JPS6341238B2 - - Google Patents

Info

Publication number
JPS6341238B2
JPS6341238B2 JP55085323A JP8532380A JPS6341238B2 JP S6341238 B2 JPS6341238 B2 JP S6341238B2 JP 55085323 A JP55085323 A JP 55085323A JP 8532380 A JP8532380 A JP 8532380A JP S6341238 B2 JPS6341238 B2 JP S6341238B2
Authority
JP
Japan
Prior art keywords
wiring body
layer
circuit board
solder
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55085323A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5710998A (en
Inventor
Mamoru Yanagisawa
Hidehiko Akasaki
Tomio Oda
Takehisa Tsujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8532380A priority Critical patent/JPS5710998A/ja
Publication of JPS5710998A publication Critical patent/JPS5710998A/ja
Publication of JPS6341238B2 publication Critical patent/JPS6341238B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP8532380A 1980-06-24 1980-06-24 Circuit board Granted JPS5710998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8532380A JPS5710998A (en) 1980-06-24 1980-06-24 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8532380A JPS5710998A (en) 1980-06-24 1980-06-24 Circuit board

Publications (2)

Publication Number Publication Date
JPS5710998A JPS5710998A (en) 1982-01-20
JPS6341238B2 true JPS6341238B2 (enrdf_load_stackoverflow) 1988-08-16

Family

ID=13855407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8532380A Granted JPS5710998A (en) 1980-06-24 1980-06-24 Circuit board

Country Status (1)

Country Link
JP (1) JPS5710998A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053093A (ja) * 1983-09-02 1985-03-26 株式会社日立製作所 ピングリッドアレイ型半導体パッケージ
JP2741611B2 (ja) * 1989-01-12 1998-04-22 新光電気工業株式会社 フリップチップボンディング用基板
JPH11251484A (ja) * 1998-03-06 1999-09-17 Mitsui High Tec Inc チップサイズ型半導体装置
WO2000010369A1 (fr) 1998-08-10 2000-02-24 Fujitsu Limited Realisation de bossages de soudure, methode de montage d'un dispositif electronique et structure de montage pour ce dispositif
FR2940521B1 (fr) * 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754931B2 (enrdf_load_stackoverflow) * 1974-01-09 1982-11-20

Also Published As

Publication number Publication date
JPS5710998A (en) 1982-01-20

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