JPS63271997A - プリント配線板 - Google Patents
プリント配線板Info
- Publication number
- JPS63271997A JPS63271997A JP10553387A JP10553387A JPS63271997A JP S63271997 A JPS63271997 A JP S63271997A JP 10553387 A JP10553387 A JP 10553387A JP 10553387 A JP10553387 A JP 10553387A JP S63271997 A JPS63271997 A JP S63271997A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- metal plating
- connector terminal
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims abstract description 54
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims description 34
- 238000000576 coating method Methods 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 23
- 239000010949 copper Substances 0.000 description 23
- 239000004020 conductor Substances 0.000 description 22
- 239000010970 precious metal Substances 0.000 description 21
- 238000007639 printing Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10553387A JPS63271997A (ja) | 1987-04-28 | 1987-04-28 | プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10553387A JPS63271997A (ja) | 1987-04-28 | 1987-04-28 | プリント配線板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4152977A Division JPH06105827B2 (ja) | 1992-05-19 | 1992-05-19 | プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63271997A true JPS63271997A (ja) | 1988-11-09 |
| JPH0578199B2 JPH0578199B2 (enrdf_load_stackoverflow) | 1993-10-28 |
Family
ID=14410227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10553387A Granted JPS63271997A (ja) | 1987-04-28 | 1987-04-28 | プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63271997A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02271544A (ja) * | 1989-04-12 | 1990-11-06 | Hitachi Ltd | 配線基板およびこれを用いた半導体装置 |
| JPH02294095A (ja) * | 1989-05-09 | 1990-12-05 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
| JPH06252550A (ja) * | 1993-02-26 | 1994-09-09 | Matsushita Electric Works Ltd | プリント配線板の製造方法 |
| JP2010267693A (ja) * | 2009-05-13 | 2010-11-25 | Toray Ind Inc | ソルダーレジストの形成方法及び回路基板 |
| JP2012104625A (ja) * | 2010-11-10 | 2012-05-31 | Nec Corp | 多層配線体の構造および製造方法 |
| JP2014053608A (ja) * | 2012-09-10 | 2014-03-20 | Samsung Electro-Mechanics Co Ltd | 回路基板及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350864U (enrdf_load_stackoverflow) * | 1986-09-19 | 1988-04-06 |
-
1987
- 1987-04-28 JP JP10553387A patent/JPS63271997A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350864U (enrdf_load_stackoverflow) * | 1986-09-19 | 1988-04-06 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02271544A (ja) * | 1989-04-12 | 1990-11-06 | Hitachi Ltd | 配線基板およびこれを用いた半導体装置 |
| JPH02294095A (ja) * | 1989-05-09 | 1990-12-05 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
| JPH06252550A (ja) * | 1993-02-26 | 1994-09-09 | Matsushita Electric Works Ltd | プリント配線板の製造方法 |
| JP2010267693A (ja) * | 2009-05-13 | 2010-11-25 | Toray Ind Inc | ソルダーレジストの形成方法及び回路基板 |
| JP2012104625A (ja) * | 2010-11-10 | 2012-05-31 | Nec Corp | 多層配線体の構造および製造方法 |
| JP2014053608A (ja) * | 2012-09-10 | 2014-03-20 | Samsung Electro-Mechanics Co Ltd | 回路基板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0578199B2 (enrdf_load_stackoverflow) | 1993-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |