JPS6349383B2 - - Google Patents

Info

Publication number
JPS6349383B2
JPS6349383B2 JP58110214A JP11021483A JPS6349383B2 JP S6349383 B2 JPS6349383 B2 JP S6349383B2 JP 58110214 A JP58110214 A JP 58110214A JP 11021483 A JP11021483 A JP 11021483A JP S6349383 B2 JPS6349383 B2 JP S6349383B2
Authority
JP
Japan
Prior art keywords
plating
lead
semiconductor package
oxide film
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58110214A
Other languages
English (en)
Japanese (ja)
Other versions
JPS603144A (ja
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58110214A priority Critical patent/JPS603144A/ja
Publication of JPS603144A publication Critical patent/JPS603144A/ja
Publication of JPS6349383B2 publication Critical patent/JPS6349383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58110214A 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法 Granted JPS603144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58110214A JPS603144A (ja) 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58110214A JPS603144A (ja) 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法

Publications (2)

Publication Number Publication Date
JPS603144A JPS603144A (ja) 1985-01-09
JPS6349383B2 true JPS6349383B2 (enrdf_load_html_response) 1988-10-04

Family

ID=14529954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58110214A Granted JPS603144A (ja) 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法

Country Status (1)

Country Link
JP (1) JPS603144A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5719540A (en) * 1980-07-10 1982-02-01 Toshiba Corp Relative humidity detecting method for air conditioner
JP6481895B2 (ja) * 2015-12-16 2019-03-13 大口マテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP6971400B2 (ja) * 2018-06-29 2021-11-24 日立ジョンソンコントロールズ空調株式会社 空調システム、空調方法、及びプログラム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164552A (en) * 1981-04-01 1982-10-09 Hitachi Cable Ltd Lead-frame for semiconductor device
JPS5875861A (ja) * 1981-10-30 1983-05-07 Fuji Denka:Kk 回路素子気密パツケ−ジ用リ−ド線及びその製造方法
JPS59161850A (ja) * 1983-03-07 1984-09-12 Hitachi Ltd 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS603144A (ja) 1985-01-09

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