JPS6337498B2 - - Google Patents

Info

Publication number
JPS6337498B2
JPS6337498B2 JP55012496A JP1249680A JPS6337498B2 JP S6337498 B2 JPS6337498 B2 JP S6337498B2 JP 55012496 A JP55012496 A JP 55012496A JP 1249680 A JP1249680 A JP 1249680A JP S6337498 B2 JPS6337498 B2 JP S6337498B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
wire bonding
semiconductor
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55012496A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56110244A (en
Inventor
Hajime Murakami
Shinji Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP1249680A priority Critical patent/JPS56110244A/ja
Publication of JPS56110244A publication Critical patent/JPS56110244A/ja
Publication of JPS6337498B2 publication Critical patent/JPS6337498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1249680A 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof Granted JPS56110244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Publications (2)

Publication Number Publication Date
JPS56110244A JPS56110244A (en) 1981-09-01
JPS6337498B2 true JPS6337498B2 (enrdf_load_stackoverflow) 1988-07-26

Family

ID=11806975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1249680A Granted JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Country Status (1)

Country Link
JP (1) JPS56110244A (enrdf_load_stackoverflow)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140858A (enrdf_load_stackoverflow) * 1974-05-02 1975-11-12
JPS5310426B2 (enrdf_load_stackoverflow) * 1974-10-04 1978-04-13
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS5237768A (en) * 1975-09-19 1977-03-23 Seiko Instr & Electronics Ltd Substrate having positioning marks
JPS52127069A (en) * 1976-04-16 1977-10-25 Shinkawa Ltd Wire bonding apparatus
JPS5329068A (en) * 1976-08-31 1978-03-17 Sony Corp Automatic wire bonding unit
JPS5390863A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Wire bonding method and mark provided on subsutrate
JPS5826664B2 (ja) * 1977-09-27 1983-06-04 松下電器産業株式会社 自動ワイヤボンデイング方法
JPS5847704Y2 (ja) * 1978-04-10 1983-10-31 日本電気株式会社 半導体装置用容器
JPS5827657B2 (ja) * 1978-04-12 1983-06-10 株式会社日立製作所 テ−プキヤリア方式のボンデイング方法及びその装置
JPS5629357A (en) * 1979-08-18 1981-03-24 Mitsubishi Electric Corp Semiconductor container
JPS5737768A (en) * 1980-08-18 1982-03-02 Pioneer Electronic Corp Bookshelf type record player

Also Published As

Publication number Publication date
JPS56110244A (en) 1981-09-01

Similar Documents

Publication Publication Date Title
US4907061A (en) Electronic device
JP2002009105A (ja) パターンの認識方法及びこのためのクランプ
JPS6337498B2 (enrdf_load_stackoverflow)
JP3801300B2 (ja) 半導体装置の製造方法
CN115566109A (zh) 一种固晶方法、装置及电子元件
CN205282471U (zh) 一种集成电路封装结构
JPS6120345A (ja) ボンディング方法およびボンディング装置
JP4043854B2 (ja) Ｉｃカードの製造方法とｉｃカード
JP2663638B2 (ja) 半導体装置の製造方法
JPS6156419A (ja) 半導体装置用シ−ト貼付装置
JPH0687472B2 (ja) フィルムキャリアテープ
JPH0235464B2 (enrdf_load_stackoverflow)
JPS61234555A (ja) 半導体装置
JPS6359595A (ja) 携帯可能媒体における実装方法
JPH1154999A (ja) Ｂｇａ等の実装位置確認用治具及び位置決め方法
JPH065729A (ja) プリント配線板および半導体素子の位置合わせ方法
JPS62165942A (ja) 混成集積回路及びその製法
EP2244540A1 (en) Electronic devices with light source
JP2521693B2 (ja) 半導体装置及び半導体装置の製造方法
JPS61222793A (ja) Ｉｃカ−ドの製造方法
JPH0321088B2 (enrdf_load_stackoverflow)
JPS5887838A (ja) 位置認識方法
JPS5874064A (ja) リ−ドフレ−ム
CN115346943A (zh) 半导体器件和半导体器件的加工方法
JPH0527978B2 (enrdf_load_stackoverflow)