JPS6351542B2 - - Google Patents

Info

Publication number
JPS6351542B2
JPS6351542B2 JP57016232A JP1623282A JPS6351542B2 JP S6351542 B2 JPS6351542 B2 JP S6351542B2 JP 57016232 A JP57016232 A JP 57016232A JP 1623282 A JP1623282 A JP 1623282A JP S6351542 B2 JPS6351542 B2 JP S6351542B2
Authority
JP
Japan
Prior art keywords
lead
tab
semiconductor device
package body
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57016232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58134452A (ja
Inventor
Masachika Masuda
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP57016232A priority Critical patent/JPS58134452A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to DE3303165A priority patent/DE3303165C2/de
Priority to GB08302730A priority patent/GB2115220B/en
Priority to IT19414/83A priority patent/IT1161869B/it
Priority to KR1019830000433A priority patent/KR900001989B1/ko
Publication of JPS58134452A publication Critical patent/JPS58134452A/ja
Priority to SG362/87A priority patent/SG36287G/en
Priority to HK707/87A priority patent/HK70787A/xx
Priority to MY616/87A priority patent/MY8700616A/xx
Publication of JPS6351542B2 publication Critical patent/JPS6351542B2/ja
Priority to KR1019900000785A priority patent/KR900001988B1/ko
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57016232A 1982-02-05 1982-02-05 半導体装置およびその製造方法 Granted JPS58134452A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP57016232A JPS58134452A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法
DE3303165A DE3303165C2 (de) 1982-02-05 1983-01-31 Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern
GB08302730A GB2115220B (en) 1982-02-05 1983-02-01 Semiconductor device and method of producing the same
IT19414/83A IT1161869B (it) 1982-02-05 1983-02-03 Dispositivo a semiconduttori e procedimento per la sua fabbricazione
KR1019830000433A KR900001989B1 (ko) 1982-02-05 1983-02-04 반도체장치
SG362/87A SG36287G (en) 1982-02-05 1987-04-23 Semiconductor device and method of producing the same
HK707/87A HK70787A (en) 1982-02-05 1987-10-01 Semiconductor device and method of producing the same
MY616/87A MY8700616A (en) 1982-02-05 1987-12-30 Semiconductor device and method of producing the same
KR1019900000785A KR900001988B1 (ko) 1982-02-05 1990-01-24 반도체장치에 사용되는 리이드 프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57016232A JPS58134452A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS58134452A JPS58134452A (ja) 1983-08-10
JPS6351542B2 true JPS6351542B2 (enrdf_load_stackoverflow) 1988-10-14

Family

ID=11910801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57016232A Granted JPS58134452A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS58134452A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0464982U (enrdf_load_stackoverflow) * 1990-10-12 1992-06-04
JPH08502389A (ja) * 1992-10-13 1996-03-12 オリン コーポレイション シール幅を縮小した金属電子パッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0464982U (enrdf_load_stackoverflow) * 1990-10-12 1992-06-04
JPH08502389A (ja) * 1992-10-13 1996-03-12 オリン コーポレイション シール幅を縮小した金属電子パッケージ

Also Published As

Publication number Publication date
JPS58134452A (ja) 1983-08-10

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