JPH05145204A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH05145204A JPH05145204A JP30913691A JP30913691A JPH05145204A JP H05145204 A JPH05145204 A JP H05145204A JP 30913691 A JP30913691 A JP 30913691A JP 30913691 A JP30913691 A JP 30913691A JP H05145204 A JPH05145204 A JP H05145204A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- printed wiring
- wiring board
- pattern
- division
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は印刷配線基板に係り、特
に基板表面にV溝を形成することによって複数の基板に
分割される印刷配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board divided into a plurality of substrates by forming a V groove on the surface of the substrate.
【0002】[0002]
【従来の技術】従来から、独立した複数の回路パターン
を一体形成した印刷配線基板を複数の基板に分割する場
合、印刷配線基板の表裏各面に分割目標ラインに沿って
V溝を入れ、その後、基板全体を僅かに湾曲させること
でこれを切断していた。その際、印刷配線基板へのV溝
加工は丸のこやカッターを切断具としたV溝加工機を用
いることが一般である。2. Description of the Related Art Conventionally, when a printed wiring board integrally formed with a plurality of independent circuit patterns is divided into a plurality of boards, a V groove is formed on each surface of the printed wiring board along a division target line, and then, This was cut by slightly bending the entire substrate. At that time, it is general to use a V-groove machine using a circular saw or a cutter as a cutting tool for the V-groove processing on the printed wiring board.
【0003】しかしながら、ここで問題となるのは印刷
配線基板の分割精度である。つまり、V溝加工にあたっ
て印刷配線基板はその端辺等を基準として位置決めされ
るものの、基板外形のバラツキ等から必ずしも基板上の
正確な位置にV溝加工が施されるとは限らない。しか
も、今日のように電子機器の小形化が熱望されてサイズ
上の制約が益々厳しくなるなか、印刷配線基板の外形、
サイズにバラツキがあることは機器への組み込み不能を
頻発させることになり、極めて憂慮すべき点と言える。However, the problem here is the division accuracy of the printed wiring board. In other words, although the printed wiring board is positioned with reference to the edges and the like in the V-groove processing, the V-groove processing is not always performed at an accurate position on the board due to variations in the outer shape of the board and the like. Moreover, as the miniaturization of electronic devices is eagerly awaited today and the restrictions on size are becoming more and more severe, the external shape of the printed wiring board,
Since there are variations in size, it often happens that the device cannot be incorporated into the device, which is an extremely alarming point.
【0004】また、分割した個々の印刷配線基板につい
てメジャー等を用いてサイズチェック等を行うことは極
めて効率が悪いといった理由から、これらのチェックは
省略されることが多く、機器への組み込みを試みてはじ
めて印刷配線基板のサイズ不良を知ると言った状況であ
った。Further, since it is extremely inefficient to perform a size check or the like on each of the divided printed wiring boards by using a measure or the like, these checks are often omitted, and an attempt is made to incorporate them into a device. For the first time, the situation was such that the size defect of the printed wiring board was known.
【0005】[0005]
【発明が解決しようとする課題】このように、分割した
印刷配線基板のひとつひとつについてサイズチェック等
を行うことは、手間がかかり過ぎて実施性に欠けると言
う問題があった。As described above, there is a problem that performing size check or the like on each of the divided printed wiring boards is too time-consuming and lacks in practicability.
【0006】本発明はこのような事情に対処してなされ
たものであり、目視により容易にV溝の加工精度すなわ
ち基板の分割精度の良否を判定することのできる印刷配
線基板の提供を目的としている。The present invention has been made in view of the above circumstances, and an object thereof is to provide a printed wiring board capable of easily visually judging the quality of the V-groove processing accuracy, that is, the board division accuracy. There is.
【0007】[0007]
【課題を解決するための手段】本発明の印刷配線基板は
上記した目的を達成するために、基板表面にV溝を形成
することにより、このV溝に沿って複数の基板に分割さ
れる印刷配線基板において、前記基板表面の分割目標ラ
イン上の少なくとも両端部に、前記V溝の加工精度を目
視確認するためのパターンを印刷してなることを特徴と
している。In order to achieve the above-mentioned object, a printed wiring board of the present invention is formed by forming a V-groove on the surface of the substrate, and is divided into a plurality of substrates along the V-groove. In the wiring board, a pattern for visually confirming the processing accuracy of the V groove is printed on at least both ends on the division target line on the board surface.
【0008】[0008]
【作用】本発明では、基板表面の分割目標ライン上の少
なくとも両端部に、V溝の加工精度を確認するためのパ
ターンを印刷しておくことにより、V溝加工後に残った
パターンの様子を目視確認するだけで、V溝の位置、幅
等の加工精度、すなわち印刷配線基板の分割精度の良否
判定を行うことができる。According to the present invention, a pattern for confirming the processing accuracy of the V-groove is printed on at least both ends on the division target line on the substrate surface, so that the state of the pattern remaining after the V-groove processing can be visually checked. Only by checking, it is possible to determine whether or not the processing accuracy of the position and width of the V groove, that is, the division accuracy of the printed wiring board.
【0009】[0009]
【実施例】以下、本発明の実施例を図面を用いて説明す
る。Embodiments of the present invention will be described below with reference to the drawings.
【0010】図1は本発明に係る一実施例の印刷配線基
板の分割前の状態を示す平面図である。FIG. 1 is a plan view showing a state before division of a printed wiring board according to an embodiment of the present invention.
【0011】同図に示すように、この印刷配線基板1の
表面には、それぞれ独立した複数の回路パターン(図示
せず)と共に、V溝加工機により形成されたV溝の位
置、幅等の精度を目視確認するための複数のチェックパ
ターンP1、P2、P3が基板分割の目標ラインLに沿
って一列に印刷されている。As shown in FIG. 1, on the surface of the printed wiring board 1, a plurality of independent circuit patterns (not shown) are formed, and the position, width, etc. of the V groove formed by the V groove processing machine are shown. A plurality of check patterns P1, P2, P3 for visually confirming the accuracy are printed in a line along the target line L for dividing the substrate.
【0012】ここで、各チェックパターンP1、P2、
P3はそれぞれ3種類の幅を持ち、各種類のパターン幅
W1、W2、W3は、目標のV溝幅をWaとすると、そ
れぞれWa>W1、Wa=W2、Wa<W3の関係を持
つものとされている。Here, each check pattern P1, P2,
P3 has three kinds of widths, and each kind of pattern width W1, W2, W3 has a relationship of Wa> W1, Wa = W2, Wa <W3, where Wa is the target V groove width. Has been done.
【0013】図2及び図3はV溝加工後の印刷配線基板
1の様子を示す平面図及び断面図である。2 and 3 are a plan view and a sectional view showing a state of the printed wiring board 1 after the V-groove processing.
【0014】これらの図に示すように、印刷配線基板1
にV溝10を、分割目標ラインLに沿って正確な幅で形
成できた場合、印刷配線基板1上のP1及びP2のチェ
ック用パターンはすべて無くなり、パターン幅が最大の
チェックパターンP3の両端部だけが均等な幅で残るこ
とになる。As shown in these figures, the printed wiring board 1
If the V groove 10 can be formed with a correct width along the division target line L, all the check patterns of P1 and P2 on the printed wiring board 1 are eliminated, and both end portions of the check pattern P3 having the maximum pattern width are removed. Only will remain with a uniform width.
【0015】したがって、このようにV溝加工後に残っ
たチェックパターンの様子を目視確認することで、V溝
の加工精度の良否、つまり印刷配線基板1の分割精度の
良否を容易に判定することが可能になる。Therefore, by visually confirming the state of the check pattern remaining after the V-groove processing, it is possible to easily determine whether the V-groove processing accuracy, that is, the division accuracy of the printed wiring board 1 is good or bad. It will be possible.
【0016】次に本発明の他の実施例を説明する。図4
はこの実施例の印刷配線基板の分割前の状態を示す平面
図である。Next, another embodiment of the present invention will be described. Figure 4
FIG. 6 is a plan view showing a state before division of the printed wiring board of this embodiment.
【0017】同図に示すように、本実施例の印刷配線基
板11は、分割目標ラインL上の両端部に、それぞれ千
鳥状のチェックパターンP11、P12を印刷してなってい
る。ここで、各チェックパターンP11、P12の真中に位
置するパターン部の幅W11は目標V溝幅Waと等しもの
となっている。As shown in the figure, the printed wiring board 11 of this embodiment has zigzag check patterns P11 and P12 printed at both ends on the division target line L, respectively. Here, the width W11 of the pattern portion located in the center of each check pattern P11, P12 is equal to the target V groove width Wa.
【0018】したがって、この印刷配線基板11におい
ては、V溝加工後に残った2つのチェックパターンP1
1、P12を目視により比較するだけで、V溝の加工精度
の良否を判定することができる。Therefore, in this printed wiring board 11, the two check patterns P1 remaining after the V-groove processing is performed.
By visually comparing 1 and P12, it is possible to determine whether the machining accuracy of the V groove is good or bad.
【0019】なお、チェックパターンの形状は、V溝加
工後に残ったパターンの様子からV溝加工精度の良否を
目視判定することができれば、他のどのような形状とし
てもよいことは言うまでもない。Needless to say, the shape of the check pattern may be any other shape as long as the quality of the V-groove processing accuracy can be visually judged from the state of the pattern remaining after the V-groove processing.
【0020】例えば、図1の実施例において、目標V溝
幅より幅の大きいチェックパターンP3だけを印刷する
ようにしてもよく、またこのチェックパターンP3と共
に目標V溝幅と等しい幅のチェックパターンP2を印刷
するようにしてもよい。For example, in the embodiment shown in FIG. 1, only the check pattern P3 having a width larger than the target V groove width may be printed, and the check pattern P2 having the same width as the target V groove width may be printed together with the check pattern P3. May be printed.
【0021】さらに、図1に示したチェックパターン
を、印刷配線基板1の両端部のみに印刷したり、印刷配
線基板の表裏各面に印刷してもよい。Further, the check pattern shown in FIG. 1 may be printed only on both ends of the printed wiring board 1, or may be printed on both front and back surfaces of the printed wiring board.
【0022】[0022]
【発明の効果】以上説明したように本発明の印刷配線基
板によれば、基板表面の分割目標ライン上の少なくとも
両端部にV溝加工精度を確認するためのパターンを印刷
しておくことにより、V溝加工後のパターンの様子を目
視確認するだけで、V溝の加工精度の良否を判定するこ
とができる。As described above, according to the printed wiring board of the present invention, by printing the pattern for confirming the V-groove processing accuracy on at least both ends on the division target line on the substrate surface, The quality of the V-groove processing accuracy can be determined only by visually confirming the state of the pattern after the V-groove processing.
【図1】本発明に係る一実施例の印刷配線基板の分割前
の状態を示す平面図である。FIG. 1 is a plan view showing a state before division of a printed wiring board according to an embodiment of the present invention.
【図2】図1に示した印刷配線基板のV溝加工後の様子
を示す平面図である。FIG. 2 is a plan view showing a state of the printed wiring board shown in FIG. 1 after V-groove processing.
【図3】図2に示したV溝加工後の印刷配線基板の部分
的な断面図である。FIG. 3 is a partial cross-sectional view of the printed wiring board after the V-groove processing shown in FIG.
【図4】本発明に係る他の実施例の印刷配線基板の分割
前の状態を示す平面図である。FIG. 4 is a plan view showing a state before division of a printed wiring board according to another embodiment of the present invention.
1、11…印刷配線基板 P1、P2、P3、P11、P12…チェックパターン 10…V溝 1, 11 ... Printed wiring board P1, P2, P3, P11, P12 ... Check pattern 10 ... V groove
Claims (1)
このV溝に沿って複数の基板に分割される印刷配線基板
において、 前記基板表面の分割目標ライン上の少なくとも両端部
に、前記V溝の加工精度を目視確認するためのパターン
を印刷してなることを特徴とする印刷配線基板。1. By forming a V groove on the surface of the substrate,
In a printed wiring board divided into a plurality of substrates along the V groove, a pattern for visually confirming the processing accuracy of the V groove is printed on at least both ends on the division target line on the substrate surface. A printed wiring board characterized by the above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30913691A JPH05145204A (en) | 1991-11-25 | 1991-11-25 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30913691A JPH05145204A (en) | 1991-11-25 | 1991-11-25 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05145204A true JPH05145204A (en) | 1993-06-11 |
Family
ID=17989336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30913691A Withdrawn JPH05145204A (en) | 1991-11-25 | 1991-11-25 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05145204A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015191909A (en) * | 2014-03-27 | 2015-11-02 | 京セラ株式会社 | Multi-piece ceramic substrate and ceramic substrates |
-
1991
- 1991-11-25 JP JP30913691A patent/JPH05145204A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015191909A (en) * | 2014-03-27 | 2015-11-02 | 京セラ株式会社 | Multi-piece ceramic substrate and ceramic substrates |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5067042A (en) | Wiring board for flat package type integrated circuit device | |
JPH05145204A (en) | Printed wiring board | |
JP2941182B2 (en) | Printed circuit board and its cutting method | |
JP3514961B2 (en) | Method of identifying split board, method of manufacturing the same, and split board | |
JPH11307890A (en) | Printed wiring board | |
US6751861B2 (en) | Printed circuit board manufacturing method | |
JPS61140192A (en) | Printed wiring board | |
JPH04254391A (en) | Printed wiring board | |
JPH09214080A (en) | Printed wiring board | |
JPS60130884A (en) | Method of confirming v-cut of printed circuit board | |
JPS6359840B2 (en) | ||
JPH027476Y2 (en) | ||
JPS6285485A (en) | Checking of printed circuit board | |
JPH03191590A (en) | Printed wiring board | |
JP3534993B2 (en) | Printed wiring assembly board | |
JPH0621606A (en) | Method of confirming auxiliary processing of external and internal shape of printed wiring board | |
KR100194092B1 (en) | Tension check method when machining printed circuit board | |
JP3105084B2 (en) | Drilling machine with processed PCB and display method of spindle | |
JPH08213726A (en) | Printed board | |
JPH11233901A (en) | Printed board with key gap forming mark and key gap forming position deviation determining method on the printed board | |
JPH06152081A (en) | Printed wiring board | |
EP0357307A2 (en) | Printed-wiring board | |
JPH0128690Y2 (en) | ||
JPH01133391A (en) | Confirming method for v-cutting of printed substrate | |
KR19980011220U (en) | IC board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990204 |