JPS5976865A - 電子部品のリ−ド線の半田メツキ方法 - Google Patents

電子部品のリ−ド線の半田メツキ方法

Info

Publication number
JPS5976865A
JPS5976865A JP57188000A JP18800082A JPS5976865A JP S5976865 A JPS5976865 A JP S5976865A JP 57188000 A JP57188000 A JP 57188000A JP 18800082 A JP18800082 A JP 18800082A JP S5976865 A JPS5976865 A JP S5976865A
Authority
JP
Japan
Prior art keywords
solder
lead wires
lead wire
holes
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57188000A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348414B2 (cg-RX-API-DMAC10.html
Inventor
Takahisa Hiraki
平木 隆久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP57188000A priority Critical patent/JPS5976865A/ja
Publication of JPS5976865A publication Critical patent/JPS5976865A/ja
Publication of JPS6348414B2 publication Critical patent/JPS6348414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/006Pattern or selective deposits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57188000A 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法 Granted JPS5976865A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57188000A JPS5976865A (ja) 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57188000A JPS5976865A (ja) 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法

Publications (2)

Publication Number Publication Date
JPS5976865A true JPS5976865A (ja) 1984-05-02
JPS6348414B2 JPS6348414B2 (cg-RX-API-DMAC10.html) 1988-09-29

Family

ID=16215881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57188000A Granted JPS5976865A (ja) 1982-10-25 1982-10-25 電子部品のリ−ド線の半田メツキ方法

Country Status (1)

Country Link
JP (1) JPS5976865A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109623080A (zh) * 2019-01-24 2019-04-16 合肥巨动力系统有限公司 一种高效率扁线电机绕组端部焊接装置及焊接工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025621A (cg-RX-API-DMAC10.html) * 1973-07-06 1975-03-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025621A (cg-RX-API-DMAC10.html) * 1973-07-06 1975-03-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109623080A (zh) * 2019-01-24 2019-04-16 合肥巨动力系统有限公司 一种高效率扁线电机绕组端部焊接装置及焊接工艺

Also Published As

Publication number Publication date
JPS6348414B2 (cg-RX-API-DMAC10.html) 1988-09-29

Similar Documents

Publication Publication Date Title
US8084191B2 (en) Thermoelectric module and manufacturing method for same
JPS5941895A (ja) プリント回路基板およびその製造方法
US3209066A (en) Printed circuit with integral welding tubelets
US5957364A (en) Integrated solder preform array having a tin outer coating
US4610758A (en) Manufacture of printed circuit boards
JPS5976865A (ja) 電子部品のリ−ド線の半田メツキ方法
JPS5846161B2 (ja) 耐熱性絶縁体基板の導電端子
CA1131746A (en) Circuit board with mounted components and method for manufacture
JPH0514553Y2 (cg-RX-API-DMAC10.html)
US6924440B2 (en) Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
JPS62128553A (ja) 半導体パツケ−ジの製造法
JP3191686B2 (ja) 印刷配線板の製造方法
JP2779853B2 (ja) インナーリードと電子部品との接続中間体の製造方法
JP2594075B2 (ja) 角形電子部品の製造方法
JPH11243269A (ja) チョークコイル実装基板及びその製造方法
JPH0223644A (ja) 導体ピンを有する電子部品搭載用基板の製造方法
JP2535034B2 (ja) 電子部品搭載パッケ―ジへの端子部品半田付け方法
JPS5849991B2 (ja) バックパネルの製造方法
JPH05291721A (ja) プリント配線板
DE2517132A1 (de) Litzenleiter
JPH05160572A (ja) 多層プリント配線板
JPH01194405A (ja) チップ形インダクタおよびその製造方法
JPH10130894A (ja) 電子部品へのめっき治具およびめっき方法
JPS58105560A (ja) 中間支持バンドの製造方法
JPS60142505A (ja) 成形抵抗体の製造方法