JPS63155686A - Wiring board and manufacture of the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a wiring board and a method for manufacturing the same.

(Prior Art) As a method for detecting the amount of deviation of a printed wiring board, there is, for example, a method described in Japanese Patent Publication No. 54-25226. In this method, a visual inspection is performed based on the mark for detecting the amount of deviation, thereby identifying the amount of deviation and determining whether the printed wiring board is a good product or a defective product. That is, as shown in FIG. 4, a circuit pattern 2 is provided on the substrate body 1 by etching with copper foil, and at the same time, a mark 3 for detecting the amount of deviation is created using the copper foil.

As shown in FIG. 5, this deviation amount detection mark 3 has a plurality of ring-shaped marks 5 arranged concentrically with the vertical and horizontal center lines 4A and 4B at equal intervals from the center and with equal line widths. It is. For the printed wiring board configured in this way,
In the next step, holes 2a for attaching components are formed by pressing, superimposing them on the wiring pattern 2. At this time, at the same time,
A hole 3a for detecting the amount of deviation is also formed in the mark 3 for detecting the amount of deviation. The relationship between the component mounting hole 2a and the deviation amount detection hole 3a is as follows. That is, the deviation amount detection hole 3
When the hole a is drilled at the center of the deviation detection mark 3, the component mounting hole 2a is also drilled at a predetermined position of the circuit pattern 2. Therefore, by checking in which part of the deviation amount detection mark 3 the deviation amount detection hole 3a is drilled, it is possible to determine whether the product is a good product or a defective product.

(Problems to be solved by the invention) However, the manufacturing process of ordinary printed wiring boards is
It involves not only the process of creating a circuit pattern using copper foil and the process of drilling holes as described above, but also multiple processes that are performed sequentially, i.e.
The process includes creating a copper foil pattern, resist printing, silk printing, and punching holes using a press. Therefore, the amount of misalignment that occurs in the printed wiring board as a final product includes not only the misalignment between the copper foil circuit pattern and the component mounting hole, but also the misalignment between the resist pattern and the component mounting hole, and the misalignment between the silk pattern and the component mounting hole. It is also possible that the holes are misaligned.

Currently, inspection items that are visually performed include not only the misalignment between the copper foil circuit pattern and the hole, but also the amount of misalignment between the resist or silk pattern and the hole.

However, the method using the deviation amount detection marks shown in Figures 4 and 5 has a problem in that it can only inspect the amount of deviation between the circuit pattern of the copper foil and the hole. .

Furthermore, at present, the amount of deviation is detected by visual inspection, but in recent years there has been an increasing demand for automatic detection of the amount of deviation by applying image processing. however,
Even if the marks for detecting the amount of deviation shown in FIGS. 4 and 5 are used, automation as described above is extremely difficult.

The present invention has been made in view of the above circumstances, and makes it possible to individually detect the amount of misalignment between various patterns made of a plurality of materials and component mounting holes, and to It is an object of the present invention to provide a wiring board that can automatically detect the amount of deviation by applying image processing, and a method for manufacturing the same.

[Structure of the invention]

(Means for Solving the Problems) The wiring board of the present invention includes a plurality of patterns made of various materials on the board body, and holes for mounting components are formed in positional relationships with each of the patterns. In the wiring board, a deviation amount detection mark for detecting the deviation amount of the component mounting hole with respect to each of the patterns is formed by a circular or ring-shaped mark made of one of the materials and an outer side thereof. and a ring-shaped mark made of another of the materials, which is located concentrically with a gap between the substrate body and the substrate body.

The method of manufacturing a wiring board of the present invention comprises forming a plurality of patterns of various materials on a board main body, and drilling holes for mounting parts in a positional relationship with each of the patterns. A deviation amount detection mark for detecting the amount of deviation of each of the mounting holes with respect to each of the patterns includes a circular or ring-shaped mark and a ring-shaped mark located concentrically outside the circular or ring-shaped mark with a gap therebetween. The present invention is characterized in that each of the circular or ring-shaped marks is constructed one by one from the same material as each of the patterns at the same time as the various patterns are constructed.

(Function) A hole for detecting the amount of deviation is made in the wiring board of the present invention along with a hole for mounting the component. By looking at the positional relationship between the deviation amount detection hole and the circular or ring-shaped mark made of various materials of the deviation amount detection mark, it is possible to determine the position of the component mounting hole.
Discrepancies between various patterns made of various materials are individually detected. These individual deviations can be easily detected because the circular or ring-shaped marks for detecting the amount of deviation are provided with a gap therebetween so that they do not overlap each other.

In the method for manufacturing a wiring board of the present invention, the board body"-
In each step of configuring multiple types of patterns using various materials, by configuring one circular or ring-shaped mark one by one depending on the material used in each step, each step can be completed without increasing the number of steps. A wiring board is obtained in which the amount of deviation between the various patterns made by the above method and the component mounting holes can be individually detected.

(Example) An embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a corner of the printed wiring board.

As shown in the figure, a mark 12 for detecting the amount of deviation is provided at a corner of the substrate body 11. The mark for detecting the amount of deviation consists of a copper foil circular mark 13 located at the center, a resist ring mark 15 provided on the outside with a ring-shaped gap 14 in between, and a ring-shaped gap 14 on the outside of the ring-shaped mark 15. 1
6, and the marks 13, 15, 17 are provided concentrically. Each of those marks 1B, 15.17 is marked 13°15.1 according to the manufacturing process of the printed wiring board.
7 in order.

FIGS. 2(A) to 2(C) show this situation. That is, first, when forming a copper foil pattern on, for example, the central portion of the surface of the board main body 11, at the same time, the pattern shown in FIG.
As shown in A), circular marks 13 made of copper foil are formed at the corners of the surface of the board body 11. This copper foil circular mark 13
can also be configured in a ring shape.

Next, when configuring a resist pattern in relation to the copper foil pattern, as shown in FIG. A mark 15 is formed.

After that, when configuring a silk pattern in relation to the copper foil and resist patterns, a gap is created outside the ring-shaped mark 15 of the resist, as shown in FIG.
A ring-shaped mark 17 of silk is formed through 6.

In the printed wiring board constructed in this manner, holes for mounting components are made in relation to each pattern made of the copper foil, resist, and silk in the next final step, which is a hole-drilling step. When drilling the hole, a hole 18 for detecting the amount of deviation is also made on the mark 12 for detecting the amount of deviation. The relationship between the component mounting hole and the deviation amount detection hole 18 is the same as that described in the prior art section. That is, when the deviation amount detection hole 18 is drilled at the center of the circular mark 13 of the copper foil, the component mounting hole is drilled at the appropriate position of each pattern, and the deviation amount detection hole 18 is When the holes for attaching parts are opened offset from the circular marks 13 of the copper foil, the holes for mounting components are also opened offset from each pattern.

In FIG. 1, the hole 18 for detecting the amount of deviation is a circular mark 13 made of copper foil.
FIG. 2(C) shows a state in which the deviation amount detection hole 18 is drilled at a position slightly shifted from the center of the circular mark 13 of the copper foil.

Next, a specific method for quantitatively measuring the amount of deviation between each pattern and the component mounting hole will be explained.

FIG. 3 shows a case where the amount of deviation between the resist pattern and the component mounting hole is measured from the amount of deviation between the ring-shaped mark 15 on the resist and the deviation amount detection hole 18. As shown in the figure, a straight line AA' passing through the deviation amount detection hole 18 is drawn. The intersection of this straight line AA' and the outer circle of the ring-shaped mark 15 on the resist is a, a'
shall be. Further, the intersection of this straight line AA' and the outer circumferential circle of the deviation amount detection hole 18 is defined as b'. By comparing the distance ab between the intersections a and b with the distance a L b J between the intersections a / b 1,
It is possible to quantitatively know how much the deviation amount detection hole 8 is deviated from the ring-shaped mark 15 of the resist on the straight line AA' to the left or right. That is, if the amount of deviation is ZAA/, then the amount of deviation on the straight line AA' can be found. This amount of deviation is the straight line AA between the resist pattern and the component mounting hole.
' is equal to the amount of deviation along .

Also, as shown in the figure, a straight line BB' is drawn which is perpendicular to the straight line AA'. The intersection of this straight line BB' and the inside of the ring-shaped mark 15 on the resist is designated as C1C'. Further, the intersection points of this straight line BB' and the deviation amount detection hole 18 are designated as d and d'. Similar to the above equation (1), the amount of deviation ZBB' of the deviation amount detection hole 18 on the straight line BB' is cd-c'd'ZBB""'...
・It can be obtained as (2). This amount of deviation is equal to the amount of deviation between the resist pattern and the component mounting hole along the straight line BB'.

Here, the amount of deviation Z on the straight line AA' found by equation (1)
By vector-synthesizing AA and the deviation Ett Z nn7 on the straight line BB'''2 found by equation (2), the amount of planar deviation between the resist pattern and the component mounting hole can be determined. . In other words, the size of the gap is IZ
When l and direction are LZ, the magnitude IZl and the direction LZ are each determined by 2AA', and it is possible to quantitatively determine in which direction and by how much the deviation has occurred.

-J 1 - The method for measuring the amount of misalignment between the resist pattern and the component mounting hole has been described above, and by the same method, the amount of misalignment between the copper foil pattern and the component mounting hole and the silk The amount of deviation between the pattern and the component mounting hole can also be determined quantitatively.

As described above, according to the embodiment described above, by using the deviation amount detection mark 12, it is possible to not only determine the amount of deviation in one direction along a certain straight line, but also to determine the amount of deviation in two directions perpendicular to each other. If the amount of deviation is determined, the amount of planar deviation can be easily and quantitatively determined from the direction S.

In addition, by embedding a plurality of marks 12 for detecting the amount of deviation in empty spaces on the printed circuit board, it is possible to detect not only deviations in the setting of the mold but also errors in copper foil, resist, and silk caused by expansion and contraction during printing. The amount of deviation between the patterns and the holes drilled in relation to each pattern can be determined individually and quantitatively.

In addition, in the deviation amount detection mark 12, the copper foil circular mark 13, the resist ring mark 15, and the silk ring mark 17 are created so as to be separated from each other by a gap 14.16. Even if any of the copper foil circular mark 13, the resist ring mark 15, or the silk ring mark 17 is shifted from each other, these marks can be prevented from overlapping each other. Therefore, each of the intersection points shown in FIG. 3 can be easily found, and it is also possible to automatically detect the amount of deviation by applying image processing.

〔Effect of the invention〕

According to the wiring board of the present invention, it is possible to individually detect the amount of deviation between various patterns made of various materials and component mounting holes, and this detection can be automatically performed by applying image processing. It is also easy to do.

According to the method for manufacturing a wiring board of the present invention, a wiring board that provides the above effects can be obtained without increasing the number of steps, and therefore can be provided at low cost.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing a corner of the wiring board of the present invention, Figs. 2 (A) to (C) are process diagrams showing the method of manufacturing the wiring board of the invention, and Fig. 3 is an explanation showing detection of the amount of deviation. 4 is a perspective view of a conventional wiring board, and FIG. 5 is an enlarged explanatory view of a mark for detecting the amount of deviation. 11... Board body, 12... Mark for detecting deviation amount,
13...Copper foil circular mark, 14...Gap, 15.
...Resist ring mark, 16...Gap, 17
... Silk ring-shaped mark, 18 ... Hole for detecting the amount of deviation. Applicant's agent Sato -Yu-15 = 53 and 20

Claims (1)

[Scope of Claims] 1. A wiring board having a plurality of patterns made of various materials on a board body, and in which holes for mounting components are formed in positional relationship with each of the patterns, A deviation detection mark for detecting the deviation amount of each of the patterns of holes is positioned concentrically with a circular or ring-shaped mark formed of one of the materials with a gap outside the mark. and a ring-shaped mark made of another of the materials mentioned above, on the board body. 2. In a method for manufacturing a wiring board, in which a plurality of patterns are formed on a board body using various materials, and holes for mounting components are formed in a positional relationship with each of the patterns, holes for mounting components in each of the patterns are formed. The deviation amount detection mark for detecting the deviation amount for each is configured to have a circular or ring-shaped mark and a ring-shaped mark located concentrically with a gap on the outside of the circular or ring-shaped mark. A method for manufacturing a wiring board, characterized in that each of the shaped or ring-shaped marks is formed one by one from the same material as each pattern at the same time as the various patterns are formed.