JPS6348414B2 - - Google Patents

Info

Publication number
JPS6348414B2
JPS6348414B2 JP57188000A JP18800082A JPS6348414B2 JP S6348414 B2 JPS6348414 B2 JP S6348414B2 JP 57188000 A JP57188000 A JP 57188000A JP 18800082 A JP18800082 A JP 18800082A JP S6348414 B2 JPS6348414 B2 JP S6348414B2
Authority
JP
Japan
Prior art keywords
solder
lead wires
electronic components
partition plate
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57188000A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5976865A (ja
Inventor
Takahisa Hiraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP57188000A priority Critical patent/JPS5976865A/ja
Publication of JPS5976865A publication Critical patent/JPS5976865A/ja
Publication of JPS6348414B2 publication Critical patent/JPS6348414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/006—Pattern or selective deposits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57188000A 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法 Granted JPS5976865A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57188000A JPS5976865A (ja) 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57188000A JPS5976865A (ja) 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法

Publications (2)

Publication Number Publication Date
JPS5976865A JPS5976865A (ja) 1984-05-02
JPS6348414B2 true JPS6348414B2 (cg-RX-API-DMAC10.html) 1988-09-29

Family

ID=16215881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57188000A Granted JPS5976865A (ja) 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法

Country Status (1)

Country Link
JP (1) JPS5976865A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109623080A (zh) * 2019-01-24 2019-04-16 合肥巨动力系统有限公司 一种高效率扁线电机绕组端部焊接装置及焊接工艺

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5410970B2 (cg-RX-API-DMAC10.html) * 1973-07-06 1979-05-11

Also Published As

Publication number Publication date
JPS5976865A (ja) 1984-05-02

Similar Documents

Publication Publication Date Title
US6066551A (en) Method for forming bump of semiconductor device
GB2212818A (en) Electronic component chip holder
JPS6348414B2 (cg-RX-API-DMAC10.html)
JPH07142845A (ja) プリント配線板及びその製造方法
JPH0514553Y2 (cg-RX-API-DMAC10.html)
JPS63285961A (ja) 半導体搭載用基板
EP0250450A1 (en) Lead finishing for a surface mount package
US6924440B2 (en) Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
JP2745218B2 (ja) 半導体搭載用基板
JPS63285960A (ja) 半導体搭載基板用の導体ピン
JPH06349561A (ja) リード端子の配線基板への半田付け方法
JP3096816B2 (ja) 電気的接続部材の製造方法
JPH05129753A (ja) デイスクリート部品およびデイスクリート部品のプリント基板実装方法
JPS63155689A (ja) プリント基板の半田コ−テイング方法
JPH0223644A (ja) 導体ピンを有する電子部品搭載用基板の製造方法
JPS599947A (ja) 電子回路基板およびその製造方法
JPH04208510A (ja) チップ型電子部品
JP2594075B2 (ja) 角形電子部品の製造方法
JP2742785B2 (ja) 半導体搭載基板用の導体ピン
JPH03192793A (ja) 電気回路部品の実装方法
JPH04133492A (ja) 印刷配線板の製造方法
JP2535034B2 (ja) 電子部品搭載パッケ―ジへの端子部品半田付け方法
JP2591766Y2 (ja) プリント基板
JPH0335550A (ja) 電子部品塔載用基板の製造方法
JPS6269698A (ja) 電磁遅延線の製造方法