measurement method in the hole of laser drilling according to claim 2, which is characterized in that all setting circles
The axis of piece (2) is in the same plane.
4. the inclined distance measurement method in the hole of laser drilling according to claim 3, which is characterized in that the positioning disc
(2) it is arranged successively from small to large according to the size of radius.
5. the inclined distance measurement method in the hole of laser drilling according to claim 4, which is characterized in that adjacent positioning disc
The distance between (2) radial difference between equal and adjacent positioning disc (2) is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811407880.9A CN109539940A (en) | 2018-11-23 | 2018-11-23 | The inclined distance measurement method in the hole of laser drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811407880.9A CN109539940A (en) | 2018-11-23 | 2018-11-23 | The inclined distance measurement method in the hole of laser drilling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109539940A true CN109539940A (en) | 2019-03-29 |
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ID=65849746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811407880.9A Pending CN109539940A (en) | 2018-11-23 | 2018-11-23 | The inclined distance measurement method in the hole of laser drilling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324971A (en) * | 2019-04-29 | 2019-10-11 | 惠州中京电子科技有限公司 | A kind of production method that LED board overall dimensions precision improves |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02125490A (en) * | 1988-11-02 | 1990-05-14 | Nec Corp | Printed circuit board |
| CN102032885A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof |
| CN204090283U (en) * | 2014-08-14 | 2015-01-07 | 梅州市志浩电子科技有限公司 | There is the printed circuit board (PCB) of target patterns |
| CN105072830A (en) * | 2015-09-10 | 2015-11-18 | 江门崇达电路技术有限公司 | Layer deviation detection method |
| CN105392286A (en) * | 2015-11-10 | 2016-03-09 | 深圳崇达多层线路板有限公司 | Method for detecting circuit offset situation of core plate |
| CN105392287A (en) * | 2015-11-16 | 2016-03-09 | 景旺电子科技(龙川)有限公司 | Laser drilling positioning method |
-
2018
- 2018-11-23 CN CN201811407880.9A patent/CN109539940A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02125490A (en) * | 1988-11-02 | 1990-05-14 | Nec Corp | Printed circuit board |
| CN102032885A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof |
| CN204090283U (en) * | 2014-08-14 | 2015-01-07 | 梅州市志浩电子科技有限公司 | There is the printed circuit board (PCB) of target patterns |
| CN105072830A (en) * | 2015-09-10 | 2015-11-18 | 江门崇达电路技术有限公司 | Layer deviation detection method |
| CN105392286A (en) * | 2015-11-10 | 2016-03-09 | 深圳崇达多层线路板有限公司 | Method for detecting circuit offset situation of core plate |
| CN105392287A (en) * | 2015-11-16 | 2016-03-09 | 景旺电子科技(龙川)有限公司 | Laser drilling positioning method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324971A (en) * | 2019-04-29 | 2019-10-11 | 惠州中京电子科技有限公司 | A kind of production method that LED board overall dimensions precision improves |
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Application publication date: 20190329 |
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