JPS6342416B2 - - Google Patents

Info

Publication number
JPS6342416B2
JPS6342416B2 JP55001334A JP133480A JPS6342416B2 JP S6342416 B2 JPS6342416 B2 JP S6342416B2 JP 55001334 A JP55001334 A JP 55001334A JP 133480 A JP133480 A JP 133480A JP S6342416 B2 JPS6342416 B2 JP S6342416B2
Authority
JP
Japan
Prior art keywords
solder
lead
tip
leads
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55001334A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5698853A (en
Inventor
Fumihito Inoe
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP133480A priority Critical patent/JPS5698853A/ja
Publication of JPS5698853A publication Critical patent/JPS5698853A/ja
Publication of JPS6342416B2 publication Critical patent/JPS6342416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP133480A 1980-01-11 1980-01-11 Structure of lead in semiconductor device Granted JPS5698853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP133480A JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP133480A JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP30370786A Division JPS62169354A (ja) 1986-12-22 1986-12-22 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPS5698853A JPS5698853A (en) 1981-08-08
JPS6342416B2 true JPS6342416B2 (enrdf_load_stackoverflow) 1988-08-23

Family

ID=11498593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP133480A Granted JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5698853A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
JPS59108389A (ja) * 1982-12-13 1984-06-22 マルコン電子株式会社 混成集積回路の製造方法
JPS6188471A (ja) * 1984-10-05 1986-05-06 松下電器産業株式会社 コネクタ−
JPH0510366Y2 (enrdf_load_stackoverflow) * 1985-08-31 1993-03-15
JPS62169354A (ja) * 1986-12-22 1987-07-25 Hitachi Ltd 半導体装置の実装構造
JPH051909Y2 (enrdf_load_stackoverflow) * 1987-04-30 1993-01-19

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279258A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Container for electronic circuit parts
JPS5756527Y2 (enrdf_load_stackoverflow) * 1977-02-25 1982-12-04

Also Published As

Publication number Publication date
JPS5698853A (en) 1981-08-08

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