JPS63159261U - - Google Patents

Info

Publication number
JPS63159261U
JPS63159261U JP1987050987U JP5098787U JPS63159261U JP S63159261 U JPS63159261 U JP S63159261U JP 1987050987 U JP1987050987 U JP 1987050987U JP 5098787 U JP5098787 U JP 5098787U JP S63159261 U JPS63159261 U JP S63159261U
Authority
JP
Japan
Prior art keywords
bonding pad
bank
die bonding
fluorescent display
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987050987U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0545009Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987050987U priority Critical patent/JPH0545009Y2/ja
Priority to US07/177,949 priority patent/US4835445A/en
Priority to KR1019880003839A priority patent/KR910009991B1/ko
Publication of JPS63159261U publication Critical patent/JPS63159261U/ja
Application granted granted Critical
Publication of JPH0545009Y2 publication Critical patent/JPH0545009Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/15—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen with ray or beam selectively directed to luminescent anode segments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Die Bonding (AREA)
JP1987050987U 1987-04-06 1987-04-06 Expired - Lifetime JPH0545009Y2 (https=)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1987050987U JPH0545009Y2 (https=) 1987-04-06 1987-04-06
US07/177,949 US4835445A (en) 1987-04-06 1988-04-05 Fluorescent display device
KR1019880003839A KR910009991B1 (ko) 1987-04-06 1988-04-06 형광표시관 및 그의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987050987U JPH0545009Y2 (https=) 1987-04-06 1987-04-06

Publications (2)

Publication Number Publication Date
JPS63159261U true JPS63159261U (https=) 1988-10-18
JPH0545009Y2 JPH0545009Y2 (https=) 1993-11-16

Family

ID=12874148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987050987U Expired - Lifetime JPH0545009Y2 (https=) 1987-04-06 1987-04-06

Country Status (3)

Country Link
US (1) US4835445A (https=)
JP (1) JPH0545009Y2 (https=)
KR (1) KR910009991B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087662A (ja) * 2007-09-28 2009-04-23 Futaba Corp 蛍光表示管及びその製造方法
JP2009085987A (ja) * 2007-09-27 2009-04-23 Futaba Corp 蛍光表示管

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639211B2 (ja) * 1990-11-07 1997-08-06 日本電気株式会社 蛍光表示パネル
US5346748A (en) * 1992-01-08 1994-09-13 Nec Corporation Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding
US5736814A (en) * 1995-09-06 1998-04-07 Ise Electronics Corporation Vacuum flourescent display apparatus
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP5066333B2 (ja) * 2005-11-02 2012-11-07 シチズン電子株式会社 Ｌｅｄ発光装置。
DE102012201935A1 (de) * 2012-02-09 2013-08-14 Robert Bosch Gmbh Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements
CN112530878A (zh) * 2019-09-18 2021-03-19 深圳市中光工业技术研究院 用于焊接电子元器件的基底及其制备方法、半导体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5885341U (ja) * 1981-12-07 1983-06-09 日本電気株式会社 印刷基板
JPS6178127A (ja) * 1984-09-26 1986-04-21 Toshiba Corp 薄膜配線基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208886A (ja) * 1984-03-31 1985-10-21 株式会社東芝 電子部品の製造方法
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
JPH06122946A (ja) * 1992-08-25 1994-05-06 Nippon Steel Corp 耐粒界腐食性に優れたオーステナイト系ステンレス鋼
JPH06155847A (ja) * 1992-11-20 1994-06-03 Oki Electric Ind Co Ltd プリンタ装置
JPH06250984A (ja) * 1993-02-23 1994-09-09 Hitachi Ltd 分散処理システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5885341U (ja) * 1981-12-07 1983-06-09 日本電気株式会社 印刷基板
JPS6178127A (ja) * 1984-09-26 1986-04-21 Toshiba Corp 薄膜配線基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009085987A (ja) * 2007-09-27 2009-04-23 Futaba Corp 蛍光表示管
JP2009087662A (ja) * 2007-09-28 2009-04-23 Futaba Corp 蛍光表示管及びその製造方法
KR100993410B1 (ko) * 2007-09-28 2010-11-09 후다바 덴시 고교 가부시키가이샤 차량탑재용 형광 표시관 및 그 제조 방법

Also Published As

Publication number Publication date
KR880013211A (ko) 1988-11-30
KR910009991B1 (ko) 1991-12-09
JPH0545009Y2 (https=) 1993-11-16
US4835445A (en) 1989-05-30

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