JPS5698853A - Structure of lead in semiconductor device - Google Patents

Structure of lead in semiconductor device

Info

Publication number
JPS5698853A
JPS5698853A JP133480A JP133480A JPS5698853A JP S5698853 A JPS5698853 A JP S5698853A JP 133480 A JP133480 A JP 133480A JP 133480 A JP133480 A JP 133480A JP S5698853 A JPS5698853 A JP S5698853A
Authority
JP
Japan
Prior art keywords
lead
sides
circuit
slanted
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP133480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342416B2 (enrdf_load_stackoverflow
Inventor
Fumihito Inoue
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP133480A priority Critical patent/JPS5698853A/ja
Publication of JPS5698853A publication Critical patent/JPS5698853A/ja
Publication of JPS6342416B2 publication Critical patent/JPS6342416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP133480A 1980-01-11 1980-01-11 Structure of lead in semiconductor device Granted JPS5698853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP133480A JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP133480A JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP30370786A Division JPS62169354A (ja) 1986-12-22 1986-12-22 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPS5698853A true JPS5698853A (en) 1981-08-08
JPS6342416B2 JPS6342416B2 (enrdf_load_stackoverflow) 1988-08-23

Family

ID=11498593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP133480A Granted JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5698853A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108389A (ja) * 1982-12-13 1984-06-22 マルコン電子株式会社 混成集積回路の製造方法
JPS6188471A (ja) * 1984-10-05 1986-05-06 松下電器産業株式会社 コネクタ−
JPS6242253U (enrdf_load_stackoverflow) * 1985-08-31 1987-03-13
JPS62169354A (ja) * 1986-12-22 1987-07-25 Hitachi Ltd 半導体装置の実装構造
JPS63172060U (enrdf_load_stackoverflow) * 1987-04-30 1988-11-09
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279258A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Container for electronic circuit parts
JPS53118464U (enrdf_load_stackoverflow) * 1977-02-25 1978-09-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279258A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Container for electronic circuit parts
JPS53118464U (enrdf_load_stackoverflow) * 1977-02-25 1978-09-20

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
JPS59108389A (ja) * 1982-12-13 1984-06-22 マルコン電子株式会社 混成集積回路の製造方法
JPS6188471A (ja) * 1984-10-05 1986-05-06 松下電器産業株式会社 コネクタ−
JPS6242253U (enrdf_load_stackoverflow) * 1985-08-31 1987-03-13
JPS62169354A (ja) * 1986-12-22 1987-07-25 Hitachi Ltd 半導体装置の実装構造
JPS63172060U (enrdf_load_stackoverflow) * 1987-04-30 1988-11-09

Also Published As

Publication number Publication date
JPS6342416B2 (enrdf_load_stackoverflow) 1988-08-23

Similar Documents

Publication Publication Date Title
KR890013754A (ko) 면내장 플라스틱 패키지형 반도체 집적회로 장치 및 그 제조방법과 그 내장방법 및 내장구조
JPS5698853A (en) Structure of lead in semiconductor device
JPS5779652A (en) Resin-sealed semiconductor device
GB1511415A (en) Connecting strips
JPS5389368A (en) Production of semiconductor integrated circuit
JPS5763850A (en) Semiconductor device
JPS6453493A (en) Wiring board for surface packaging
JPS5792854A (en) Plastic molded type semiconductor device
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPH0228356A (ja) 表面実装型半導体装置及びその製造方法
JPS56142659A (en) Semiconductor device
JPS56115550A (en) Manufacture of semiconductor device
JPS54102971A (en) Semiconductor device
JPS572537A (en) Semiconductor device
JPS54112167A (en) Manufacture of semiconductor device
JP2018152390A (ja) 電子部品および電子部品の製造方法
JPS54114975A (en) Semiconductor device
JPS572536A (en) Semiconductor device
JPS57148362A (en) Semiconductor device
JPS5743435A (en) Electronic part
JPS59104147A (ja) 半導体装置
JP2000150761A (ja) 樹脂封止型半導体装置及びその製造方法
JPS5735331A (en) Semiconductor device
JPS6420630A (en) Manufacture of semiconductor device
JPS56129356A (en) Packaging and package